システム・イン・パッケージ(SiP)の世界市場予測(~2023年)

【英語タイトル】System in Package Market by Packaging Technology (2D IC, 2.5D IC, 3D IC), Package Type (BGA, SOP), Packaging Method (Flip Chip, Wire Bond), Device (RF Front-End, RF Amplifier), Application (Consumer Electronics, Communications) - Global Forecast to 2023

MarketsandMarketsが出版した調査資料(MAM-SE-2384)・商品コード:MAM-SE-2384
・発行会社(調査会社):MarketsandMarkets
・発行日:2017年11月30日
・ページ数:156
・レポート言語:英語
・レポート形式:PDF
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・産業分野:電子
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MarketsandMarketsが発行した当調査レポートでは、システム・イン・パッケージ(SiP)の世界市場について調査・分析し、エグゼクティブサマリー、市場インサイト、市場概観/市場動向、バリューチェーン分析、市場シェア分析、パッケージング技術別分析、パッケージング方式別分析、用途別分析、地域別分析、システム・イン・パッケージ(SiP)の世界市場規模及び予測、市場動向、競争状況、関連企業分析などの情報をお届けいたします。
【レポートの概要】

The system in package market is expected to grow from USD 5.79 Billion in 2017 to USD 9.07 Billion by 2023, at a CAGR of 9.4% between 2017 and 2023. The growth of this market is propelled by the growing demand for miniaturization of electronic devices, impact of Internet of Things (IoT), and reduced time-to-market, and developments in the system in package ecosystem through organic and inorganic growth strategies such as product launches and developments, mergers and acquisitions, expansions, agreements, collaborations, joint ventures, and partnerships.
Among all the technologies in the system in package, the market for 3D IC is expected to grow at the highest CAGR between 2017 and 2023. The major factors driving the system in package market for 3D IC include the highest interconnect density and greater space efficiency than all other types of packaging technologies such as 2D IC and 2.5D IC. Moreover, leading semiconductor companies are focusing on R&D for the development of the 3D IC packaging technology to cater to this demand.

The market for FOWLP packaging method is expected to grow at a high rate between 2017 and 2023. The demand for FOWLP would be driven by the evolution of wireless communication networks. For instance, the 5G wireless communications technology is developing rapidly and is expected to start rolling out worldwide by 2020. For advanced high-performance communication applications, network infrastructure manufacturers need integration of various heterogeneous devices such as RF transceiver, baseband processor, and power management IC (PMIC) in a single unit, which, in turn, results in the increased demand for FOWLP packaging method.

Among various applications, the consumer electronics application accounted for the largest share of the overall system in package market based on the industry in 2016. The growth is attributed to the high adoption of system in package technology in smartphones and tablets because of their small form factor and better performance requirements to operate at a higher bandwidth, at a relatively lower cost. These are portable computing devices that encompass additional advanced features and higher connectivity than a regular feature phone, with many functions built in a single device. As a result, many ICs need to be incorporated into a single chip module for reducing the board space, cost, and the overall time to market. With all this development in the consumer electronics application, the demand for system in package would also rise.

APAC is expected to hold the largest share of the system in package market during the forecast period. This growth is mainly attributed to the broad scope of system in package technology in various consumer electronics applications, particularly in smartphones and tablets. In addition, the high population density in APAC, as well as the presence of major companies in this sector such as Samsung Electronics (South Korea), ASE Group (Taiwan), and many others, drives the growth of the system in package market in APAC. The key restraining factor for the growth of the system in package market is thermal-related issues caused by higher levels of integration.

The key market players such as ASE Group (Taiwan), Amkor Technology (US), and SPI (US) are focusing on the strategies such as product launches and developments, mergers and acquisitions, expansions, agreements, collaborations, joint ventures, and partnerships to enhance their service offerings and expand their business.

【レポートの目次】

1 Introduction (Page No. – 13)
1.1 Objectives of the Study
1.2 Definition
1.3 Market Segmentation
1.3.1 Markets Covered
1.3.2 Geographic Scope
1.3.3 Years Considered for the Study
1.4 Currency
1.5 Limitations
1.6 Market Stakeholders

2 Research Methodology (Page No. – 17)
2.1 Research Data
2.1.1 Secondary Data
2.1.1.1 Secondary Sources
2.1.2 Primary Data
2.1.2.1 Primary Sources
2.1.2.2 Key Industry Insights
2.1.2.3 Breakdown of Primaries
2.2 Market Size Estimation
2.2.1 Bottom-Up Approach
2.2.2 Top-Down Approach
2.3 Market Breakdown and Data Triangulation
2.4 Research Assumptions

