1 INTRODUCTION 18
1.1 STUDY OBJECTIVES 18
1.2 MARKET DEFINITION 18
1.3 INCLUSIONS & EXCLUSIONS 18
1.4 MARKET SCOPE 19
1.4.1 MARKETS COVERED 19
1.4.2 REGIONAL SCOPE 19
1.4.3 YEARS CONSIDERED 20
1.5 CURRENCY CONSIDERED 20
1.6 LIMITATIONS 20
1.7 STAKEHOLDERS 21
2 RESEARCH METHODOLOGY 22
2.1 RESEARCH DATA 22
FIGURE 1 SIC WAFER POLISHING MARKET: RESEARCH DESIGN 22
2.1.1 SECONDARY DATA 23
2.1.1.1 Key data from secondary sources 23
2.1.2 PRIMARY DATA 24
2.1.2.1 Key data from primary sources 24
FIGURE 2 KEY INDUSTRY INSIGHTS 24
2.1.2.2 Breakdown of primary interviews 25
FIGURE 3 BREAKDOWN OF PRIMARY INTERVIEWS: BY COMPANY TYPE, DESIGNATION, AND REGION 25
2.2 DATA TRIANGULATION 26
FIGURE 4 DATA TRIANGULATION 26
2.3 MARKET SIZE ESTIMATION 27
2.3.1 BOTTOM-UP APPROACH 27
FIGURE 5 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH 27
2.3.2 TOP-DOWN APPROACH 28
FIGURE 6 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH 28
2.3.3 DEMAND SIDE 28
FIGURE 7 DEMAND-SIDE ANALYSIS 28
FIGURE 8 METRICS CONSIDERED FOR ANALYZING AND ASSESSING DEMAND FOR SIC WAFER POLISHING 29
2.3.3.1 Research assumptions 29
2.3.4 FORECAST 30
3 EXECUTIVE SUMMARY 31
TABLE 1 SIC WAFER POLISHING MARKET: SNAPSHOT 31
FIGURE 9 DIAMOND SLURRIES SEGMENT TO ACCOUNT FOR LARGEST SHARE DURING FORECAST PERIOD 32
FIGURE 10 POWER ELECTRONICS SEGMENT TO ACCOUNT FOR LARGEST SHARE DURING FORECAST PERIOD 32
FIGURE 11 CHEMICAL MECHANICAL POLISHING (CMP) PROCESS TO ACCOUNT FOR LARGEST SHARE DURING FORECAST PERIOD 33
FIGURE 12 ASIA PACIFIC TO LEAD SIC WAFER POLISHING MARKET IN 2023 34
4 PREMIUM INSIGHTS 35
4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN SIC WAFER POLISHING MARKET 35
FIGURE 13 INCREASING AWARENESS OF SUSTAINABLE TECHNOLOGY DRIVING MARKET DURING FORECAST PERIOD 35
4.2 SIC WAFER POLISHING MARKET: ASIA PACIFIC, BY APPLICATION AND COUNTRY 36
FIGURE 14 CHEMICAL AND CHINA ACCOUNTED FOR SIGNIFICANT SHARE IN 2022 36
4.3 SIC WAFER POLISHING MARKET, BY PRODUCT 36
FIGURE 15 DIAMOND SLURRIES SEGMENT TO ACCOUNT FOR LARGEST SHARE BY 2028 36
4.4 SIC WAFER POLISHING MARKET, BY APPLICATION 37
FIGURE 16 POWER ELECTRONICS SEGMENT TO ACCOUNT FOR LARGEST SHARE IN 2028 37
4.5 SIC WAFER POLISHING MARKET, BY PROCESS 37
FIGURE 17 CHEMICAL MECHANICAL POLISHING SEGMENT TO ACCOUNT FOR LARGEST SHARE IN 2028 37
4.6 SIC WAFER POLISHING MARKET: REGIONAL ANALYSIS 38
FIGURE 18 ASIA PACIFIC TO ACCOUNT FOR LARGEST SHARE OF SIC WAFER POLISHING MARKET IN 2023 38
5 MARKET OVERVIEW 39
5.1 INTRODUCTION 39
5.2 MARKET DYNAMICS 39
FIGURE 19 DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES IN SIC WAFER POLISHING MARKET 39
5.2.1 DRIVERS 40
5.2.1.1 Growing consumption of consumer electronics 40
5.2.1.2 Growing demand for SiC-based power devices 40
5.2.1.3 Development of advanced polishing consumable 41
5.2.1.4 Adoption of SiC wafers in radio frequency (RF) devices 41
5.2.2 RESTRAINTS 42
5.2.2.1 Surface defects and contamination 42
5.2.2.2 Long polishing cycle times 42
5.2.2.3 Limited supplier base 43
5.2.3 OPPORTUNITIES 43
5.2.3.1 Growing investments in SiC R&D 43
5.2.3.2 Emergence of new applications 43
5.2.3.3 Advancements in polishing technologies 44
5.2.4 CHALLENGES 45
5.2.4.1 Complexity regarding manufacturing 45
