1 Introduction to Research & Analysis Reports
1.1 PCB Packaging Materials Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global PCB Packaging Materials Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global PCB Packaging Materials Overall Market Size
2.1 Global PCB Packaging Materials Market Size: 2022 VS 2029
2.2 Global PCB Packaging Materials Revenue, Prospects & Forecasts: 2018-2029
2.3 Global PCB Packaging Materials Sales: 2018-2029
3 Company Landscape
3.1 Top PCB Packaging Materials Players in Global Market
3.2 Top Global PCB Packaging Materials Companies Ranked by Revenue
3.3 Global PCB Packaging Materials Revenue by Companies
3.4 Global PCB Packaging Materials Sales by Companies
3.5 Global PCB Packaging Materials Price by Manufacturer (2018-2023)
3.6 Top 3 and Top 5 PCB Packaging Materials Companies in Global Market, by Revenue in 2022
3.7 Global Manufacturers PCB Packaging Materials Product Type
3.8 Tier 1, Tier 2 and Tier 3 PCB Packaging Materials Players in Global Market
3.8.1 List of Global Tier 1 PCB Packaging Materials Companies
3.8.2 List of Global Tier 2 and Tier 3 PCB Packaging Materials Companies
4 Sights by Product
4.1 Overview
4.1.1 By Type – Global PCB Packaging Materials Market Size Markets, 2022 & 2029
4.1.2 Metal Packages
4.1.3 Plastic Packages
4.1.4 Ceramic Packages
4.2 By Type – Global PCB Packaging Materials Revenue & Forecasts
4.2.1 By Type – Global PCB Packaging Materials Revenue, 2018-2023
4.2.2 By Type – Global PCB Packaging Materials Revenue, 2024-2029
4.2.3 By Type – Global PCB Packaging Materials Revenue Market Share, 2018-2029
4.3 By Type – Global PCB Packaging Materials Sales & Forecasts
4.3.1 By Type – Global PCB Packaging Materials Sales, 2018-2023
4.3.2 By Type – Global PCB Packaging Materials Sales, 2024-2029
4.3.3 By Type – Global PCB Packaging Materials Sales Market Share, 2018-2029
4.4 By Type – Global PCB Packaging Materials Price (Manufacturers Selling Prices), 2018-2029
5 Sights by Application
5.1 Overview
5.1.1 By Application – Global PCB Packaging Materials Market Size, 2022 & 2029
5.1.2 Single Layer Circuit Board
5.1.3 Multilayer Circuit Board
5.1.4 Other
5.2 By Application – Global PCB Packaging Materials Revenue & Forecasts
5.2.1 By Application – Global PCB Packaging Materials Revenue, 2018-2023
5.2.2 By Application – Global PCB Packaging Materials Revenue, 2024-2029
5.2.3 By Application – Global PCB Packaging Materials Revenue Market Share, 2018-2029
5.3 By Application – Global PCB Packaging Materials Sales & Forecasts
5.3.1 By Application – Global PCB Packaging Materials Sales, 2018-2023
5.3.2 By Application – Global PCB Packaging Materials Sales, 2024-2029
5.3.3 By Application – Global PCB Packaging Materials Sales Market Share, 2018-2029
5.4 By Application – Global PCB Packaging Materials Price (Manufacturers Selling Prices), 2018-2029
6 Sights by Region
6.1 By Region – Global PCB Packaging Materials Market Size, 2022 & 2029
6.2 By Region – Global PCB Packaging Materials Revenue & Forecasts
6.2.1 By Region – Global PCB Packaging Materials Revenue, 2018-2023
