1 エグゼクティブ・サマリー
2 序文
2.1 概要
2.2 ステークホルダー
2.3 調査範囲
2.4 調査方法
2.4.1 データマイニング
2.4.2 データ分析
2.4.3 データの検証
2.4.4 リサーチアプローチ
2.5 リサーチソース
2.5.1 一次調査ソース
2.5.2 セカンダリーリサーチソース
2.5.3 前提条件
3 市場動向分析
3.1 はじめに
3.2 推進要因
3.3 抑制要因
3.4 機会
3.5 脅威
3.6 技術分析
3.7 アプリケーション分析
3.8 エンドユーザー分析
3.9 新興市場
3.10 Covid-19の影響
4 ポーターズファイブフォース分析
4.1 供給者の交渉力
4.2 買い手の交渉力
4.3 代替品の脅威
4.4 新規参入の脅威
4.5 競争上のライバル関係
5 半導体ボンディングの世界市場、タイプ別
5.1 はじめに
5.2 ワイヤーボンディング
5.3 フリップチップボンディング
5.4 バンプボンディング
5.5 インターポーザーボンディング
5.6 その他のタイプ
6 半導体ボンディングの世界市場、材料別
6.1 はじめに
6.2 金
6.3 アルミニウム
6.4 はんだ
6.5 導電性接着剤
6.6 その他の材料
7 半導体ボンディングの世界市場、プロセス別
7.1 はじめに
7.2 ダイ間ボンディング
7.3 ダイ-ウエハ接合
7.4 ウェーハ間ボンディング
7.5 その他のプロセス
8 半導体ボンディングの世界市場、技術別
8.1 導入
8.2 熱圧着ボンディング
8.3 接着剤ボンディング
8.4 はんだ接合
8.5 ハイブリッドボンディング
8.6 その他の技術
9 半導体ボンディングの世界市場、用途別
9.1 はじめに
9.2 メモリデバイス
9.3 RFデバイス
9.4 CMOSイメージセンサー
9.5 LED
9.6 MEMSデバイス
9.7 ディスクリート部品
9.8 集積回路（IC）
9.9 その他の用途
10 半導体ボンディングの世界市場：エンドユーザー別
10.1 はじめに
10.2 半導体メーカー
10.3 医療機器メーカー
10.4 自動車メーカー
10.5 航空宇宙・防衛
10.6 通信機器
10.7 研究機関
10.8 その他のエンドユーザー
11 半導体ボンディングの世界市場：地域別
11.1 はじめに
11.2 北米
11.2.1 アメリカ
11.2.2 カナダ
11.2.3 メキシコ
11.3 ヨーロッパ
11.3.1 ドイツ
11.3.2 イギリス
11.3.3 イタリア
11.3.4 フランス
11.3.5 スペイン
11.3.6 その他のヨーロッパ
11.4 アジア太平洋
11.4.1 日本
11.4.2 中国
11.4.3 インド
11.4.4 オーストラリア
11.4.5 ニュージーランド
11.4.6 韓国
11.4.7 その他のアジア太平洋地域
11.5 南米
11.5.1 アルゼンチン
11.5.2 ブラジル
11.5.3 チリ
11.5.4 その他の南米地域
11.6 中東・アフリカ
11.6.1 サウジアラビア
11.6.2 アラブ首長国連邦
11.6.3 カタール
11.6.4 南アフリカ
11.6.5 その他の中東・アフリカ地域
12 主要開発
12.1 契約、パートナーシップ、提携、合弁事業
12.2 買収と合併
12.3 新製品上市
12.4 拡張
12.5 その他の主要戦略
13 企業プロフィール
EV Group
ASMPT Semiconductor Solutions
MRSI Systems.
WestBond Inc.
Panasonic Holding Corporation
Palomar Technologies
Dr. Tresky AG
BE Semiconductor Industries NV
Fasford Technology Co.Ltd
Kulicke and Soffa Industries Inc.