5.2.4.2 Intense competition and market consolidation 45
5.3 PORTER’S FIVE FORCES ANALYSIS 46
TABLE 2 SIC WAFER POLISHING MARKET: PORTER’S FIVE FORCES ANALYSIS 46
FIGURE 20 PORTER’S FIVE FORCES ANALYSIS: SIC WAFER POLISHING MARKET 46
5.3.1 THREAT OF NEW ENTRANTS 47
5.3.2 THREATS OF SUBSTITUTES 47
5.3.3 BARGAINING POWER OF SUPPLIERS 47
5.3.4 BARGAINING POWER OF BUYERS 47
5.3.5 INTENSITY OF COMPETITIVE RIVALRY 48
6 INDUSTRY TRENDS 49
6.1 RECESSION IMPACT 49
6.2 VALUE CHAIN ANALYSIS 49
FIGURE 21 VALUE CHAIN FOR SIC WAFER POLISHING MARKET 50
6.2.1 RAW MATERIAL SUPPLIERS 50
6.2.2 MANUFACTURERS 51
6.2.3 DISTRIBUTORS 51
6.2.4 END USER 51
6.3 MACROECONOMIC INDICATORS 52
6.3.1 GDP TRENDS AND FORECASTS OF MAJOR ECONOMIES 52
TABLE 3 GDP TRENDS AND FORECASTS, BY KEY COUNTRY, 2019–2027 (USD MILLION) 52
6.4 SIC WAFER POLISHING MARKET REGULATIONS 53
6.4.1 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 53
TABLE 4 NORTH AMERICA: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 53
TABLE 5 EUROPE: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 54
TABLE 6 ASIA PACIFIC: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 54
6.5 TRADE ANALYSIS 55
6.5.1 EXPORT SCENARIO 55
FIGURE 22 EXPORT SCENARIO FOR HS CODE 381800, BY KEY COUNTRY (2019–2022) 55
6.5.2 IMPORT SCENARIO 55
FIGURE 23 IMPORT SCENARIO FOR HS CODE 381800, BY KEY COUNTRY, (2019–2022) 55
6.6 PATENT ANALYSIS 56
6.6.1 INTRODUCTION 56
6.6.2 METHODOLOGY 56
6.6.2.1 Document type 56
TABLE 7 GRANTED PATENTS ACCOUNTED FOR 35% OF TOTAL PATENTS IN LAST 10 YEARS 56
FIGURE 24 PUBLICATION TRENDS OVER LAST TEN YEARS 57
6.6.3 INSIGHTS 57
6.6.4 LEGAL STATUS OF PATENTS 57
FIGURE 25 LEGAL STATUS OF PATENTS FIELD FOR SIC WAFER POLISHING MARKET 57
6.6.5 JURISDICTION ANALYSIS 58
FIGURE 26 TOP JURISDICTION-BY DOCUMENT 58
6.6.6 ANALYSIS OF TOP APPLICANTS 58
FIGURE 27 TAIWAN SEMICONDUCTOR MFG CO LTD REGISTERED HIGHEST NUMBER OF PATIENTS BETWEEN 2017 AND 2022 58
6.7 TRENDS/DISRUPTIONS IMPACTING CUSTOMERS’ BUSINESSES 59
6.7.1 REVENUE SHIFTS & NEW REVENUE POCKETS FOR SIC WAFER POLISHING MARKET 59
FIGURE 28 REVENUE SHIFT OF SIC WAFER POLISHING PROVIDERS 59
6.8 ECOSYSTEM/MARKETMAP 60
TABLE 8 GDP TRENDS AND FORECASTS, BY KEY COUNTRY, 2019–2027 60
FIGURE 29 SIC WAFER POLISHING MARKET: ECOSYSTEM 61
6.9 TECHNOLOGY ANALYSIS 61
6.9.1 CHEMICAL MECHANICAL PLANARIZATION (CMP) TECHNOLOGY 61
TABLE 9 ADVANTAGES OF CHEMICAL MECHANICAL PLANARIZATION (CMP) TECHNOLOGY 62
6.9.2 FIXED ABRASIVE POLISHING (FAP) 62
TABLE 10 ADVANTAGES OF FIXED ABRASIVE POLISHING (FAP) TECHNOLOGY 62
6.10 KEY STAKEHOLDERS AND BUYING CRITERIA 63
6.10.1 KEY STAKEHOLDERS IN BUYING PROCESS 63
FIGURE 30 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP 4 APPLICATIONS 63
TABLE 11 INFLUENCE OF INSTITUTIONAL BUYERS ON BUYING PROCESS FOR TOP 4 APPLICATIONS 63
6.10.2 BUYING CRITERIA 64
FIGURE 31 KEY BUYING CRITERIA FOR END-USER INDUSTRIES 64
TABLE 12 KEY BUYING CRITERIA FOR END-USER INDUSTRIES 64
7 SIC WAFER POLISHING MARKET, BY PRODUCT 65
7.1 INTRODUCTION 66
FIGURE 32 SIC WAFER POLISHING MARKET, BY PRODUCT, 2022 66
TABLE 13 SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 66
TABLE 14 SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 67