6.2.2 By Region – Global PCB Packaging Materials Revenue, 2024-2029
6.2.3 By Region – Global PCB Packaging Materials Revenue Market Share, 2018-2029
6.3 By Region – Global PCB Packaging Materials Sales & Forecasts
6.3.1 By Region – Global PCB Packaging Materials Sales, 2018-2023
6.3.2 By Region – Global PCB Packaging Materials Sales, 2024-2029
6.3.3 By Region – Global PCB Packaging Materials Sales Market Share, 2018-2029
6.4 North America
6.4.1 By Country – North America PCB Packaging Materials Revenue, 2018-2029
6.4.2 By Country – North America PCB Packaging Materials Sales, 2018-2029
6.4.3 US PCB Packaging Materials Market Size, 2018-2029
6.4.4 Canada PCB Packaging Materials Market Size, 2018-2029
6.4.5 Mexico PCB Packaging Materials Market Size, 2018-2029
6.5 Europe
6.5.1 By Country – Europe PCB Packaging Materials Revenue, 2018-2029
6.5.2 By Country – Europe PCB Packaging Materials Sales, 2018-2029
6.5.3 Germany PCB Packaging Materials Market Size, 2018-2029
6.5.4 France PCB Packaging Materials Market Size, 2018-2029
6.5.5 U.K. PCB Packaging Materials Market Size, 2018-2029
6.5.6 Italy PCB Packaging Materials Market Size, 2018-2029
6.5.7 Russia PCB Packaging Materials Market Size, 2018-2029
6.5.8 Nordic Countries PCB Packaging Materials Market Size, 2018-2029
6.5.9 Benelux PCB Packaging Materials Market Size, 2018-2029
6.6 Asia
6.6.1 By Region – Asia PCB Packaging Materials Revenue, 2018-2029
6.6.2 By Region – Asia PCB Packaging Materials Sales, 2018-2029
6.6.3 China PCB Packaging Materials Market Size, 2018-2029
6.6.4 Japan PCB Packaging Materials Market Size, 2018-2029
6.6.5 South Korea PCB Packaging Materials Market Size, 2018-2029
6.6.6 Southeast Asia PCB Packaging Materials Market Size, 2018-2029
6.6.7 India PCB Packaging Materials Market Size, 2018-2029
6.7 South America
6.7.1 By Country – South America PCB Packaging Materials Revenue, 2018-2029
6.7.2 By Country – South America PCB Packaging Materials Sales, 2018-2029
6.7.3 Brazil PCB Packaging Materials Market Size, 2018-2029
6.7.4 Argentina PCB Packaging Materials Market Size, 2018-2029
6.8 Middle East & Africa
6.8.1 By Country – Middle East & Africa PCB Packaging Materials Revenue, 2018-2029
6.8.2 By Country – Middle East & Africa PCB Packaging Materials Sales, 2018-2029
6.8.3 Turkey PCB Packaging Materials Market Size, 2018-2029
6.8.4 Israel PCB Packaging Materials Market Size, 2018-2029
6.8.5 Saudi Arabia PCB Packaging Materials Market Size, 2018-2029
6.8.6 UAE PCB Packaging Materials Market Size, 2018-2029
7 Manufacturers & Brands Profiles
7.1 DuPont
7.1.1 DuPont Company Summary
7.1.2 DuPont Business Overview
7.1.3 DuPont PCB Packaging Materials Major Product Offerings
7.1.4 DuPont PCB Packaging Materials Sales and Revenue in Global (2018-2023)
7.1.5 DuPont Key News & Latest Developments
7.2 Evonik
7.2.1 Evonik Company Summary
7.2.2 Evonik Business Overview
7.2.3 Evonik PCB Packaging Materials Major Product Offerings
7.2.4 Evonik PCB Packaging Materials Sales and Revenue in Global (2018-2023)
7.2.5 Evonik Key News & Latest Developments