DIAS Automation
Shibaura Mechatronics Corporation
SUSS MicroTec SE
Tokyo Electron Limited
Intel Corporation
Kulicke and Soffa Industries, Inc. and TDK Corporation.
表一覧
表1 半導体ボンディングの世界市場展望、地域別 (2022-2030) ($MN)
表2 半導体ボンディングの世界市場展望、タイプ別 (2022-2030) ($MN)
表3 半導体ボンディングの世界市場展望、ワイヤボンディング別 (2022-2030) ($MN)
表4 半導体ボンディングの世界市場展望、フリップチップボンディング別 (2022-2030) ($MN)
表5 半導体ボンディングの世界市場展望、バンプボンディング別 (2022-2030) ($MN)
表6 半導体ボンディングの世界市場展望、インターポーザボンディング別 (2022-2030) ($MN)
表7 半導体ボンディングの世界市場展望、その他のタイプ別 (2022-2030) ($MN)
表8 半導体ボンディングの世界市場展望、材料別 (2022-2030) ($MN)
表9 半導体ボンディングの世界市場展望、金別 (2022-2030) ($MN)
表10 半導体ボンディングの世界市場展望、アルミニウム別 (2022-2030) ($MN)
表11 半導体ボンディングの世界市場展望、はんだ別 (2022-2030) ($MN)
表12 半導体ボンディングの世界市場展望、導電性接着剤別 (2022-2030) ($MN)
表13 半導体ボンディングの世界市場展望、その他の材料別 (2022-2030) ($MN)
表14 半導体ボンディングの世界市場展望、プロセス別 (2022-2030) ($MN)
表15 半導体ボンディングの世界市場展望、ダイ間ボンディング別 (2022-2030) ($MN)
表16 半導体ボンディングの世界市場展望、ダイ・ツー・ウェーハボンディング別 (2022-2030) ($MN)
表17 半導体ボンディングの世界市場展望、ウェーハ間ボンディング別 (2022-2030) ($MN)
表18 半導体ボンディングの世界市場展望、その他のプロセス別 (2022-2030) ($MN)
表19 半導体ボンディングの世界市場展望、技術別 (2022-2030) ($MN)
表20 半導体ボンディングの世界市場展望、熱圧着別 (2022-2030) ($MN)
表21 半導体ボンディングの世界市場展望、接着剤ボンディング別 (2022-2030) ($MN)
表22 半導体ボンディングの世界市場展望、はんだボンディング別 (2022-2030) ($MN)
表23 半導体ボンディングの世界市場展望、ハイブリッドボンディング別 (2022-2030) ($MN)
表24 半導体ボンディングの世界市場展望、その他の技術別 (2022-2030) ($MN)
表25 半導体ボンディングの世界市場展望、用途別 (2022-2030) ($MN)
表26 半導体ボンディングの世界市場展望、メモリデバイス別 (2022-2030) ($MN)
表27 半導体ボンディングの世界市場展望、RFデバイス別 (2022-2030) ($MN)
表28 半導体ボンディングの世界市場展望、CMOSイメージセンサ別 (2022-2030) ($MN)
表29 半導体ボンディングの世界市場展望、LED別 (2022-2030) ($MN)
表30 半導体ボンディングの世界市場展望、MEMSデバイス別 (2022-2030) ($MN)
表31 半導体ボンディングの世界市場展望、ディスクリートコンポーネント別 (2022-2030) ($MN)
表32 半導体ボンディングの世界市場展望：集積回路(IC)別 (2022-2030) ($MN)
表33 半導体ボンディングの世界市場展望、その他の用途別 (2022-2030) ($MN)
表34 半導体ボンディングの世界市場展望、エンドユーザー別 (2022-2030) ($MN)
表35 半導体ボンディングの世界市場展望、半導体メーカー別 (2022-2030) ($MN)
表36 半導体ボンディングの世界市場展望、医療機器メーカー別 (2022-2030) ($MN)
表37 半導体ボンディングの世界市場展望、自動車メーカー別 (2022-2030) ($MN)
表38 半導体ボンディングの世界市場展望、航空宇宙・防衛別 (2022-2030) ($MN)
表39 半導体ボンディングの世界市場展望、通信機器別 (2022-2030) ($MN)
表40 半導体ボンディングの世界市場展望、研究機関別 (2022-2030) ($MN)
表41 半導体ボンディングの世界市場展望：その他のエンドユーザー別 (2022-2030) ($MN)
注：北米、ヨーロッパ、APAC、南米、中東・アフリカ地域の表も上記と同様に表記しています。
Market Dynamics:
Driver:
Increasing demand from various industries
The market is experiencing growing demand across various industries, including consumer electronics, automotive, and telecommunications. As the need for advanced electronic devices rises, driven by trends like 5G, IoT, and electric vehicles, the demand for efficient and reliable semiconductor connections intensifies. This surge propels innovations in bonding technologies, enabling manufacturers to meet performance requirements and enhance the functionality of increasingly compact and powerful electronic systems.