7.2 ABRASIVE POWDER 67
7.2.1 COMPATIBILITY WITH DIFFERENT POLISHING SYSTEMS AND EQUIPMENT TO DRIVE MARKET 67
7.3 POLISHING PADS 67
7.3.1 HIGHLY VERSATILE NATURE TO INCREASE USAGE 67
7.4 DIAMOND SLURRIES 68
7.4.1 INCREASING DEMAND FOR HIGH-PERFORMANCE SIC-BASED DEVICES TO DRIVE MARKET 68
7.5 COLLOIDAL SILICA SUSPENSIONS 68
7.5.1 COST-EFFECTIVENESS IN SIC WAFER POLISHING PROCESSES TO DRIVE MARKET 68
7.6 OTHERS 69
7.6.1 ABRASIVE SLURRIES 69
8 SIC WAFER POLISHING MARKET, BY PROCESS 70
8.1 INTRODUCTION 71
FIGURE 33 SIC WAFER POLISHING MARKET, BY PROCESS, 2022 71
TABLE 15 SIC WAFER POLISHING MARKET, BY PROCESS, 2020–2022 (USD MILLION) 71
TABLE 16 SIC WAFER POLISHING MARKET SIZE, BY PROCESS, 2023–2028 (USD MILLION) 72
8.2 MECHANICAL POLISHING 72
8.2.1 VERSATILE PROCESS FOR POLISHING COMPLEX SIC WAFERS TO DRIVE MARKET 72
8.3 CHEMICAL-MECHANICAL POLISHING (CMP) 72
8.3.1 HIGH DEMAND FOR POLISHING SEMICONDUCTOR DEVICES TO DRIVE MARKET 72
8.4 ELECTROPOLISHING 73
8.4.1 CUTTING-EDGE ELECTROPOLISHING ADVANCES TO INCREASE DEMAND 73
8.5 CHEMICAL POLISHING 73
8.5.1 RISING DEMAND FOR HIGH-THROUGHPUT SIC POLISHING TO DRIVE MARKET 73
8.6 PLASMA-ASSISTED POLISHING 74
8.6.1 HIGHLY EFFICIENT AND EFFECTIVE PROCESS TO DRIVE MARKET 74
8.7 OTHERS 75
8.7.1 REACTIVE ION ETCHING (RIE) 75
9 SIC WAFER POLISHING MARKET, BY APPLICATION 76
9.1 INTRODUCTION 77
FIGURE 34 SIC WAFER POLISHING MARKET, BY APPLICATION, 2023 77
TABLE 17 SIC WAFER POLISHING MARKET, BY APPLICATION, 2020–2022 (USD MILLION) 77
TABLE 18 SIC WAFER POLISHING MARKET, BY APPLICATION, 2023–2028 (USD MILLION) 78
9.2 POWER ELECTRONICS 78
9.2.1 ADVANCED POLISHING TECHNIQUES TO DRIVE MARKET 78
9.3 LIGHT-EMITTING DIODES (LEDS) 79
9.3.1 STABLE ILLUMINATION AND INCREASING PRODUCTIVITY TO DRIVE MARKET 79
9.4 SENSORS AND DETECTORS 79
9.4.1 SIC POLISHING EMPOWERING GROWTH WITH ADVANCED SENSORS AND DETECTORS TO DRIVE MARKET 79
9.5 RF AND MICROWAVE DEVICES 80
9.5.1 ELECTRICAL AND THERMAL PERFORMANCE TO DRIVE MARKET 80
9.6 OTHERS 80
9.6.1 SEMICONDUCTOR DEVICES 80
10 SIC WAFER POLISHING MARKET, BY REGION 81
10.1 INTRODUCTION 82
FIGURE 35 ASIA PACIFIC TO BE FASTEST-GROWING MARKET DURING FORECAST PERIOD 82
TABLE 19 SIC WAFER POLISHING MARKET, BY REGION, 2020–2022 (USD MILLION) 82
TABLE 20 SIC WAFER POLISHING MARKET, BY REGION, 2023–2028 (USD MILLION) 83
TABLE 21 SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 83
TABLE 22 SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 83
TABLE 23 SIC WAFER POLISHING MARKET, BY PROCESS, 2020–2022 (USD MILLION) 84
TABLE 24 SIC WAFER POLISHING MARKET, BY PROCESS, 2023–2028 (USD MILLION) 84
TABLE 25 SIC WAFER POLISHING MARKET, BY APPLICATION, 2020–2022 (USD MILLION) 84
TABLE 26 SIC WAFER POLISHING MARKET, BY APPLICATION, 2023–2028 (USD MILLION) 85
10.2 EUROPE 85
10.2.1 RECESSION IMPACT 85
FIGURE 36 EUROPE: SIC WAFER POLISHING MARKET SNAPSHOT 86
TABLE 27 EUROPE: SIC WAFER POLISHING MARKET, BY COUNTRY, 2020–2022 (USD MILLION) 86
TABLE 28 EUROPE: SIC WAFER POLISHING MARKET, BY COUNTRY, 2023–2028 (USD MILLION) 87
TABLE 29 EUROPE: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 87
TABLE 30 EUROPE: SIC WAFER POLISHING, BY PRODUCT, 2023–2028 (USD MILLION) 87
