カテゴリー：世界, 部品/材料, IMARC

世界の電子用接着剤市場予測2023年-2028年

【英語タイトル】Electronic Adhesives Market by Form (Paste, Solid, Liquid), Product Type (Electrically Conductive Adhesives, Thermally Conductive Adhesives, and Others), Resin Type (Epoxy, Silicone, Acrylics, PU, and Others), Application (Consumer Electronics, Computers and Servers, Industrial, Medical, Automotive, Communication, and Others), and Region 2023-2028
	・商品コード：IMARC23AP029 ・発行会社（調査会社）：IMARC ・発行日：2023年3月2日・ページ数：146 ・レポート言語：英語・レポート形式：PDF ・納品方法：Eメール・調査対象地域：グローバル・産業分野：材料

◆販売価格オプション（消費税別）

Single User	USD2,999 ⇒換算￥449,850	見積依頼/購入/質問フォーム
Five User	USD3,999 ⇒換算￥599,850	見積依頼/購入/質問フォーム
Enterprisewide	USD4,999 ⇒換算￥749,850	見積依頼/購入/質問フォーム

※販売価格オプションの説明
※お支払金額：換算金額（日本円）＋消費税
※納期：即日〜2営業日（3日以上かかる場合は別途表記又はご連絡）
※お支払方法：納品日＋5日以内に請求書を発行・送付（請求書発行日より2ヶ月以内に銀行振込、振込先：三菱UFJ銀行/H&Iグローバルリサーチ株式会社、支払期限と方法は調整可能）

❖ レポートの概要 ❖

IMARC社の本調査レポートでは、2022年に52億ドルであった世界の電子用接着剤市場規模が、2028年までに76億ドルに拡大し、予測期間中にCAGR6.2%で成長すると予想しています。本書は、電子用接着剤の世界市場を調査・分析し、序論、範囲・調査手法、エグゼクティブサマリー、イントロダクション、形状別（ペースト状、固形、液状）分析、製品別（導電性接着剤、熱伝導性接着剤、その他）分析、樹脂別（エポキシ、シリコーン、アクリル、PU、その他）分析、用途別（家電、コンピューター・サーバー、工業、医療、その他）分析、地域別（北米、アジア太平洋、ヨーロッパ、中南米、中東・アフリカ）分析、要因・制約・機会、バリューチェーン分析、ポーターズファイブフォース分析、価格分析、競争状況などの項目を整理しています。また、本書には、3M Company、Avery Dennison Corporation、Bondline Electronic Adhesives Inc.、Dow Inc.、Dymax Corporation、Evonik Industries AG、H.B. Fuller Company、Henkel Ag & Co. KGaA、Heraeus Holding、Huntsman Corporation、Master Bond Inc. Permabond LLCなどの企業情報が含まれています。
・序論
・範囲・調査手法
・エグゼクティブサマリー
・イントロダクション
・世界の電子用接着剤市場規模：形状別
- ペースト状接着剤の市場規模
- 固形接着剤の市場規模
- 液状接着剤の市場規模
・世界の電子用接着剤市場規模：製品別
- 導電性接着剤の市場規模
- 熱伝導性接着剤の市場規模
- その他の市場規模
・世界の電子用接着剤市場規模：樹脂別
- エポキシにおける市場規模
- シリコーンにおける市場規模
- アクリルにおける市場規模
- PUにおける市場規模
- その他における市場規模
・世界の電子用接着剤市場規模：用途別
- 家電における市場規模
- コンピューター・サーバーにおける市場規模
- 工業における市場規模
- 医療における市場規模
- その他における市場規模
・世界の電子用接着剤市場規模：地域別
- 北米の電子用接着剤市場規模
- アジア太平洋の電子用接着剤市場規模
- ヨーロッパの電子用接着剤市場規模
- 中南米の電子用接着剤市場規模
- 中東・アフリカの電子用接着剤市場規模
・要因・制約・機会
・バリューチェーン分析
・ポーターズファイブフォース分析
・価格分析
・競争状況

Market Overview:
The global electronic adhesives market size reached US$ 5.2 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 7.6 Billion by 2028, exhibiting a growth rate (CAGR) of 6.2% during 2023-2028. The increasing product utilization in the electronic industry significant growth in the automotive industry, and rising expenditure capacities of consumers represent some of the key factors driving the market.