3 Executive Summary (Page No. – 26)

4 Premium Insights (Page No. – 31)
4.1 Attractive Opportunities in the SiP Market
4.2 SiP Market, By Packaging Technology
4.3 SiP Market, By Region and Application
4.4 SiP Market, By Region
4.5 SiP Market Size, By Packaging Method, 2017–2023
4.6 SiP Market, By Package Type

5 Market Overview (Page No. – 35)
5.1 Introduction
5.2 Market Dynamics
5.2.1 Drivers
5.2.1.1 Growing Demand for Miniaturization of Electronic Devices
5.2.1.2 Impact of Internet of Things (IoT)
5.2.1.3 Reduced Time-To-Market
5.2.2 Restraints
5.2.2.1 Higher Level of Integration Leads to Thermal Issues
5.2.3 Opportunities
5.2.3.1 Potential Use of RF Components in Developing Advanced 5G Infrastructure
5.2.4 Challenges
5.2.4.1 Effective Supply Chain Management
5.3 Value Chain Analysis
5.4 Comparison of Technology
5.4.1 Benchmarking of SiP and SOC
5.4.2 Market Trends for SiP
5.4.3 Market Trends for SOC

6 SiP Market, By Packaging Technology (Page No. – 41)
6.1 Introduction
6.2 2D IC Packaging Technology
6.3 2.5D IC Packaging Technology
6.4 3d IC Packaging Technology

7 SiP Market, By Package Type (Page No. – 47)
7.1 Introduction
7.2 Ball Grid Array (BGA)
7.2.1 Plastic Ball Grid Array (PBGA)
7.2.2 Super Ball Grid Array (SBGA)
7.2.3 Fine Pitch Ball Grid Array (FBGA)
7.2.4 Flip Chip Ball Grid Array (FCBGA)
7.2.5 Others
7.3 Surface Mount Package
7.3.1 Land Grid Array (LGA)
7.3.2 Ceramic Column Grid Array (CCGA)
7.3.3 Others
7.4 Pin Grid Array (PGA)
7.4.1 Flip Chip Pin Grid Array (PGA)
7.4.2 Ceramic Pin Grid Array (CPGA)
7.4.3 Others
7.5 Flat Package (FP)
7.5.1 Quad Flat No-Leads (QFN)
7.5.2 Ultra Thin Quad Flat No-Leads (UTQFN)
7.5.3 Others
7.6 Small Outline Package
7.6.1 Thin Small Outline Package (TSOP)
7.6.2 Thin Shrink Small Outline Package (TSSOP)
7.6.3 Others

8 SiP Market, By Packaging Method (Page No. – 56)
8.1 Introduction
8.2 Wire Bond and Die Attach
8.3 Flip Chip
8.4 Fan-Out Wafer Level Packaging (FOWLP)
8.5 Comparison of Wire Bond, Flip Chip, and FOWLP Packaging Methods
8.6 Advantages and Limitations of Wire Bond, Flip Chip, and FOWLP Packaging Methods
8.7 Trends in Each Packaging Method

9 SiP Market, By Device (Page No. – 64)
9.1 Introduction
9.2 Power Management Integrated Circuit (PMIC)
9.3 Microelectromechanical Systems (MEMS)
9.4 RF Front-End
9.5 RF Power Amplifier
9.6 Baseband Processor
9.7 Application Processor
9.8 Others

10 SiP Market, By Application (Page No. – 76)
10.1 Introduction
10.2 Consumer Electronics
10.3 Communications
10.4 Industrial
10.5 Automotive & Transportation
10.6 Aerospace & Defense
10.7 Healthcare
10.8 Emerging & Others

11 SiP Market, By Geography (Page No. – 87)
11.1 Introduction
11.2 APAC
11.2.1 China and Taiwan
11.2.2 Japan
11.2.3 South Korea
11.2.4 Rest of APAC
11.3 North America
11.3.1 US
11.3.2 Canada
11.3.3 Mexico
11.4 Europe
11.4.1 Germany
11.4.2 France
11.4.3 Rest of Europe
11.5 RoW
11.5.1 Middle East and Africa
11.5.2 South America

12 Competitive Landscape (Page No. – 99)
12.1 Introduction
12.2 Ranking Analysis of Market Players
12.3 Competitive Scenario
12.3.1 Battle for the Market Share
12.3.2 Product Launches and Developments
12.3.3 Agreements, Collaborations, Partnerships, and Joint Ventures
12.3.4 Acquisitions and Expansions

13 Company Profiles (Page No. – 105)
(Overview, Service Offered, Strength of Product Portfolio, Business Strategy Excellence, Recent Developments, and Key Relationships)*
13.1 Amkor Technology
13.2 ASE Group
13.3 Chipbond Technology
13.4 Chipmos Technologies
13.5 FATC
13.6 Intel
13.7 JCET
13.8 Powertech Technology
13.9 Samsung Electronics
13.10 Spil
13.11 Texas Instruments
13.12 Unisem
13.13 UTAC (Global A&T Electronics)

*Details on Overview, Service Offered, Strength of Product Portfolio, Business Strategy Excellence, Recent Developments, and Key Relationships* Might Not Be Captured in Case of Unlisted Companies.