Restraint:
Shortage of skilled labor
The shortage of skilled labor in the market poses significant challenges, hindering production efficiency and innovation. With a lack of trained technicians and engineers, companies may struggle to maintain quality standards, leading to increased defect rates in semiconductor devices. This workforce gap can slow down the development of advanced technologies and delay project timelines, ultimately impacting competitiveness and the ability to meet the rising demand for sophisticated electronic products in various industries.
Opportunity:
Shift towards electric vehicles (EVs)
The shift towards electric vehicles (EVs) is driving substantial growth in the market, as these vehicles require advanced electronic systems for battery management, power distribution, and infotainment. This transition increases the demand for reliable semiconductor connections that ensure safety, efficiency, and performance. Consequently, manufacturers are investing in innovative bonding technologies to meet the specific needs of EV applications, fostering advancements that enhance the functionality and reliability of electric vehicle components.
Threat:
High production costs
High production costs in the market can significantly impact profitability and competitiveness for manufacturers. These elevated expenses may stem from advanced materials, intricate bonding techniques. As a result, companies may struggle to maintain affordable pricing for their products, limiting market accessibility and reducing overall demand. This financial strain can also hinder investment in research and development, stalling innovation and advancements in bonding technologies critical for future growth.
Covid-19 Impact:
The COVID-19 pandemic had a profound impact on the market, disrupting supply chains and causing delays in production. Lockdowns and labor shortages led to reduced manufacturing capacity, while increased demand for electronics in remote work and healthcare applications strained resources. Additionally, semiconductor shortages emerged, affecting various industries reliant on bonded components. These challenges highlighted the need for greater resilience and flexibility in semiconductor manufacturing processes and supply chain management.
The flip chip bonding segment is projected to be the largest during the forecast period
The flip chip bonding segment is projected to account for the largest market share during the projection period. This method enhances electrical performance and thermal management, enabling compact designs in high-performance applications such as smartphones, computers, and automotive electronics. As demand for miniaturization and efficiency grows, flip chip bonding continues to gain prominence, driving innovations that support the evolving needs of modern electronic devices.
The automotives segment is expected to have the highest CAGR during the forecast period
The automotives segment is expected to have the highest CAGR during the extrapolated period. As automakers integrate technologies like driver assistance, infotainment, and electric powertrains, reliable semiconductor bonding becomes essential for performance and safety. This trend is accelerating the adoption of innovative bonding techniques, enabling manufacturers to produce smaller, more efficient components that meet the rigorous standards required for modern automotive applications and electric vehicles.
Region with largest share:
North America region is projected to account for the largest market share during the forecast period fueled by advancements in technology. Key drivers include the rising adoption of 5G, automotive electronics, and IoT applications. Major companies are investing in innovative bonding techniques to enhance performance and efficiency. Additionally, the region benefits from a strong research and development ecosystem, fostering collaboration and innovation within the semiconductor industry to address evolving market needs.
