1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global SiC Wafer Thinning Equipment Annual Sales 2018-2029
2.1.2 World Current & Future Analysis for SiC Wafer Thinning Equipment by Geographic Region, 2018, 2022 & 2029
2.1.3 World Current & Future Analysis for SiC Wafer Thinning Equipment by Country/Region, 2018, 2022 & 2029
2.2 SiC Wafer Thinning Equipment Segment by Type
2.2.1 Full-Automatic
2.2.2 Semi-Automatic
2.3 SiC Wafer Thinning Equipment Sales by Type
2.3.1 Global SiC Wafer Thinning Equipment Sales Market Share by Type (2018-2023)
2.3.2 Global SiC Wafer Thinning Equipment Revenue and Market Share by Type (2018-2023)
2.3.3 Global SiC Wafer Thinning Equipment Sale Price by Type (2018-2023)
2.4 SiC Wafer Thinning Equipment Segment by Application
2.4.1 Less than 6 Inch
2.4.2 6 Inch and Above
2.5 SiC Wafer Thinning Equipment Sales by Application
2.5.1 Global SiC Wafer Thinning Equipment Sale Market Share by Application (2018-2023)
2.5.2 Global SiC Wafer Thinning Equipment Revenue and Market Share by Application (2018-2023)
2.5.3 Global SiC Wafer Thinning Equipment Sale Price by Application (2018-2023)
3 Global SiC Wafer Thinning Equipment by Company
3.1 Global SiC Wafer Thinning Equipment Breakdown Data by Company
3.1.1 Global SiC Wafer Thinning Equipment Annual Sales by Company (2018-2023)
3.1.2 Global SiC Wafer Thinning Equipment Sales Market Share by Company (2018-2023)
3.2 Global SiC Wafer Thinning Equipment Annual Revenue by Company (2018-2023)
3.2.1 Global SiC Wafer Thinning Equipment Revenue by Company (2018-2023)
3.2.2 Global SiC Wafer Thinning Equipment Revenue Market Share by Company (2018-2023)
3.3 Global SiC Wafer Thinning Equipment Sale Price by Company
3.4 Key Manufacturers SiC Wafer Thinning Equipment Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers SiC Wafer Thinning Equipment Product Location Distribution
3.4.2 Players SiC Wafer Thinning Equipment Products Offered
3.5 Market Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2018-2023)
3.6 New Products and Potential Entrants
3.7 Mergers & Acquisitions, Expansion
4 World Historic Review for SiC Wafer Thinning Equipment by Geographic Region
4.1 World Historic SiC Wafer Thinning Equipment Market Size by Geographic Region (2018-2023)
4.1.1 Global SiC Wafer Thinning Equipment Annual Sales by Geographic Region (2018-2023)
4.1.2 Global SiC Wafer Thinning Equipment Annual Revenue by Geographic Region (2018-2023)
4.2 World Historic SiC Wafer Thinning Equipment Market Size by Country/Region (2018-2023)
4.2.1 Global SiC Wafer Thinning Equipment Annual Sales by Country/Region (2018-2023)
4.2.2 Global SiC Wafer Thinning Equipment Annual Revenue by Country/Region (2018-2023)
4.3 Americas SiC Wafer Thinning Equipment Sales Growth
4.4 APAC SiC Wafer Thinning Equipment Sales Growth
4.5 Europe SiC Wafer Thinning Equipment Sales Growth
4.6 Middle East & Africa SiC Wafer Thinning Equipment Sales Growth
5 Americas