7.3 EPM
7.3.1 EPM Company Summary
7.3.2 EPM Business Overview
7.3.3 EPM PCB Packaging Materials Major Product Offerings
7.3.4 EPM PCB Packaging Materials Sales and Revenue in Global (2018-2023)
7.3.5 EPM Key News & Latest Developments
7.4 Mitsubishi Chemical
7.4.1 Mitsubishi Chemical Company Summary
7.4.2 Mitsubishi Chemical Business Overview
7.4.3 Mitsubishi Chemical PCB Packaging Materials Major Product Offerings
7.4.4 Mitsubishi Chemical PCB Packaging Materials Sales and Revenue in Global (2018-2023)
7.4.5 Mitsubishi Chemical Key News & Latest Developments
7.5 Sumitomo Chemical
7.5.1 Sumitomo Chemical Company Summary
7.5.2 Sumitomo Chemical Business Overview
7.5.3 Sumitomo Chemical PCB Packaging Materials Major Product Offerings
7.5.4 Sumitomo Chemical PCB Packaging Materials Sales and Revenue in Global (2018-2023)
7.5.5 Sumitomo Chemical Key News & Latest Developments
7.6 Mitsui High-tec
7.6.1 Mitsui High-tec Company Summary
7.6.2 Mitsui High-tec Business Overview
7.6.3 Mitsui High-tec PCB Packaging Materials Major Product Offerings
7.6.4 Mitsui High-tec PCB Packaging Materials Sales and Revenue in Global (2018-2023)
7.6.5 Mitsui High-tec Key News & Latest Developments
7.7 Tanaka
7.7.1 Tanaka Company Summary
7.7.2 Tanaka Business Overview
7.7.3 Tanaka PCB Packaging Materials Major Product Offerings
7.7.4 Tanaka PCB Packaging Materials Sales and Revenue in Global (2018-2023)
7.7.5 Tanaka Key News & Latest Developments
7.8 Shinko Electric Industries
7.8.1 Shinko Electric Industries Company Summary
7.8.2 Shinko Electric Industries Business Overview
7.8.3 Shinko Electric Industries PCB Packaging Materials Major Product Offerings
7.8.4 Shinko Electric Industries PCB Packaging Materials Sales and Revenue in Global (2018-2023)
7.8.5 Shinko Electric Industries Key News & Latest Developments
7.9 Panasonic
7.9.1 Panasonic Company Summary
7.9.2 Panasonic Business Overview
7.9.3 Panasonic PCB Packaging Materials Major Product Offerings
7.9.4 Panasonic PCB Packaging Materials Sales and Revenue in Global (2018-2023)
7.9.5 Panasonic Key News & Latest Developments
7.10 Hitachi Chemical
7.10.1 Hitachi Chemical Company Summary
7.10.2 Hitachi Chemical Business Overview
7.10.3 Hitachi Chemical PCB Packaging Materials Major Product Offerings
7.10.4 Hitachi Chemical PCB Packaging Materials Sales and Revenue in Global (2018-2023)
7.10.5 Hitachi Chemical Key News & Latest Developments
7.11 Kyocera Chemical
7.11.1 Kyocera Chemical Company Summary
7.11.2 Kyocera Chemical PCB Packaging Materials Business Overview
7.11.3 Kyocera Chemical PCB Packaging Materials Major Product Offerings
7.11.4 Kyocera Chemical PCB Packaging Materials Sales and Revenue in Global (2018-2023)
7.11.5 Kyocera Chemical Key News & Latest Developments
7.12 Gore
7.12.1 Gore Company Summary
7.12.2 Gore PCB Packaging Materials Business Overview
7.12.3 Gore PCB Packaging Materials Major Product Offerings
7.12.4 Gore PCB Packaging Materials Sales and Revenue in Global (2018-2023)
7.12.5 Gore Key News & Latest Developments
7.13 BASF