10.2.2 GERMANY 88
10.2.2.1 Increasing availability of SiC wafers to drive market 88
TABLE 31 GERMANY: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 88
TABLE 32 GERMANY: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 88
10.2.3 ITALY 89
10.2.3.1 Government initiatives promoting adoption of renewable energy to drive market 89
TABLE 33 ITALY: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 89
TABLE 34 ITALY: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 89
10.2.4 FRANCE 90
10.2.4.1 Growing demand for high-performance electronic devices to drive market 90
TABLE 35 FRANCE: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 90
TABLE 36 FRANCE: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 90
10.2.5 SWEDEN 91
10.2.5.1 Growing importance of cybersecurity for semiconductors to increase market 91
TABLE 37 SWEDEN: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 91
TABLE 38 SWEDEN: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 91
10.2.6 REST OF EUROPE 92
TABLE 39 REST OF EUROPE: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 92
TABLE 40 REST OF EUROPE: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 92
10.3 ASIA PACIFIC 93
10.3.1 RECESSION IMPACT 93
FIGURE 37 ASIA PACIFIC: SIC WAFER POLISHING MARKET SNAPSHOT 94
TABLE 41 ASIA PACIFIC: SIC WAFER POLISHING MARKET, BY COUNTRY, 2020–2022 (USD MILLION) 94
TABLE 42 ASIA PACIFIC: SIC WAFER POLISHING MARKET, BY COUNTRY, 2023–2028 (USD MILLION) 95
TABLE 43 ASIA PACIFIC: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 95
TABLE 44 ASIA PACIFIC: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 95
10.3.2 CHINA 96
10.3.2.1 Increasing demand for SiC wafers in power electronics applications to drive market 96
TABLE 45 CHINA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 96
TABLE 46 CHINA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 96
10.3.3 JAPAN 97
10.3.3.1 Growing importance as semiconductors market to drive growth 97
TABLE 47 JAPAN: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 97
TABLE 48 JAPAN: SIC WAFER POLISHING MARKET, BY PRODUCT 2023–2028 (USD MILLION) 97
10.3.4 SOUTH KOREA 98
10.3.4.1 Development of new polishing technologies to drive market 98
TABLE 49 SOUTH KOREA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 98
TABLE 50 SOUTH KOREA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 99
10.3.5 TAIWAN 99
10.3.5.1 Efforts to reduce carbon emissions to drive market 99
TABLE 51 TAIWAN: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 100
TABLE 52 TAIWAN: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 100
10.3.6 REST OF ASIA PACIFIC 100
TABLE 53 REST OF ASIA PACIFIC: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 100
TABLE 54 REST OF ASIA PACIFIC: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 101
10.4 NORTH AMERICA 101
10.4.1 RECESSION IMPACT 101
FIGURE 38 NORTH AMERICA: SIC WAFER POLISHING MARKET SNAPSHOT 102
TABLE 55 NORTH AMERICA: SIC WAFER POLISHING MARKET, BY COUNTRY, 2020–2022 (USD MILLION) 102
TABLE 56 NORTH AMERICA: SIC WAFER POLISHING MARKE, BY COUNTRY, 2023–2028 (USD MILLION) 103
TABLE 57 NORTH AMERICA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 103