5.1 Americas SiC Wafer Thinning Equipment Sales by Country
5.1.1 Americas SiC Wafer Thinning Equipment Sales by Country (2018-2023)
5.1.2 Americas SiC Wafer Thinning Equipment Revenue by Country (2018-2023)
5.2 Americas SiC Wafer Thinning Equipment Sales by Type
5.3 Americas SiC Wafer Thinning Equipment Sales by Application
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC SiC Wafer Thinning Equipment Sales by Region
6.1.1 APAC SiC Wafer Thinning Equipment Sales by Region (2018-2023)
6.1.2 APAC SiC Wafer Thinning Equipment Revenue by Region (2018-2023)
6.2 APAC SiC Wafer Thinning Equipment Sales by Type
6.3 APAC SiC Wafer Thinning Equipment Sales by Application
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe SiC Wafer Thinning Equipment by Country
7.1.1 Europe SiC Wafer Thinning Equipment Sales by Country (2018-2023)
7.1.2 Europe SiC Wafer Thinning Equipment Revenue by Country (2018-2023)
7.2 Europe SiC Wafer Thinning Equipment Sales by Type
7.3 Europe SiC Wafer Thinning Equipment Sales by Application
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa SiC Wafer Thinning Equipment by Country
8.1.1 Middle East & Africa SiC Wafer Thinning Equipment Sales by Country (2018-2023)
8.1.2 Middle East & Africa SiC Wafer Thinning Equipment Revenue by Country (2018-2023)
8.2 Middle East & Africa SiC Wafer Thinning Equipment Sales by Type
8.3 Middle East & Africa SiC Wafer Thinning Equipment Sales by Application
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of SiC Wafer Thinning Equipment
10.3 Manufacturing Process Analysis of SiC Wafer Thinning Equipment
10.4 Industry Chain Structure of SiC Wafer Thinning Equipment
11 Marketing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 SiC Wafer Thinning Equipment Distributors
11.3 SiC Wafer Thinning Equipment Customer
12 World Forecast Review for SiC Wafer Thinning Equipment by Geographic Region
12.1 Global SiC Wafer Thinning Equipment Market Size Forecast by Region
12.1.1 Global SiC Wafer Thinning Equipment Forecast by Region (2024-2029)
12.1.2 Global SiC Wafer Thinning Equipment Annual Revenue Forecast by Region (2024-2029)
12.2 Americas Forecast by Country
12.3 APAC Forecast by Region
12.4 Europe Forecast by Country
12.5 Middle East & Africa Forecast by Country
12.6 Global SiC Wafer Thinning Equipment Forecast by Type
12.7 Global SiC Wafer Thinning Equipment Forecast by Application
13 Key Players Analysis
13.1 Disco
13.1.1 Disco Company Information
13.1.2 Disco SiC Wafer Thinning Equipment Product Portfolios and Specifications
13.1.3 Disco SiC Wafer Thinning Equipment Sales, Revenue, Price and Gross Margin (2018-2023)
13.1.4 Disco Main Business Overview
13.1.5 Disco Latest Developments
13.2 TOKYO SEIMITSU
13.2.1 TOKYO SEIMITSU Company Information
13.2.2 TOKYO SEIMITSU SiC Wafer Thinning Equipment Product Portfolios and Specifications
13.2.3 TOKYO SEIMITSU SiC Wafer Thinning Equipment Sales, Revenue, Price and Gross Margin (2018-2023)