7.13.1 BASF Company Summary
7.13.2 BASF PCB Packaging Materials Business Overview
7.13.3 BASF PCB Packaging Materials Major Product Offerings
7.13.4 BASF PCB Packaging Materials Sales and Revenue in Global (2018-2023)
7.13.5 BASF Key News & Latest Developments
7.14 Henkel
7.14.1 Henkel Company Summary
7.14.2 Henkel Business Overview
7.14.3 Henkel PCB Packaging Materials Major Product Offerings
7.14.4 Henkel PCB Packaging Materials Sales and Revenue in Global (2018-2023)
7.14.5 Henkel Key News & Latest Developments
7.15 AMETEK Electronic
7.15.1 AMETEK Electronic Company Summary
7.15.2 AMETEK Electronic Business Overview
7.15.3 AMETEK Electronic PCB Packaging Materials Major Product Offerings
7.15.4 AMETEK Electronic PCB Packaging Materials Sales and Revenue in Global (2018-2023)
7.15.5 AMETEK Electronic Key News & Latest Developments
7.16 Toray
7.16.1 Toray Company Summary
7.16.2 Toray Business Overview
7.16.3 Toray PCB Packaging Materials Major Product Offerings
7.16.4 Toray PCB Packaging Materials Sales and Revenue in Global (2018-2023)
7.16.5 Toray Key News & Latest Developments
7.17 Maruwa
7.17.1 Maruwa Company Summary
7.17.2 Maruwa Business Overview
7.17.3 Maruwa PCB Packaging Materials Major Product Offerings
7.17.4 Maruwa PCB Packaging Materials Sales and Revenue in Global (2018-2023)
7.17.5 Maruwa Key News & Latest Developments
7.18 Leatec Fine Ceramics
7.18.1 Leatec Fine Ceramics Company Summary
7.18.2 Leatec Fine Ceramics Business Overview
7.18.3 Leatec Fine Ceramics PCB Packaging Materials Major Product Offerings
7.18.4 Leatec Fine Ceramics PCB Packaging Materials Sales and Revenue in Global (2018-2023)
7.18.5 Leatec Fine Ceramics Key News & Latest Developments
7.19 NCI
7.19.1 NCI Company Summary
7.19.2 NCI Business Overview
7.19.3 NCI PCB Packaging Materials Major Product Offerings
7.19.4 NCI PCB Packaging Materials Sales and Revenue in Global (2018-2023)
7.19.5 NCI Key News & Latest Developments
7.20 Chaozhou Three-Circle
7.20.1 Chaozhou Three-Circle Company Summary
7.20.2 Chaozhou Three-Circle Business Overview
7.20.3 Chaozhou Three-Circle PCB Packaging Materials Major Product Offerings
7.20.4 Chaozhou Three-Circle PCB Packaging Materials Sales and Revenue in Global (2018-2023)
7.20.5 Chaozhou Three-Circle Key News & Latest Developments
7.21 Nippon Micrometal
7.21.1 Nippon Micrometal Company Summary
7.21.2 Nippon Micrometal Business Overview
7.21.3 Nippon Micrometal PCB Packaging Materials Major Product Offerings
7.21.4 Nippon Micrometal PCB Packaging Materials Sales and Revenue in Global (2018-2023)
7.21.5 Nippon Micrometal Key News & Latest Developments
7.22 Toppan
7.22.1 Toppan Company Summary
7.22.2 Toppan Business Overview
7.22.3 Toppan PCB Packaging Materials Major Product Offerings
7.22.4 Toppan PCB Packaging Materials Sales and Revenue in Global (2018-2023)
7.22.5 Toppan Key News & Latest Developments
7.23 Dai Nippon Printing
7.23.1 Dai Nippon Printing Company Summary
7.23.2 Dai Nippon Printing Business Overview
7.23.3 Dai Nippon Printing PCB Packaging Materials Major Product Offerings