TABLE 58 NORTH AMERICA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 103
10.4.2 US 104
10.4.2.1 Rising adoption of SiC-based power devices in renewable energy to hamper market 104
TABLE 59 US: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 104
TABLE 60 US: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 104
10.4.3 CANADA 105
10.4.3.1 Growing research activities to drive market 105
TABLE 61 CANADA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 105
TABLE 62 CANADA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 105
10.4.4 MEXICO 106
10.4.4.1 Growing telecommunication industry to increase demand 106
TABLE 63 MEXICO: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 106
TABLE 64 MEXICO: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 106
10.5 REST OF WORLD (ROW) 107
TABLE 65 REST OF WORLD: SIC WAFER POLISHING MARKET SIZE, BY COUNTRY, 2020–2022 (USD MILLION) 107
TABLE 66 REST OF WORLD: SIC WAFER POLISHING MARKET, BY COUNTRY, 2023–2028 (USD MILLION) 107
TABLE 67 REST OF WORLD: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 107
TABLE 68 REST OF WORLD: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 108
10.5.1 BRAZIL 108
10.5.1.1 Favorable government policies to drive market 108
TABLE 69 BRAZIL: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 108
TABLE 70 BRAZIL: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 109
10.5.2 SOUTH AFRICA 109
10.5.2.1 Expanding SiC wafer manufacturing base to drive demand 109
TABLE 71 SOUTH AFRICA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 109
TABLE 72 SOUTH AFRICA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 110
10.5.3 REST OF ROW 110
TABLE 73 REST OF ROW: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 110
TABLE 74 REST OF ROW: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 110
11 COMPETITIVE LANDSCAPE 111
11.1 INTRODUCTION 111
11.2 STRATEGIES ADOPTED BY KEY PLAYERS 111
TABLE 75 OVERVIEW OF STRATEGIES ADOPTED BY KEY SIC WAFER POLISHING MARKET 111
11.3 MARKET SHARE ANALYSIS 112
11.3.1 RANKING OF KEY MARKET PLAYERS, 2022 112
FIGURE 39 RANKING OF TOP FIVE PLAYERS IN SIC WAFER POLISHING MARKET, 2022 112
11.3.2 MARKET SHARE OF KEY PLAYERS 112
TABLE 76 SIC WAFER POLISHINGS: DEGREE OF COMPETITION 113
FIGURE 40 SIC WAFER POLISHING MARKET IN 2022 113
11.3.2.1 Kemet International Limited 113
11.3.2.2 Entegris 113
11.3.2.3 Fujimi Incorporated 114
11.3.2.4 Ferro Corporation 114
11.3.2.5 Iljin Diamond 114
11.4 COMPANY PRODUCT FOOTPRINT ANALYSIS 114
TABLE 77 SIC WAFER POLISHING MARKET: KEY COMPANY PROCESS FOOTPRINT 114
TABLE 78 SIC WAFER POLISHING MARKET: KEY COMPANY PRODUCT FOOTPRINT 115
TABLE 79 SIC WAFER POLISHING MARKET: KEY COMPANY APPLICATION FOOTPRINT 116
TABLE 80 SIC WAFER POLISHING MARKET: KEY COMPANY REGION FOOTPRINT 116
11.5 COMPANY EVALUATION QUADRANT (TIER 1) 117
11.5.1 STARS 117
11.5.2 EMERGING LEADERS 117
11.5.3 PERVASIVE PLAYERS 117
11.5.4 PARTICIPANTS 117
FIGURE 41 SIC WAFER POLISHING MARKET COMPANY EVALUATION MATRIX, 2022 (TIER 1) 118
11.6 COMPETITIVE BENCHMARKING 119
TABLE 81 SIC WAFER POLISHING MARKET: DETAILED LIST OF KEY STARTUPS/SMES 119
TABLE 82 SIC WAFER POLISHING MARKET: STARTUPS/SME PLAYERS PROCESS FOOTPRINT 120
