カテゴリー：世界, 航空宇宙/防衛, Allied Market Research

世界の軍事＆航空宇宙における半導体市場2021年-2031年：コンポーネント別（センサー、メモリー、オプトエレクトロニクス、ロジック、マイクロ、アナログ、その他）、技術別（表面実装技術、スルーホール技術）、エンドユーザー別（軍事、航空宇宙）、用途別（通信、ナビゲーション、GPS＆監視、イメージング、レーダー＆地球観測、軍需品、その他）

【英語タイトル】Semiconductor in Military and Aerospace Market By Component (Sensors, Memory, Opto Electronics, Logic, Micro, Analog, Others), By Technology (Surface Mount Technology, Through-Hole Technology), By End Use (Military, Aerospace), By Application (Communication, Navigation, Global Positioning System (GPS) and Surveillance, Imaging, Radar and Earth Observation, Munitions, Others): Global Opportunity Analysis and Industry Forecast, 2021-2031

Allied Market Researchが出版した調査資料（ALD23MA009）

・商品コード：ALD23MA009
・発行会社（調査会社）：Allied Market Research
・発行日：2023年2月
・ページ数：302
・レポート言語：英語
・レポート形式：PDF
・納品方法：Eメール（受注後24時間以内）
・調査対象地域：グローバル
・産業分野：軍事＆防衛

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❖ レポートの概要 ❖

Allied Market Research社の本調査資料は、予測期間中（2021〜2031年）における世界の軍事＆航空宇宙における半導体市場の現状・動向について調査した最新レポートです。イントロダクション、エグゼクティブサマリー、市場概要、コンポーネント別（センサー、メモリー、オプトエレクトロニクス、ロジック、その他）分析、技術別（表面実装技術、スルーホール技術）分析、エンドユーザー別（軍事、航空宇宙）分析、用途別（通信、ナビゲーション、GPS＆監視、イメージング、その他）分析、地域別（北米、ヨーロッパ、アジア太平洋、中南米・中東/アフリカ）分析、企業状況などについて以下の構成でまとめております。なお、参入企業情報として、Analog Devices, Inc.、Infineon Technologies AG、Microchip Technology Inc.、Northrop Grumman Corporation、NXP Semiconductors NV、ON Semiconductor Corporation、Raytheon Technologies Corporation、Teledyne Technologies Inc.、Texas Instruments Incorporated、Advanced Micro Devices Inc.(Xilinx Inc.)などが含まれております。
・イントロダクション
・エグゼクティブサマリー
・市場概要
・世界の軍事＆航空宇宙における半導体市場規模：コンポーネント別
　 - センサーの市場規模
　 - メモリーの市場規模
　 - オプトエレクトロニクスの市場規模
　- ロジックの市場規模
　 - その他コンポーネントの市場規模
・世界の軍事＆航空宇宙における半導体市場規模：技術別
　 - 表面実装技術の市場規模
　 - スルーホール技術の市場規模
・世界の軍事＆航空宇宙における半導体市場規模：エンドユーザー別
　 - 軍事における市場規模
　 - 航空宇宙における市場規模
・世界の軍事＆航空宇宙における半導体市場規模：用途別
　 - 通信用半導体の市場規模
　 - ナビゲーション用半導体の市場規模
　 - GPS＆監視用半導体の市場規模
　 - イメージング用半導体の市場規模
　 - その他用途の市場規模
・世界の軍事＆航空宇宙における半導体市場規模：地域別
　 - 北米の軍事＆航空宇宙における半導体市場規模
　 - ヨーロッパの軍事＆航空宇宙における半導体市場規模
　 - アジア太平洋の軍事＆航空宇宙における半導体市場規模
　 - 中南米・中東/アフリカの軍事＆航空宇宙における半導体市場規模
・企業状況
・企業情報

A semiconductor is an element designed to manage and control the flow of current in electronic devices and equipment. It is made up of silicon, germanium, or gallium arsenide. In addition, semiconductors are generally categorized into N-type semiconductors, and P-type semiconductors. Moreover, semiconductors enable advances in communications, healthcare, military systems, clean energy and others. Furthermore, in military & defense sector, applications of semiconductor include avionics systems, fire control systems, communication systems, missile systems, and others.
Several semiconductor manufacturers are launching new semiconductor products for use in military, which supplements growth of semiconductor in military and aerospace market. For instance, in 2020, Microchip Technology Inc. introduced its new VSC8540/41ET Gigabit Ethernet PHY RMII / RGMII Transceiver – a Commercial Off-The-Shelf (COTS)-based device upgraded for avionics and military applications.