7.23.4 Dai Nippon Printing PCB Packaging Materials Sales and Revenue in Global (2018-2023)
7.23.5 Dai Nippon Printing Key News & Latest Developments
7.24 Possehl
7.24.1 Possehl Company Summary
7.24.2 Possehl Business Overview
7.24.3 Possehl PCB Packaging Materials Major Product Offerings
7.24.4 Possehl PCB Packaging Materials Sales and Revenue in Global (2018-2023)
7.24.5 Possehl Key News & Latest Developments
7.25 Ningbo Kangqiang
7.25.1 Ningbo Kangqiang Company Summary
7.25.2 Ningbo Kangqiang Business Overview
7.25.3 Ningbo Kangqiang PCB Packaging Materials Major Product Offerings
7.25.4 Ningbo Kangqiang PCB Packaging Materials Sales and Revenue in Global (2018-2023)
7.25.5 Ningbo Kangqiang Key News & Latest Developments
8 Global PCB Packaging Materials Production Capacity, Analysis
8.1 Global PCB Packaging Materials Production Capacity, 2018-2029
8.2 PCB Packaging Materials Production Capacity of Key Manufacturers in Global Market
8.3 Global PCB Packaging Materials Production by Region
9 Key Market Trends, Opportunity, Drivers and Restraints
9.1 Market Opportunities & Trends
9.2 Market Drivers
9.3 Market Restraints
10 PCB Packaging Materials Supply Chain Analysis
10.1 PCB Packaging Materials Industry Value Chain
10.2 PCB Packaging Materials Upstream Market
10.3 PCB Packaging Materials Downstream and Clients
10.4 Marketing Channels Analysis
10.4.1 Marketing Channels
10.4.2 PCB Packaging Materials Distributors and Sales Agents in Global
11 Conclusion
12 Appendix
12.1 Note
12.2 Examples of Clients
12.3 Disclaimer
※参考情報 PCBパッケージ材料は、プリント基板(PCB)を製造する際に使用される多様な材料を指します。これらの材料は、電子機器の小型化、高性能化、信頼性の向上に寄与し、現代のエレクトロニクス産業において不可欠な要素となっています。本稿では、PCBパッケージ材料の定義、特徴、種類、用途、関連技術について説明します。 PCBパッケージ材料の定義としては、主に電子回路を構成するための基板自体をはじめ、半導体チップを保護するための封止材料、接続部材、さらには表面処理材料などが含まれます。これらの材料は、電気的特性や熱的特性、機械的特性を考慮して選択され、最終的な製品の性能を大きく左右します。 PCBパッケージ材料の特徴には、以下のような点が挙げられます。まず第一に、高い絶縁性が求められます。これは、電子回路が正確に動作するために、異なる導体間で電流が漏れないようにするためです。次に、熱伝導性や耐熱性も重要です。特に高性能な電子機器では、発生する熱を適切に管理しなければならず、これに対応するための材料選定が不可欠です。また、機械的強度も大切な要素であり、外部からの衝撃や圧力に対して耐える能力が求められます。最後に、化学的耐性や環境への適合性も無視できません。環境に優しい材料が求められる現代では、リサイクル性や環境負荷を考慮した選択も重要視されています。 PCBパッケージ材料には主に以下の種類が存在します。一般的に使用される材料としては、FR-4と呼ばれるエポキシ樹脂系のガラス繊維複合材料が挙げられます。これは、コストパフォーマンスが優れており、多くの電子機器で利用されています。また、より高性能な材料として、PTFE(テフロン)やBT(ビスフェノール樹脂)ベースの材料、さらにはスピラル塗装材なども使用されます。 FR-4は優れた絶縁性を持ちつつ、機械的強度や耐熱性にも優れていますが、高周波特性には限界があります。これに対して、PTFEは高周波特性に優れていますが、コストが高く加工が難しいという欠点もあります。また、BTベースの材料は、さらなる耐熱性や弾性を提供しますが、ハンダ耐熱性に課題があることもあります。 用途としては、様々なエレクトロニクス製品に使用されます。スマートフォンやタブレットなどのモバイルデバイス、自動車や航空機などの運輸機器、さらには医療機器や通信機器など、多岐にわたります。高性能な電子機器においては、パッケージ材料の選定がそのまま製品の機能性や耐久性に直結するため、非常に重要であると言えます。 関連技術についても触れておく必要があります。PCBの製造プロセスは非常に複雑であり、化学エッチング、メッキ、成膜、はんだ付けなどの技術が関与します。特に最近では、3Dプリンティング技術がPCB製造にも応用される場面が増えてきています。これにより、複雑な形状の基板や新しい材料を使用したパッケージングが可能になり、さらなる小型化や集積化が期待されています。 また、電子デバイスの進化に伴い、PCBパッケージ材料の技術も常に進化しています。例えば、ナノ材料を使用した新しいコンポジットや、環境に配慮した生分解性の材料の研究開発が進められています。これにより、従来の材料に代わる新しい選択肢が増えてきており、今後の業界動向が注目されます。 総じて、PCBパッケージ材料はエレクトロニクス産業において極めて重要な役割を担っており、材料の選定や技術の進化は製品の性能や信頼性に大きな影響を与えます。今後は、さらなる性能向上や環境配慮が求められる中、これらの材料に関する研究開発が重要となるでしょう。 |