Electronic adhesives are substances used for bonding and holding electrical components together. They provide a strong bond during electronics assembly while protecting components against potential damage. They are widely used in surface-mounting, assembling substrates on printed circuit boards (PCBs) and semiconductors, potting and encapsulations, and manufacturing and assembly of electronic circuits and products. Electronic adhesives are manufactured using polyurethanes, cyanoacrylate, polysulfide, silicones, and epoxies. They help to protect the circuit board from harmful environmental factors, including moisture, and corrosion. They improve the performance by providing excellent protection and layered security. As a result, electronic adhesives have applications across the consumer electronics, communications, industrial, medical, and automotive industries.

Electronic Adhesives Market Trends:
The rapidly growing electronics industry across the globe is one of the key factors creating a positive outlook for the market. In line with this, the increasing digitization and rising automobile sales with ease and security features via electronic systems are favoring the market growth. Additionally, the widespread product utilization in the automotive industry for collision avoidance systems, engine status displays, anti-theft systems, power electronic modules, and LED packaging is driving the market growth. Apart from this, the introduction of bio-based electronic adhesives that reduce carbon dioxide (CO2) emissions, increase operational efficiency, and promote a cleaner work environment is providing an impetus to the market growth. Moreover, the increasing expenditure capacities of consumers and the rising demand for smartphones and other electronic devices are acting as other growth-inducing factors. Along with this, the rising product application to manage the precision and protection of electronic components in display and telecommunication devices is providing a considerable boost to the market growth. Furthermore, the widespread product utilization in encapsulation and conformal coating applications due to the growing inclination toward the miniaturization of mobile devices, laptops, touchscreens, and displays is facilitating the market growth. Besides this, the increasing product application in medical devices, gadgets, and wearables is positively influencing the market growth. Other factors, including an enhanced focus on the production of sustainable and environmentally friendly products, such as halogen-free, solvent-free, lead-free, and low volatile organic compound (VOC) content, and extensive research and development (R&D) activities, are anticipated to drive the market growth.

Key Market Segmentation:
IMARC Group provides an analysis of the key trends in each segment of the global electronic adhesives market, along with forecasts at the global, regional, and country level from 2023-2028. Our report has categorized the market based on form, product type, resin type, and application.

Form Insights:
Paste
Solid
Liquid

The report has provided a detailed breakup and analysis of the electronic adhesives market based on the form. This includes paste, solid, and liquid. According to the report, liquid represented the largest segment.

Product Type Insights:
Electrically Conductive Adhesives
Thermally Conductive Adhesives
Others

A detailed breakup and analysis of the electronic adhesives market based on the product type has also been provided in the report. This includes electrically and thermally conductive adhesives and others. According to the report, electrically conductive adhesives accounted for the largest market share.

Resin Type Insights:
Epoxy
Silicone
Acrylics
PU
Others

The report has provided a detailed breakup and analysis of the electronic adhesives market based on the resin type. This includes epoxy, silicone, acrylics, PU and others. According to the report, epoxy represented the largest segment.

Application Insights:
Consumer Electronics
Computers and Servers
Industrial
Medical
Automotive
Communication
Others

The report has provided a detailed breakup and analysis of the electronic adhesives market based on the application. This includes consumer electronics, computers and servers, industrial, medical, automotive, communication, and others. According to the report, communication represented the largest segment.

Regional Insights:
North America
United States
Canada
Asia Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa

The report has also provided a comprehensive analysis of all the major regional markets that include North America (the

Competitive Landscape:
The report has also provided a comprehensive analysis of the competitive landscape in the global electronic adhesives market. Detailed profiles of all major companies have also been provided. Some of the companies covered include 3M Company, Avery Dennison Corporation, Bondline Electronic Adhesives Inc., Dow Inc., Dymax Corporation, Evonik Industries AG, H.B. Fuller Company, Henkel Ag & Co. KGaA, Heraeus Holding, Huntsman Corporation, Master Bond Inc. Permabond LLC, etc. Kindly note that this only represents a partial list of companies, and the complete list has been provided in the report.