Region with highest CAGR:
Asia Pacific is expected to register the highest growth rate over the forecast period. The increasing adoption of technologies such as IoT, AI, and 5G is significantly boosting demand for advanced semiconductor bonding techniques. These technologies require high-performance chips that depend on efficient bonding processes. The rise in electric vehicle production is a major driver, as these vehicles require sophisticated semiconductor components for power management and efficiency.
Key players in the market
Some of the key players in Semiconductor Bonding market include EV Group, ASMPT Semiconductor Solutions, MRSI Systems., WestBond Inc., Panasonic Holding Corporation, Palomar Technologies, Dr. Tresky AG, BE Semiconductor Industries NV, Fasford Technology Co.Ltd , Kulicke and Soffa Industries Inc., DIAS Automation, Shibaura Mechatronics Corporation, SUSS MicroTec SE, Tokyo Electron Limited, Intel Corporation, Kulicke and Soffa Industries, Inc. and TDK Corporation.
Key Developments:
In March 2024, TANAKA Kikinzoku Kogyo K.K., a leading company in the precious metals industry, recently pioneered the semiconductor bonding field by developing a gold particle bonding technology. This innovative method utilizes AuRoFUSE, a specialized low-temperature fired paste, to facilitate gold-to-gold bonding in high-density semiconductor mounting applications.
In December 2023, Tokyo Electron Kyushu developed an Extreme Laser Lift Off (XLO) technology. This cutting-edge approach is set to revolutionize the field of 3D integration for advanced semiconductor devices that utilize permanent wafer bonding.
Types Covered:
• Wire Bonding
• Flip Chip Bonding
• Bump Bonding
• Interposer Bonding
• Other Types
Materials Covered:
• Gold
• Aluminum
• Solder
• Conductive Adhesives
• Other Materials
Processes Covered:
• Die-to-Die Bonding
• Die-to-Wafer Bonding
• Wafer-to-Wafer Bonding
• Other Processes
Technologies Covered:
• Thermo-Compression Bonding
• Adhesive Bonding
• Solder Bonding
• Hybrid Bonding
• Other Technologies
Applications Covered:
• Memory Devices
• RF Devices
• CMOS Image Sensors
• LED
• MEMS Devices
• Discrete Components
• Integrated Circuits (ICs)
• Other Applications
End Users Covered:
• Semiconductor Manufacturers
• Medical Device Manufacturers
• Automotives
• Aerospace & Defense
• Telecommunications Equipments
• Research Institutions
• Other End Users
Regions Covered:
• North America
US
Canada
Mexico
• Europe
Germany
UK
Italy
France
Spain
Rest of Europe
• Asia Pacific
Japan
China
India
Australia
New Zealand
South Korea
Rest of Asia Pacific
• South America
Argentina
Brazil
Chile
Rest of South America
• Middle East & Africa
Saudi Arabia
UAE
Qatar
South Africa
Rest of Middle East & Africa
What our report offers:
- Market share assessments for the regional and country-level segments
- Strategic recommendations for the new entrants
- Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
- Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
- Strategic recommendations in key business segments based on the market estimations
- Competitive landscaping mapping the key common trends
- Company profiling with detailed strategies, financials, and recent developments