TABLE 83 SIC WAFER POLISHING MARKET: STARTUPS/SME PLAYERS PRODUCT FOOTPRINT 120
TABLE 84 SIC WAFER POLISHING MARKET: STARTUPS/SME PLAYERS APPLICATION FOOTPRINT 121
TABLE 85 SIC WAFER POLISHING MARKET: STARTUPS/SME PLAYERS REGION FOOTPRINT 122
11.7 STARTUP/SME EVALUATION QUADRANT 122
11.7.1 RESPONSIVE COMPANIES 122
11.7.2 STARTING BLOCKS 122
11.7.3 PROGRESSIVE COMPANIES 122
11.7.4 DYNAMIC COMPANIES 122
FIGURE 42 SIC WAFER POLISHING MARKET STARTUPS/SMES COMPANY EVALUATION MATRIX, 2022 123
11.8 COMPETITIVE SCENARIOS AND TRENDS 124
11.8.1 DEALS 124
TABLE 86 SIC WAFER POLISHING MARKET: DEALS (2020–2023) 124
11.8.2 OTHERS 124
TABLE 87 SIC WAFER POLISHING MARKET: OTHERS (2021–2023) 124
12 COMPANY PROFILES 125
(Business overview, Products/Services/Solutions offered, Recent developments & MnM View)*
12.1 KEY PLAYERS 125
12.1.1 ENTEGRIS 125
TABLE 88 ENTEGRIS: COMPANY OVERVIEW 125
FIGURE 43 ENTEGRIS: COMPANY SNAPSHOT 126
TABLE 89 ENTEGRIS: PRODUCTS/SERVICES/SOLUTIONS OFFERED 126
TABLE 90 ENTEGRIS: DEALS 127
12.1.2 SAINT-GOBAIN 129
TABLE 91 SAINT-GOBAIN: COMPANY OVERVIEW 129
TABLE 92 SAINT-GOBAIN: PRODUCTS/SERVICES/SOLUTIONS OFFERED 129
12.1.3 KEMET INTERNATIONAL LIMITED 131
TABLE 93 KEMET INTERNATIONAL LIMITED: COMPANY OVERVIEW 131
TABLE 94 KEMET INTERNATIONAL LIMITED: PRODUCTS/SERVICES/SOLUTIONS OFFERED 131
12.1.4 ILJIN DIAMOND CO., LTD. 133
TABLE 95 ILJIN DIAMOND CO., LTD.: COMPANY OVERVIEW 133
TABLE 96 ILJIN DIAMOND CO., LTD: PRODUCTS/SERVICES/SOLUTIONS OFFERED 133
12.1.5 DUPONT INCORPORATED 135
TABLE 97 DUPONT INCORPORATED: COMPANY OVERVIEW 135
FIGURE 44 DUPONT: COMPANY SNAPSHOT 136
TABLE 98 DUPONT INCORPORATED: PRODUCTS/SERVICES/SOLUTIONS OFFERED 136
12.1.6 FUJIBO HOLDINGS, INC. 138
TABLE 99 FUJIBO HOLDINGS, INC.: COMPANY OVERVIEW 138
FIGURE 45 FUJIBO HOLDING, INC.: COMPANY SNAPSHOT 138
TABLE 100 FUJIBO HOLDINGS, INC.: PRODUCTS/SERVICES/SOLUTIONS OFFERED 139
12.1.7 FUJIFILM HOLDINGS AMERICA CORPORATION 140
TABLE 101 FUJIFILM HOLDINGS AMERICA CORPORATION: COMPANY OVERVIEW 140
TABLE 102 FUJIFILM HOLDINGS AMERICA CORPORATION: PRODUCTS/SERVICES/SOLUTIONS OFFERED 141
TABLE 103 FUJIFILM HOLDINGS AMERICA CORPORATION: OTHERS 141
TABLE 104 FUJIFILM HOLDINGS AMERICA CORPORATION: DEALS 142
12.1.8 ENGIS CORPORATION 143
TABLE 105 ENGIS CORPORATION: COMPANY OVERVIEW 143
TABLE 106 ENGIS CORPORATION: PRODUCTS/SERVICES/SOLUTIONS OFFERED 143
12.1.9 SKC 145
TABLE 107 SKC: COMPANY OVERVIEW 145
FIGURE 46 SKC: COMPANY SNAPSHOT 146
TABLE 108 SKC: PRODUCTS/SERVICES/SOLUTIONS OFFERED 146
TABLE 109 SKC: DEALS 147
TABLE 110 SKC: OTHERS 147
12.1.10 FERRO CORPORATION 148
TABLE 111 FERRO CORPORATION: COMPANY OVERVIEW 148
TABLE 112 FERRO CORPORATION: PRODUCTS/SERVICES/SOLUTIONS OFFERED 148
12.1.11 3M 150
TABLE 113 3M: COMPANY OVERVIEW 150
FIGURE 47 3M: COMPANY SNAPSHOT 151
TABLE 114 3M: PRODUCTS/SERVICES/SOLUTIONS OFFERED 152
12.1.12 JSR CORPORATION 153
TABLE 115 JSR CORPORATION: COMPANY OVERVIEW 153
FIGURE 48 JSR CORPORATION: COMPANY SNAPSHOT 154
TABLE 116 JSR CORPORATION: PRODUCTS/SERVICES/SOLUTIONS OFFERED 154
*Details on Business overview, Products/Services/Solutions offered, Recent developments & MnM View might not be captured in case of unlisted companies.