The overall space economy deals with generating revenue through commercial space activities and government investments in space. The government investments shaped the space industry in the 20th century, whereas commercial activities are now setting the pace. The private spaceflight industry has evolved at a fast pace with new entrants and private funding creating opportunities for innovations in products, services, and processes. Increase in investments by governments across the globe for improvement of infrastructure and rise in need to deliver high quality telecommunication services to consumers provide growth opportunities for this market. High demand for satellite imagery in the government sector including federal agencies, local, and state governments for various purposes such as urban planning, border mapping, infrastructure security, homeland security are contributing significantly to the growth of the market.
One of the major factors positively affecting the growth of the market is the large number of satellites that have been launched by various agencies such as NASA, European Space Imaging, and Japan Aerospace Exploration Agency. The European public funding landscape includes programs such as Horizon Europe, InvestEU, and European Fund for Strategic Investments (EFSI), for product development, research and innovation. The European Space Agency (ESA) Business Incubator and Acceleration Centers and the Copernicus Start-Up Program encourage early-stage investments.

The semiconductor in military and aerospace market is segmented on the basis of component, technology, end use, application, and region. By component, it is fragmented into up to sensors, memory, opto electronics, logic, micro, analog, and others. By technology, it is categorized into surface mount technology, and through-hole technology. By end use, it is fragmented into military, and aerospace. By application, it is classified into communication, navigation, global positioning system & surveillance; imaging, radar & earth observation; munitions, and others. By region, the report is analyzed across North America, Europe, Asia-Pacific, and LAMEA.
Some leading companies profiled in the semiconductor in military and aerospace market report include Advanced Micro Devices Inc. (Xilinx Inc.), Analog Devices, Inc., Infineon Technologies AG, Microchip Technology Inc., Northrop Grumman Corporation, NXP Semiconductors NV, ON Semiconductor Corporation, Raytheon Technologies Corporation, Teledyne Technologies Inc., and Texas Instruments Incorporated.

Key Benefits For Stakeholders
●This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the semiconductor in military and aerospace market analysis from 2021 to 2031 to identify the prevailing semiconductor in military and aerospace market opportunities.
●The market research is offered along with information related to key drivers, restraints, and opportunities.
●Porter’s five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.
●In-depth analysis of the semiconductor in military and aerospace market segmentation assists to determine the prevailing market opportunities.
●Major countries in each region are mapped according to their revenue contribution to the global market.
●Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
●The report includes the analysis of the regional as well as global semiconductor in military and aerospace market trends, key players, market segments, application areas, and market growth strategies.

Key Market Segments

By Component
● Sensors
● Memory
● Opto Electronics
● Logic
● Micro
● Analog
● Others

By Technology
● Surface Mount Technology
● Through-Hole Technology

By End Use
● Military
● Aerospace

By Application
● Communication, Navigation, Global Positioning System (GPS) and Surveillance
● Imaging, Radar and Earth Observation
● Munitions
● Others

By Region
● North America
○ U.S.
○ Canada
○ Mexico
● Europe
○ UK
○ Germany
○ France
○ Italy
○ Rest of Europe
● Asia-Pacific
○ China
○ Japan
○ India
○ South Korea
○ Rest of Asia-Pacific
● LAMEA
○ Latin America
○ Middle East
○ Africa

● Key Market Players
○ Analog Devices, Inc.
○ Infineon Technologies AG
○ Microchip Technology Inc.
○ Northrop Grumman Corporation
○ NXP Semiconductors NV
○ ON Semiconductor Corporation
○ Raytheon Technologies Corporation
○ Teledyne Technologies Inc.
○ Texas Instruments Incorporated
○ Advanced Micro Devices Inc.(Xilinx Inc.)