13.2.4 TOKYO SEIMITSU Main Business Overview
13.2.5 TOKYO SEIMITSU Latest Developments
13.3 Okamoto Semiconductor Equipment Division
13.3.1 Okamoto Semiconductor Equipment Division Company Information
13.3.2 Okamoto Semiconductor Equipment Division SiC Wafer Thinning Equipment Product Portfolios and Specifications
13.3.3 Okamoto Semiconductor Equipment Division SiC Wafer Thinning Equipment Sales, Revenue, Price and Gross Margin (2018-2023)
13.3.4 Okamoto Semiconductor Equipment Division Main Business Overview
13.3.5 Okamoto Semiconductor Equipment Division Latest Developments
13.4 CETC
13.4.1 CETC Company Information
13.4.2 CETC SiC Wafer Thinning Equipment Product Portfolios and Specifications
13.4.3 CETC SiC Wafer Thinning Equipment Sales, Revenue, Price and Gross Margin (2018-2023)
13.4.4 CETC Main Business Overview
13.4.5 CETC Latest Developments
13.5 Koyo Machinery
13.5.1 Koyo Machinery Company Information
13.5.2 Koyo Machinery SiC Wafer Thinning Equipment Product Portfolios and Specifications
13.5.3 Koyo Machinery SiC Wafer Thinning Equipment Sales, Revenue, Price and Gross Margin (2018-2023)
13.5.4 Koyo Machinery Main Business Overview
13.5.5 Koyo Machinery Latest Developments
13.6 Revasum
13.6.1 Revasum Company Information
13.6.2 Revasum SiC Wafer Thinning Equipment Product Portfolios and Specifications
13.6.3 Revasum SiC Wafer Thinning Equipment Sales, Revenue, Price and Gross Margin (2018-2023)
13.6.4 Revasum Main Business Overview
13.6.5 Revasum Latest Developments
14 Research Findings and Conclusion
| ※参考情報 SiCウェーハ薄化装置は、シリコンカーバイド（SiC）ワッファの厚さを減少させるために使用される特殊な機械であり、半導体製造プロセスにおいて重要な役割を果たしています。SiCは高温や高電圧、さらには高周波数において優れた特性を持っており、パワーエレクトロニクスや電気自動車、再生可能エネルギーなどの分野で注目されています。そのため、SiCウェーハ薄化装置は、これらのデバイスをより効率的に製造するための重要な技術です。 SiCウェーハ薄化装置の定義としては、SiCウェーハを精密に薄くするために設計された機械であり、ゲージの精度や平坦度を確保しつつ、特定の厚さに仕上げることが求められます。これにより、デバイスの機能性や性能を向上させることが可能になります。 SiCウェーハ薄化装置の特徴は、まずその動作精度にあります。半導体製造プロセスにおいては、数ミクロン単位の精度が求められるため、装置は高い制御能力を持っています。また、SiCは非常に硬い材料であるため、薄化プロセスには特別な切削工具や技術が必要です。従来のシリコンウェーハとは異なり、SiCでは加工温度や切削条件を厳密に調整する必要があります。これは、ウェーハの損傷を最小限に抑え、均一な薄さを保つためです。 その種類については、一般的にSiCウェーハ薄化装置にはダイヤモンド研削機や化学機械研磨（CMP）装置が含まれます。ダイヤモンド研削機は、硬度の高いダイヤモンドを用いてSiCを削り取る装置であり、高い加工効率と長寿命の研磨具を使用することが特長です。一方、CMPは化学的なエッチングと物理的な研磨を同時に行うプロセスであり、平坦度や表面品質の向上に貢献します。これらの装置は、特定の製品要求や生産条件に基づいて選択されることが一般的です。 SiCウェーハ薄化装置の用途は多岐にわたります。主には、パワー半導体デバイスの製造に用いられます。高効率で電力損失の少ないSiCベースのデバイスは、電力変換や電動機制御、DC-DCコンバータなどに利用されています。また、電気自動車のパワーエレクトロニクスや再生可能エネルギーのインバータなどでも重要な役割を果たしています。このように、SiCウェーハ薄化装置は、次世代のエネルギー効率の高いデバイスを生産するために欠かせない存在となっております。 関連技術としては、薄化過程におけるプロセス制御や材料の特性解析技術が挙げられます。プロセス制御技術には、温度管理、圧力調整、スピード制御などが含まれ、これにより最適な加工条件を実現します。また、材料の特性を確認するための技術も重要であり、表面粗さの測定や厚さの均一性を評価するための非破壊検査技術なども活用されています。これに加え、SiC材料の品質保証のための解析技術や、次世代の製造プロセスを探求する研究開発も活発に行われています。 SiCウェーハ薄化装置はその特徴から、高精度で効率的な薄化プロセスを可能にする重要な機器です。そして、パワーエレクトロニクスや先進的なデバイスの製造に必要不可欠な技術として、今後も需要が高まることが予想されます。これに伴い、さらなる技術革新や研究開発が期待されており、SiCウェーハ薄化装置はますます重要な役割を果たすでしょう。 |