- Supply chain trends mapping the latest technological advancements
1 Executive Summary
2 Preface
2.1 Abstract
2.2 Stake Holders
2.3 Research Scope
2.4 Research Methodology
2.4.1 Data Mining
2.4.2 Data Analysis
2.4.3 Data Validation
2.4.4 Research Approach
2.5 Research Sources
2.5.1 Primary Research Sources
2.5.2 Secondary Research Sources
2.5.3 Assumptions
3 Market Trend Analysis
3.1 Introduction
3.2 Drivers
3.3 Restraints
3.4 Opportunities
3.5 Threats
3.6 Technology Analysis
3.7 Application Analysis
3.8 End User Analysis
3.9 Emerging Markets
3.10 Impact of Covid-19
4 Porters Five Force Analysis
4.1 Bargaining power of suppliers
4.2 Bargaining power of buyers
4.3 Threat of substitutes
4.4 Threat of new entrants
4.5 Competitive rivalry
5 Global Semiconductor Bonding Market, By Type
5.1 Introduction
5.2 Wire Bonding
5.3 Flip Chip Bonding
5.4 Bump Bonding
5.5 Interposer Bonding
5.6 Other Types
6 Global Semiconductor Bonding Market, By Material
6.1 Introduction
6.2 Gold
6.3 Aluminum
6.4 Solder
6.5 Conductive Adhesives
6.6 Other Materials
7 Global Semiconductor Bonding Market, By Process
7.1 Introduction
7.2 Die-to-Die Bonding
7.3 Die-to-Wafer Bonding
7.4 Wafer-to-Wafer Bonding
7.5 Other Processes
8 Global Semiconductor Bonding Market, By Technology
8.1 Introduction
8.2 Thermo-Compression Bonding
8.3 Adhesive Bonding
8.4 Solder Bonding
8.5 Hybrid Bonding
8.6 Other Technologies
9 Global Semiconductor Bonding Market, By Application
9.1 Introduction
9.2 Memory Devices
9.3 RF Devices
9.4 CMOS Image Sensors
9.5 LED
9.6 MEMS Devices
9.7 Discrete Components
9.8 Integrated Circuits (ICs)
9.9 Other Applications
10 Global Semiconductor Bonding Market, By End User
10.1 Introduction
10.2 Semiconductor Manufacturers
10.3 Medical Device Manufacturers
10.4 Automotives
10.5 Aerospace & Defense
10.6 Telecommunications Equipments
10.7 Research Institutions
10.8 Other End Users
11 Global Semiconductor Bonding Market, By Geography
11.1 Introduction
11.2 North America
11.2.1 US
11.2.2 Canada
11.2.3 Mexico
11.3 Europe
11.3.1 Germany
11.3.2 UK
11.3.3 Italy
11.3.4 France
11.3.5 Spain
11.3.6 Rest of Europe
11.4 Asia Pacific
11.4.1 Japan
11.4.2 China
11.4.3 India
11.4.4 Australia
11.4.5 New Zealand
11.4.6 South Korea
11.4.7 Rest of Asia Pacific
11.5 South America
11.5.1 Argentina
11.5.2 Brazil
11.5.3 Chile
11.5.4 Rest of South America
11.6 Middle East & Africa
11.6.1 Saudi Arabia
11.6.2 UAE
11.6.3 Qatar
11.6.4 South Africa
11.6.5 Rest of Middle East & Africa
12 Key Developments
12.1 Agreements, Partnerships, Collaborations and Joint Ventures
12.2 Acquisitions & Mergers
12.3 New Product Launch
12.4 Expansions
12.5 Other Key Strategies
13 Company Profiling
13.1 EV Group
13.2 ASMPT Semiconductor Solutions
13.3 MRSI Systems.
13.4 WestBond Inc.
13.5 Panasonic Holding Corporation
13.6 Palomar Technologies
13.7 Dr. Tresky AG
13.8 BE Semiconductor Industries NV
13.9 Fasford Technology Co.Ltd
13.10 Kulicke and Soffa Industries Inc.
13.11 DIAS Automation
13.12 Shibaura Mechatronics Corporation
13.13 SUSS MicroTec SE
13.14 Tokyo Electron Limited
13.15 Intel Corporation
13.16 Kulicke and Soffa Industries, Inc.
13.17 TDK Corporation
List of Tables
Table 1 Global Semiconductor Bonding Market Outlook, By Region (2022-2030) ($MN)
Table 2 Global Semiconductor Bonding Market Outlook, By Type (2022-2030) ($MN)
Table 3 Global Semiconductor Bonding Market Outlook, By Wire Bonding (2022-2030) ($MN)
Table 4 Global Semiconductor Bonding Market Outlook, By Flip Chip Bonding (2022-2030) ($MN)