12.2 OTHER PLAYERS 155
12.2.1 PUREON 155
TABLE 117 PUREON: COMPANY OVERVIEW 155
12.2.2 LAPMASTER WOLTERS 156
TABLE 118 LAPMASTER WOLTERS: COMPANY OVERVIEW 156
12.2.3 LOGITECH LTD. 156
TABLE 119 LOGITECH LTD.: COMPANY OVERVIEW 156
12.2.4 ADVANCED ABRASIVES CORPORATION 157
TABLE 120 ADVANCED ABRASIVES CORPORATION: COMPANY OVERVIEW 157
12.2.5 ALLIED HIGH TECH PRODUCTS 157
TABLE 121 ALLIED HIGH TECH PRODUCTS: COMPANY OVERVIEW 157
12.2.6 ACE NANOCHEM CO., LTD. 158
TABLE 122 ACE NANOCHEM CO., LTD.: COMPANY OVERVIEW 158
12.2.7 SHANGHAI XINANNA ELECTRONIC TECHNOLOGY CO., LTD 159
TABLE 123 SHANGHAI XINANNA ELECTRONIC TECHNOLOGY CO., LTD: COMPANY OVERVIEW 159
12.2.8 AGC INC. 160
TABLE 124 AGC INC.: COMPANY OVERVIEW 160
12.2.9 FUJIMI INCORPORATED 160
TABLE 125 FUJIMI INCORPORATED: COMPANY OVERVIEW 160
12.2.10 LAM PLAN SAS 161
TABLE 126 LAM PLAN SAS: COMPANY OVERVIEW 161
12.2.11 NITTA DUPONT INCORPORATED 161
TABLE 127 NITTA DUPONT INCORPORATED: COMPANY OVERVIEW 161
13 APPENDIX 162
13.1 DISCUSSION GUIDE 162
13.2 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 165
13.3 CUSTOMIZATION OPTIONS 167
13.4 RELATED REPORTS 167
13.5 AUTHOR DETAILS 168
世界のSiCウェーハ研磨市場（～2028年）：製品種類別（砥粒、研磨パッド、ダイヤモンドスラリー、コロイダルシリカサスペンション）、用途別、プロセス別、地域別（北米、ヨーロッパ、アジア太平洋、南米、中東・アフリカ） |
| 【英語タイトル】SiC Wafer Polishing Market by Product Type (Abrasive Powders, Polishing Pads, Diamond Slurries, Colloidal Silica Suspensions), application, Process, & Region (North America, Europe, APAC, South America, MEA) - Global Forecast 2028 | |
 | ・商品コード：CH8753-23 ・発行会社（調査会社）：MarketsandMarkets ・発行日：2023年8月20日 ・ページ数：169 ・レポート言語：英語 ・レポート形式：PDF ・納品方法：Eメール（受注後24時間以内） ・調査対象地域：グローバル ・産業分野：化学 |
| Single User（1名様閲覧） | USD4,950 ⇒換算￥742,500 | 見積依頼/購入/質問フォーム |
| Multi User (Five User) | USD6,650 ⇒換算￥997,500 | 見積依頼/購入/質問フォーム |
| Corporate License (全社内共有可) | USD8,150 ⇒換算￥1,222,500 | 見積依頼/購入/質問フォーム |
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※販売価格オプションの説明 ※お支払金額：換算金額（日本円）＋消費税 ※納期：即日〜2営業日（3日以上かかる場合は別途表記又はご連絡） ※お支払方法：納品日＋5日以内に請求書を発行・送付（請求書発行日より2ヶ月以内に銀行振込、振込先：三菱UFJ銀行/H&Iグローバルリサーチ株式会社、支払期限と方法は調整可能） |
| "SiCウェーハ研磨市場は、2023年の4億米ドルから2028年には22億米ドルに成長すると予測、2023年から2028年までのCAGRは37.5%" これらの要因を考慮すると、パワーエレクトロニクス、自動車、航空宇宙、通信分野でのSiCウェーハ需要の増加が市場拡大の原動力となっています。SiCウェーハは、高い熱伝導率やワイドバンドギャップなどの優れた特性を備えており、より高い効率と性能を必要とする先端デバイスに不可欠です。さらに、再生可能エネルギーシステムや電気自動車へのSiCベースデバイスの採用が拡大していることも、高品質研磨ウェーハの需要を後押ししています。 "製品タイプ別では、ダイヤモンドスラリーSiCウェーハ研磨遠心分離機セグメントが、2023年から2028年にかけてSicウェーハ研磨市場で最も急成長" 製品タイプに基づいて、ダイヤモンドスラリーSiCウェーハ研磨遠心分離機で作られたSiCウェーハ研磨市場は、最大の製品タイプの1つとみなされています。ダイヤモンド粒子の固有の硬度と鋭さは、SiCウェーハがもたらす課題に取り組む上で非常に効果的であり、正確な材料除去と卓越した表面平滑性をもたらします。SiCベースのパワーエレクトロニクス、オプトエレクトロニクス、高周波デバイスの需要が急増し続ける中、メーカーは高度で信頼性の高い研磨ソリューションを求めています。