Key Questions Answered in This Report:
How has the global electronic adhesives market performed so far and how will it perform in the coming years?
What are the drivers, restraints, and opportunities in the global electronic adhesives market?
What are the key regional markets?
Which countries represent the most attractive electronic adhesives markets?
What is the breakup of the market based on the form?
What is the breakup of the market based on the product type?
What is the breakup of the market based on the resin type?
What is the breakup of the market based on the application?
What is the competitive structure of the global electronic adhesives market?
Who are the key players/companies in the global electronic adhesives market?

グローバル市場調査レポート販売サイトのwww.marketreport.jpです。

❖ レポートの目次 ❖

1 Preface
2 Scope and Methodology
2.1 Objectives of the Study
2.2 Stakeholders
2.3 Data Sources
2.3.1 Primary Sources
2.3.2 Secondary Sources
2.4 Market Estimation
2.4.1 Bottom-Up Approach
2.4.2 Top-Down Approach
2.5 Forecasting Methodology
3 Executive Summary
4 Introduction
4.1 Overview
4.2 Key Industry Trends
5 Global Electronic Adhesives Market
5.1 Market Overview
5.2 Market Performance
5.3 Impact of COVID-19
5.4 Market Forecast
6 Market Breakup by Form
6.1 Paste
6.1.1 Market Trends
6.1.2 Market Forecast
6.2 Solid
6.2.1 Market Trends
6.2.2 Market Forecast
6.3 Liquid
6.3.1 Market Trends
6.3.2 Market Forecast
7 Market Breakup by Product Type
7.1 Electrically Conductive Adhesives
7.1.1 Market Trends
7.1.2 Market Forecast
7.2 Thermally Conductive Adhesives
7.2.1 Market Trends
7.2.2 Market Forecast
7.3 Others
7.3.1 Market Trends
7.3.2 Market Forecast
8 Market Breakup by Resin Type
8.1 Epoxy
8.1.1 Market Trends
8.1.2 Market Forecast
8.2 Silicone
8.2.1 Market Trends
8.2.2 Market Forecast
8.3 Acrylics
8.3.1 Market Trends
8.3.2 Market Forecast
8.4 PU
8.4.1 Market Trends
8.4.2 Market Forecast
8.5 Others
8.5.1 Market Trends
8.5.2 Market Forecast
9 Market Breakup by Application
9.1 Consumer Electronics
9.1.1 Market Trends
9.1.2 Market Forecast
9.2 Computers and Servers
9.2.1 Market Trends
9.2.2 Market Forecast
9.3 Industrial
9.3.1 Market Trends
9.3.2 Market Forecast
9.4 Medical
9.4.1 Market Trends
9.4.2 Market Forecast
9.5 Automotive
9.5.1 Market Trends
9.5.2 Market Forecast
9.6 Communication
9.6.1 Market Trends
9.6.2 Market Forecast
9.7 Others
9.7.1 Market Trends
9.7.2 Market Forecast
10 Market Breakup by Region
10.1 North America
10.1.1 United States
10.1.1.1 Market Trends
10.1.1.2 Market Forecast
10.1.2 Canada
10.1.2.1 Market Trends
10.1.2.2 Market Forecast
10.2 Asia-Pacific
10.2.1 China
10.2.1.1 Market Trends
10.2.1.2 Market Forecast
10.2.2 Japan
10.2.2.1 Market Trends
10.2.2.2 Market Forecast
10.2.3 India
10.2.3.1 Market Trends
10.2.3.2 Market Forecast
10.2.4 South Korea
10.2.4.1 Market Trends
10.2.4.2 Market Forecast
10.2.5 Australia
10.2.5.1 Market Trends
10.2.5.2 Market Forecast
10.2.6 Indonesia
10.2.6.1 Market Trends
10.2.6.2 Market Forecast