❖ レポートの目次 ❖

CHAPTER 1: INTRODUCTION
1.1. Report description
1.2. Key market segments
1.3. Key benefits to the stakeholders
1.4. Research Methodology
1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models
CHAPTER 2: EXECUTIVE SUMMARY
2.1. CXO Perspective
CHAPTER 3: MARKET OVERVIEW
3.1. Market definition and scope
3.2. Key findings
3.2.1. Top impacting factors
3.2.2. Top investment pockets
3.3. Porter’s five forces analysis
3.3.1. Moderate bargaining power of suppliers
3.3.2. Moderate bargaining power of buyers
3.3.3. Moderate threat of substitutes
3.3.4. High threat of new entrants
3.3.5. High intensity of rivalry
3.4. Market dynamics
3.4.1. Drivers
3.4.1.1. Rise in military expenditure
3.4.1.2. Rise in aircraft upgradation & modernization programs
3.4.1.3. Use of radiation tolerant semiconductor components

3.4.2. Restraints
3.4.2.1. Scarcity of semiconductors

3.4.3. Opportunities
3.4.3.1. Growth in investments by several governments in space technology
3.4.3.2. Defense modernization

3.5. COVID-19 Impact Analysis on the market
CHAPTER 4: SEMICONDUCTOR IN MILITARY AND AEROSPACE MARKET, BY COMPONENT
4.1. Overview
4.1.1. Market size and forecast
4.2. Sensors
4.2.1. Key market trends, growth factors and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market share analysis by country
4.3. Memory
4.3.1. Key market trends, growth factors and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market share analysis by country
4.4. Opto Electronics
4.4.1. Key market trends, growth factors and opportunities
4.4.2. Market size and forecast, by region
4.4.3. Market share analysis by country
4.5. Logic
4.5.1. Key market trends, growth factors and opportunities
4.5.2. Market size and forecast, by region
4.5.3. Market share analysis by country
4.6. Micro
4.6.1. Key market trends, growth factors and opportunities
4.6.2. Market size and forecast, by region
4.6.3. Market share analysis by country
4.7. Analog
4.7.1. Key market trends, growth factors and opportunities
4.7.2. Market size and forecast, by region
4.7.3. Market share analysis by country
4.8. Others
4.8.1. Key market trends, growth factors and opportunities
4.8.2. Market size and forecast, by region
4.8.3. Market share analysis by country
CHAPTER 5: SEMICONDUCTOR IN MILITARY AND AEROSPACE MARKET, BY TECHNOLOGY
5.1. Overview
5.1.1. Market size and forecast
5.2. Surface Mount Technology
5.2.1. Key market trends, growth factors and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market share analysis by country
5.3. Through-Hole Technology
5.3.1. Key market trends, growth factors and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market share analysis by country
CHAPTER 6: SEMICONDUCTOR IN MILITARY AND AEROSPACE MARKET, BY END USE
6.1. Overview
6.1.1. Market size and forecast
6.2. Military
6.2.1. Key market trends, growth factors and opportunities
6.2.2. Market size and forecast, by region
6.2.3. Market share analysis by country
6.3. Aerospace
6.3.1. Key market trends, growth factors and opportunities
6.3.2. Market size and forecast, by region
6.3.3. Market share analysis by country
CHAPTER 7: SEMICONDUCTOR IN MILITARY AND AEROSPACE MARKET, BY APPLICATION
7.1. Overview
7.1.1. Market size and forecast
7.2. Communication, Navigation, Global Positioning System (GPS) and Surveillance
7.2.1. Key market trends, growth factors and opportunities
7.2.2. Market size and forecast, by region
7.2.3. Market share analysis by country
7.3. Imaging, Radar and Earth Observation
7.3.1. Key market trends, growth factors and opportunities
7.3.2. Market size and forecast, by region
7.3.3. Market share analysis by country
7.4. Munitions
7.4.1. Key market trends, growth factors and opportunities
7.4.2. Market size and forecast, by region
7.4.3. Market share analysis by country
7.5. Others
7.5.1. Key market trends, growth factors and opportunities
7.5.2. Market size and forecast, by region
7.5.3. Market share analysis by country
CHAPTER 8: SEMICONDUCTOR IN MILITARY AND AEROSPACE MARKET, BY REGION
8.1. Overview
8.1.1. Market size and forecast By Region
8.2. North America
8.2.1. Key trends and opportunities