Table 5 Global Semiconductor Bonding Market Outlook, By Bump Bonding (2022-2030) ($MN)
Table 6 Global Semiconductor Bonding Market Outlook, By Interposer Bonding (2022-2030) ($MN)
Table 7 Global Semiconductor Bonding Market Outlook, By Other Types (2022-2030) ($MN)
Table 8 Global Semiconductor Bonding Market Outlook, By Material (2022-2030) ($MN)
Table 9 Global Semiconductor Bonding Market Outlook, By Gold (2022-2030) ($MN)
Table 10 Global Semiconductor Bonding Market Outlook, By Aluminum (2022-2030) ($MN)
Table 11 Global Semiconductor Bonding Market Outlook, By Solder (2022-2030) ($MN)
Table 12 Global Semiconductor Bonding Market Outlook, By Conductive Adhesives (2022-2030) ($MN)
Table 13 Global Semiconductor Bonding Market Outlook, By Other Materials (2022-2030) ($MN)
Table 14 Global Semiconductor Bonding Market Outlook, By Process (2022-2030) ($MN)
Table 15 Global Semiconductor Bonding Market Outlook, By Die-to-Die Bonding (2022-2030) ($MN)
Table 16 Global Semiconductor Bonding Market Outlook, By Die-to-Wafer Bonding (2022-2030) ($MN)
Table 17 Global Semiconductor Bonding Market Outlook, By Wafer-to-Wafer Bonding (2022-2030) ($MN)
Table 18 Global Semiconductor Bonding Market Outlook, By Other Processes (2022-2030) ($MN)
Table 19 Global Semiconductor Bonding Market Outlook, By Technology (2022-2030) ($MN)
Table 20 Global Semiconductor Bonding Market Outlook, By Thermo-Compression Bonding (2022-2030) ($MN)
Table 21 Global Semiconductor Bonding Market Outlook, By Adhesive Bonding (2022-2030) ($MN)
Table 22 Global Semiconductor Bonding Market Outlook, By Solder Bonding (2022-2030) ($MN)
Table 23 Global Semiconductor Bonding Market Outlook, By Hybrid Bonding (2022-2030) ($MN)
Table 24 Global Semiconductor Bonding Market Outlook, By Other Technologies (2022-2030) ($MN)
Table 25 Global Semiconductor Bonding Market Outlook, By Application (2022-2030) ($MN)
Table 26 Global Semiconductor Bonding Market Outlook, By Memory Devices (2022-2030) ($MN)
Table 27 Global Semiconductor Bonding Market Outlook, By RF Devices (2022-2030) ($MN)
Table 28 Global Semiconductor Bonding Market Outlook, By CMOS Image Sensors (2022-2030) ($MN)
Table 29 Global Semiconductor Bonding Market Outlook, By LED (2022-2030) ($MN)
Table 30 Global Semiconductor Bonding Market Outlook, By MEMS Devices (2022-2030) ($MN)
Table 31 Global Semiconductor Bonding Market Outlook, By Discrete Components (2022-2030) ($MN)
Table 32 Global Semiconductor Bonding Market Outlook, By Integrated Circuits (ICs) (2022-2030) ($MN)
Table 33 Global Semiconductor Bonding Market Outlook, By Other Applications (2022-2030) ($MN)
Table 34 Global Semiconductor Bonding Market Outlook, By End User (2022-2030) ($MN)
Table 35 Global Semiconductor Bonding Market Outlook, By Semiconductor Manufacturers (2022-2030) ($MN)
Table 36 Global Semiconductor Bonding Market Outlook, By Medical Device Manufacturers (2022-2030) ($MN)
Table 37 Global Semiconductor Bonding Market Outlook, By Automotives (2022-2030) ($MN)
Table 38 Global Semiconductor Bonding Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
Table 39 Global Semiconductor Bonding Market Outlook, By Telecommunications Equipments (2022-2030) ($MN)
Table 40 Global Semiconductor Bonding Market Outlook, By Research Institutions (2022-2030) ($MN)
Table 41 Global Semiconductor Bonding Market Outlook, By Other End Users (2022-2030) ($MN)
Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.