10.2.7 Others
10.2.7.1 Market Trends
10.2.7.2 Market Forecast
10.3 Europe
10.3.1 Germany
10.3.1.1 Market Trends
10.3.1.2 Market Forecast
10.3.2 France
10.3.2.1 Market Trends
10.3.2.2 Market Forecast
10.3.3 United Kingdom
10.3.3.1 Market Trends
10.3.3.2 Market Forecast
10.3.4 Italy
10.3.4.1 Market Trends
10.3.4.2 Market Forecast
10.3.5 Spain
10.3.5.1 Market Trends
10.3.5.2 Market Forecast
10.3.6 Russia
10.3.6.1 Market Trends
10.3.6.2 Market Forecast
10.3.7 Others
10.3.7.1 Market Trends
10.3.7.2 Market Forecast
10.4 Latin America
10.4.1 Brazil
10.4.1.1 Market Trends
10.4.1.2 Market Forecast
10.4.2 Mexico
10.4.2.1 Market Trends
10.4.2.2 Market Forecast
10.4.3 Others
10.4.3.1 Market Trends
10.4.3.2 Market Forecast
10.5 Middle East and Africa
10.5.1 Market Trends
10.5.2 Market Breakup by Country
10.5.3 Market Forecast
11 Drivers, Restraints, and Opportunities
11.1 Overview
11.2 Drivers
11.3 Restraints
11.4 Opportunities
12 Value Chain Analysis
13 Porters Five Forces Analysis
13.1 Overview
13.2 Bargaining Power of Buyers
13.3 Bargaining Power of Suppliers
13.4 Degree of Competition
13.5 Threat of New Entrants
13.6 Threat of Substitutes
14 Price Analysis
15 Competitive Landscape
15.1 Market Structure
15.2 Key Players
15.3 Profiles of Key Players
15.3.1 3M Company
15.3.1.1 Company Overview
15.3.1.2 Product Portfolio
15.3.1.3 Financials
15.3.1.4 SWOT Analysis
15.3.2 Avery Dennison Corporation
15.3.2.1 Company Overview
15.3.2.2 Product Portfolio
15.3.2.3 Financials
15.3.2.4 SWOT Analysis
15.3.3 Bondline Electronic Adhesives Inc.
15.3.3.1 Company Overview
15.3.3.2 Product Portfolio
15.3.4 Dow Inc.
15.3.4.1 Company Overview
15.3.4.2 Product Portfolio
15.3.4.3 Financials
15.3.4.4 SWOT Analysis
15.3.5 Dymax Corporation
15.3.5.1 Company Overview
15.3.5.2 Product Portfolio
15.3.6 Evonik Industries AG
15.3.6.1 Company Overview
15.3.6.2 Product Portfolio
15.3.6.3 Financials
15.3.6.4 SWOT Analysis
15.3.7 H.B. Fuller Company
15.3.7.1 Company Overview
15.3.7.2 Product Portfolio
15.3.7.3 Financials
15.3.7.4 SWOT Analysis
15.3.8 Henkel Ag & Co. KGaA
15.3.8.1 Company Overview
15.3.8.2 Product Portfolio
15.3.8.3 Financials
15.3.8.4 SWOT Analysis
15.3.9 Heraeus Holding
15.3.9.1 Company Overview
15.3.9.2 Product Portfolio
15.3.9.3 SWOT Analysis
15.3.10 Huntsman Corporation
15.3.10.1 Company Overview
15.3.10.2 Product Portfolio
15.3.10.3 Financials
15.3.10.4 SWOT Analysis
15.3.11 Master Bond Inc.
15.3.11.1 Company Overview
15.3.11.2 Product Portfolio
15.3.12 Permabond LLC
15.3.12.1 Company Overview
15.3.12.2 Product Portfolio

Kindly, note that this only represents a partial list of companies, and the complete list has been provided in the report.

★調査レポート[世界の電子用接着剤市場予測2023年-2028年] (コード：IMARC23AP029)販売に関する免責事項を必ずご確認ください。

★調査レポート[世界の電子用接着剤市場予測2023年-2028年]についてメールでお問い合わせ

MarketReport.jp

世界の電子用接着剤市場予測2023年-2028年

市場調査レポート・産業資料総合販売サイト www.MarketReport.jp

市場調査レポート・産業資料 総合販売サイト www.MarketReport.jp

市場調査レポート・産業資料総合販売サイト www.MarketReport.jp