ダイヤモンドスラリー製品はこのような要求に応え、優れた材料除去率の制御と優れた平坦化を実現し、デバイスの性能と歩留まりを向上させます。 "プロセス別では、化学機械研磨プロセスが2023年から2028年にかけてSiCウェーハ研磨市場で最も急成長するセグメントと推定" 用途別に見ると、化学機械研磨（CMP）分野は、高度に制御された正確な研磨手順を与えるそのユニークな能力により、予測期間中にSiCウェーハ研磨市場で最も大きくなると予想されています。CMPは化学反応と機械的磨耗を組み合わせることで、高性能半導体デバイスに必要とされる優れた平坦化と表面平滑性をSiCウェーハに提供します。また、多様な種類のSiC基板に対応し、ウェーハサイズの大型化にも対応できるため、半導体業界の高度なアプリケーションへの要求に応えることができます。さらに、CMPはSiCウェーハからキズや不純物を除去する効果があるため、信頼性の高い高品質なデバイスを製造する方法として好まれています。 "アジア太平洋地域のSiCウェーハ研磨市場は予測期間中に最も高いCAGRを記録すると予測" アジア太平洋地域は、2023年から2028年にかけてSicウェーハ研磨市場で最も高いCAGRを記録すると予測されています。アジア太平洋地域は、中国、日本、韓国、台湾のような国々が世界の半導体生産で重要な役割を果たしており、エレクトロニクスと半導体産業の主要なハブであるため、これらの要因を考慮すると、SiCウェーハ研磨の主要市場の1つです。パワーエレクトロニクス、RF部品、LEDなど、SiCベースのデバイスに対する需要の高まりが、高品質研磨SiCウェーハに対するニーズを後押しし、研磨市場の拡大を促進しています。 主要参入企業のプロフィール - 企業タイプ別：ティア1：35%、ティア2：45%、ティア3：20% - 役職別：Cレベル幹部：35%、取締役：25%、その他：40% - 地域別：北米：40%、欧州：20%、アジア太平洋地域：30% 中東・アフリカ：5%、南米：5% SiCウェーハ研磨市場レポートは、Kemet International (UK), Entegris (US), Iljin Diamond (US), Fujimi Corporation (Japan), Saint-Gobain (US), JSR Corporation (Japan), Engis Corporation (US), Ferro Corporation (US), 3M (US), SKC (South Korea), DuPont Incorporated (US), Fujifilm Holding America Corporation (US)などのプレーヤーによって占められています。 調査範囲 本レポートでは、タイプ、設計タイプ、用途、地域に基づいてSiCウェーハ研磨を定義、セグメント化し、その市場規模を予測しています。主要企業を戦略的にプロファイリングし、市場シェアとコアコンピタンスを包括的に分析しています。また、新製品発売、合意、契約、パートナーシップ、買収など、市場における競合企業の動向も追跡・分析しています。 レポート購入の理由 本レポートは、SiCウェーハ研磨とそのセグメントの収益数の最も近い概算を提供することで、市場のリーダー/新規参入者を支援することが期待されます。本レポートはまた、関係者が市場の競争状況について理解を深め、事業の地位を向上させるための洞察を得て、適切な市場参入戦略を立てるのに役立つことが期待されます。また、利害関係者が市場の鼓動を理解し、主要な市場促進要因、阻害要因、課題、機会に関する情報を提供することができます。 当レポートでは、以下のポイントに関する洞察を提供しています： - 主な促進要因（民生用電子機器の消費拡大、SICベースのパワーデバイスの需要拡大、高度な研磨消耗品の開発、無線周波数（RF）デバイスへのSiCウェーハの採用）、阻害要因（表面欠陥と汚染、長い研磨サイクルタイム、限られたサプライヤーベース）、機会（SiC研究開発への投資の拡大、新しいアプリケーションの出現、研磨技術の進歩）、およびSiCウェーハ研磨市場の成長に影響を与える課題（製造に関する複雑さ、激しい競争と市場統合）の分析 - 製品開発/イノベーション：SiCウェーハ研磨における今後の技術、研究開発活動に関する詳細な洞察 - 市場開発：SiCウェーハ研磨に関する包括的な情報 - 様々な地域にわたるSiCウェーハ研磨を分析 - 市場の多様化：新製品・サービス、未開拓の地域、最近の開発、SiCウェーハ研磨市場における投資に関する詳細な情報を提供 - 競合評価：Kemet International (UK), Entegris (US), Iljin Diamond (US), Fujimi Corporation (Japan), and Saint-Gobain (US)など、SICウェーハ研磨市場における主要企業の市場シェア、成長戦略、サービス内容を詳細に評価 |
1. イントロダクション
2. 調査方法
3. エグゼクティブサマリー
4. プレミアムインサイト
5. 市場概要
6. 産業動向
7. SiCウェーハ研磨市場：製品別
8. SiCウェーハ研磨市場：プロセス別
9. SiCウェーハ研磨市場：用途別
10. SiCウェーハ研磨市場：地域別
11. 競争状況
12. 企業情報
13. 付録
❖ レポートの目次 ❖
| ★調査レポート[世界のSiCウェーハ研磨市場（～2028年）：製品種類別（砥粒、研磨パッド、ダイヤモンドスラリー、コロイダルシリカサスペンション）、用途別、プロセス別、地域別（北米、ヨーロッパ、アジア太平洋、南米、中東・アフリカ）] (コード：CH8753-23)販売に関する免責事項を必ずご確認ください。 |
| ★調査レポート[世界のSiCウェーハ研磨市場（～2028年）：製品種類別（砥粒、研磨パッド、ダイヤモンドスラリー、コロイダルシリカサスペンション）、用途別、プロセス別、地域別（北米、ヨーロッパ、アジア太平洋、南米、中東・アフリカ）]についてメールでお問い合わせ |