8.2.2. Market size and forecast, by Component
8.2.3. Market size and forecast, by Technology
8.2.4. Market size and forecast, by End Use
8.2.5. Market size and forecast, by Application
8.2.6. Market size and forecast, by country
8.2.6.1. U.S.
8.2.6.1.1. Key market trends, growth factors and opportunities
8.2.6.1.2. Market size and forecast, by Component
8.2.6.1.3. Market size and forecast, by Technology
8.2.6.1.4. Market size and forecast, by End Use
8.2.6.1.5. Market size and forecast, by Application
8.2.6.2. Canada
8.2.6.2.1. Key market trends, growth factors and opportunities
8.2.6.2.2. Market size and forecast, by Component
8.2.6.2.3. Market size and forecast, by Technology
8.2.6.2.4. Market size and forecast, by End Use
8.2.6.2.5. Market size and forecast, by Application
8.2.6.3. Mexico
8.2.6.3.1. Key market trends, growth factors and opportunities
8.2.6.3.2. Market size and forecast, by Component
8.2.6.3.3. Market size and forecast, by Technology
8.2.6.3.4. Market size and forecast, by End Use
8.2.6.3.5. Market size and forecast, by Application
8.3. Europe
8.3.1. Key trends and opportunities
8.3.2. Market size and forecast, by Component
8.3.3. Market size and forecast, by Technology
8.3.4. Market size and forecast, by End Use
8.3.5. Market size and forecast, by Application
8.3.6. Market size and forecast, by country
8.3.6.1. UK
8.3.6.1.1. Key market trends, growth factors and opportunities
8.3.6.1.2. Market size and forecast, by Component
8.3.6.1.3. Market size and forecast, by Technology
8.3.6.1.4. Market size and forecast, by End Use
8.3.6.1.5. Market size and forecast, by Application
8.3.6.2. Germany
8.3.6.2.1. Key market trends, growth factors and opportunities
8.3.6.2.2. Market size and forecast, by Component
8.3.6.2.3. Market size and forecast, by Technology
8.3.6.2.4. Market size and forecast, by End Use
8.3.6.2.5. Market size and forecast, by Application
8.3.6.3. France
8.3.6.3.1. Key market trends, growth factors and opportunities
8.3.6.3.2. Market size and forecast, by Component
8.3.6.3.3. Market size and forecast, by Technology
8.3.6.3.4. Market size and forecast, by End Use
8.3.6.3.5. Market size and forecast, by Application
8.3.6.4. Italy
8.3.6.4.1. Key market trends, growth factors and opportunities
8.3.6.4.2. Market size and forecast, by Component
8.3.6.4.3. Market size and forecast, by Technology
8.3.6.4.4. Market size and forecast, by End Use
8.3.6.4.5. Market size and forecast, by Application
8.3.6.5. Rest of Europe
8.3.6.5.1. Key market trends, growth factors and opportunities
8.3.6.5.2. Market size and forecast, by Component
8.3.6.5.3. Market size and forecast, by Technology
8.3.6.5.4. Market size and forecast, by End Use
8.3.6.5.5. Market size and forecast, by Application
8.4. Asia-Pacific
8.4.1. Key trends and opportunities
8.4.2. Market size and forecast, by Component
8.4.3. Market size and forecast, by Technology
8.4.4. Market size and forecast, by End Use
8.4.5. Market size and forecast, by Application
8.4.6. Market size and forecast, by country
8.4.6.1. China
8.4.6.1.1. Key market trends, growth factors and opportunities
8.4.6.1.2. Market size and forecast, by Component
8.4.6.1.3. Market size and forecast, by Technology
8.4.6.1.4. Market size and forecast, by End Use
8.4.6.1.5. Market size and forecast, by Application
8.4.6.2. Japan
8.4.6.2.1. Key market trends, growth factors and opportunities
8.4.6.2.2. Market size and forecast, by Component
8.4.6.2.3. Market size and forecast, by Technology
8.4.6.2.4. Market size and forecast, by End Use
8.4.6.2.5. Market size and forecast, by Application
8.4.6.3. India
8.4.6.3.1. Key market trends, growth factors and opportunities
8.4.6.3.2. Market size and forecast, by Component
8.4.6.3.3. Market size and forecast, by Technology
8.4.6.3.4. Market size and forecast, by End Use
8.4.6.3.5. Market size and forecast, by Application
8.4.6.4. South Korea
8.4.6.4.1. Key market trends, growth factors and opportunities
8.4.6.4.2. Market size and forecast, by Component
8.4.6.4.3. Market size and forecast, by Technology
8.4.6.4.4. Market size and forecast, by End Use
8.4.6.4.5. Market size and forecast, by Application
8.4.6.5. Rest of Asia-Pacific
8.4.6.5.1. Key market trends, growth factors and opportunities
8.4.6.5.2. Market size and forecast, by Component
8.4.6.5.3. Market size and forecast, by Technology
8.4.6.5.4. Market size and forecast, by End Use
8.4.6.5.5. Market size and forecast, by Application
8.5. LAMEA
8.5.1. Key trends and opportunities
8.5.2. Market size and forecast, by Component
8.5.3. Market size and forecast, by Technology
8.5.4. Market size and forecast, by End Use
8.5.5. Market size and forecast, by Application
8.5.6. Market size and forecast, by country
8.5.6.1. Latin America
8.5.6.1.1. Key market trends, growth factors and opportunities
8.5.6.1.2. Market size and forecast, by Component
8.5.6.1.3. Market size and forecast, by Technology
8.5.6.1.4. Market size and forecast, by End Use
8.5.6.1.5. Market size and forecast, by Application
8.5.6.2. Middle East
8.5.6.2.1. Key market trends, growth factors and opportunities
8.5.6.2.2. Market size and forecast, by Component
8.5.6.2.3. Market size and forecast, by Technology
8.5.6.2.4. Market size and forecast, by End Use
8.5.6.2.5. Market size and forecast, by Application
8.5.6.3. Africa
8.5.6.3.1. Key market trends, growth factors and opportunities
8.5.6.3.2. Market size and forecast, by Component
8.5.6.3.3. Market size and forecast, by Technology
8.5.6.3.4. Market size and forecast, by End Use
8.5.6.3.5. Market size and forecast, by Application
CHAPTER 9: COMPETITIVE LANDSCAPE
9.1. Introduction
9.2. Top winning strategies
9.3. Product Mapping of Top 10 Player
9.4. Competitive Dashboard
9.5. Competitive Heatmap
9.6. Top player positioning, 2021
CHAPTER 10: COMPANY PROFILES
10.1. Analog Devices, Inc.
10.1.1. Company overview
10.1.2. Key Executives
10.1.3. Company snapshot
10.1.4. Operating business segments
10.1.5. Product portfolio
10.1.6. Business performance
10.2. Infineon Technologies AG
10.2.1. Company overview
10.2.2. Key Executives
10.2.3. Company snapshot
10.2.4. Operating business segments
10.2.5. Product portfolio
10.2.6. Business performance
10.2.7. Key strategic moves and developments
10.3. Microchip Technology Inc.
10.3.1. Company overview
10.3.2. Key Executives
10.3.3. Company snapshot
10.3.4. Operating business segments
10.3.5. Product portfolio
10.3.6. Business performance
10.3.7. Key strategic moves and developments
10.4. Northrop Grumman Corporation
10.4.1. Company overview
10.4.2. Key Executives
10.4.3. Company snapshot
10.4.4. Operating business segments
10.4.5. Product portfolio
10.4.6. Business performance
10.5. NXP Semiconductors NV
10.5.1. Company overview
10.5.2. Key Executives
10.5.3. Company snapshot
10.5.4. Operating business segments
10.5.5. Product portfolio
10.5.6. Business performance
10.6. ON Semiconductor Corporation
10.6.1. Company overview
10.6.2. Key Executives
10.6.3. Company snapshot
10.6.4. Operating business segments
10.6.5. Product portfolio
10.6.6. Business performance
10.7. Raytheon Technologies Corporation
10.7.1. Company overview
10.7.2. Key Executives
10.7.3. Company snapshot
10.7.4. Operating business segments
10.7.5. Product portfolio
10.7.6. Business performance
10.8. Teledyne Technologies Inc.
10.8.1. Company overview
10.8.2. Key Executives
10.8.3. Company snapshot
10.8.4. Operating business segments
10.8.5. Product portfolio
10.8.6. Business performance
10.8.7. Key strategic moves and developments
10.9. Texas Instruments Incorporated
10.9.1. Company overview
10.9.2. Key Executives
10.9.3. Company snapshot
10.9.4. Operating business segments
10.9.5. Product portfolio
10.9.6. Business performance
10.10. Advanced Micro Devices Inc.(Xilinx Inc.)
10.10.1. Company overview
10.10.2. Key Executives
10.10.3. Company snapshot
10.10.4. Operating business segments
10.10.5. Product portfolio
10.10.6. Business performance
10.10.7. Key strategic moves and developments

★調査レポート[世界の軍事＆航空宇宙における半導体市場2021年-2031年：コンポーネント別（センサー、メモリー、オプトエレクトロニクス、ロジック、マイクロ、アナログ、その他）、技術別（表面実装技術、スルーホール技術）、エンドユーザー別（軍事、航空宇宙）、用途別（通信、ナビゲーション、GPS＆監視、イメージング、レーダー＆地球観測、軍需品、その他）] (コード：ALD23MA009)販売に関する免責事項を必ずご確認ください。

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