14 Appendix (Page No. – 146)
14.1 Discussion Guide
14.2 Knowledge Store: Marketsandmarkets’ Subscription Portal
14.3 Introducing RT: Real-Time Market Intelligence
14.4 Available Customizations
14.5 Related Reports
14.6 Author Details

List of Tables (56 Tables)

Table 1 Recent IoT Acquisition
Table 2 SiP Market, By Packaging Technology, 2015–2023 (USD Million)
Table 3 SiP Market, By Package Type, 2015–2023 (USD Million)
Table 4 SiP Market for BGA, By Package Subtype, 2015–2023 (USD Million)
Table 5 SiP Market for SMT, By Package Subtype, 2015–2023 (USD Million)
Table 6 SiP Market for PGA, By Package Subtype, 2015–2023 (USD Million)
Table 7 SiP Market for FP, By Package Subtype, 2015–2023 (USD Million)
Table 8 SiP Market for Sop, By Package Subtype, 2015–2023 (USD Million)
Table 9 SiP Market, By Packaging Method, 2015–2023 (USD Million)
Table 10 SiP Market for Wire Bond and Die Attach, By Device, 2015–2023 (USD Million)
Table 11 SiP Market for Flip Chip, By Device, 2015–2023 (USD Million)
Table 12 SiP Market for FOWLP, By Device, 2015–2023 (USD Million)
Table 13 SiP Market, By Device, 2015–2023 (Billion Units)
Table 14 SiP Market, By Device, 2015–2023 (USD Million)
Table 15 SiP Market Size for PMIC, By Application, 2015–2023 (USD Million)
Table 16 SiP Market Size for PMIC, By Packaging Method, 2015–2023 (USD Million)
Table 17 SiP Market Size for MEMS, By Application, 2015–2023 (USD Million)
Table 18 SiP Market Size for MEMS, By Packaging Method, 2015–2023 (USD Million)
Table 19 SiP Market Size for RF Front-End, By Application, 2015–2023 (USD Million)
Table 20 SiP Market Size for RF Front-End, By Packaging Method, 2015–2023 (USD Million)
Table 21 SiP Market Size for RF Power Amplifier, By Application, 2015–2023 (USD Million)
Table 22 SiP Market Size for RF Power Amplifier, By Packaging Method, 2015–2023 (USD Million)
Table 23 SiP Market Size for Baseband Processor, By Application, 2015–2023 (USD Million)
Table 24 SiP Market Size for Baseband Processor, By Packaging Method, 2015–2023 (USD Million)
Table 25 SiP Market Size for Application Processor, By Application, 2015–2023 (USD Million)
Table 26 SiP Market Size for Application Processor, By Packaging Method, 2015–2023 (USD Million)
Table 27 SiP Market Size for Others, By Application, 2015–2023 (USD Million)
Table 28 SiP Market Size for Others, By Packaging Method, 2015–2023 (USD Million)
Table 29 SiP Market, By Application, 2015–2023 (USD Million)
Table 30 SiP Market for Consumer Electronics, By Device, 2015–2023 (USD Million)
Table 31 SiP Market for Consumer Electronics, By Region, 2015–2023 (USD Million)
Table 32 SiP Market for Communications, By Device, 2015–2023 (USD Million)
Table 33 SiP Market for Communications, By Region, 2015–2023 (USD Million)
Table 34 SiP Market for Industrial, By Device, 2015–2023 (USD Million)
Table 35 SiP Market for Industrial, By Region, 2015–2023 (USD Million)
Table 36 SiP Market for Automotive & Transportation, By Device, 2015–2023 (USD Million)
Table 37 SiP Market for Automotive & Transportation, By Region, 2015–2023 (USD Million)
Table 38 SiP Market for Aerospace & Defense, By Device, 2015–2023 (USD Million)
Table 39 SiP Market for Aerospace & Defense, By Region, 2015–2023 (USD Million)
Table 40 SiP Market for Healthcare, By Device, 2015–2023 (USD Million)
Table 41 SiP Market for Healthcare, By Region, 2015–2023 (USD Million)
Table 42 SiP Market for Emerging & Others, By Device, 2015–2023 (USD Million)
Table 43 SiP Market for Emerging & Others, By Region, 2015–2023 (USD Million)
Table 44 SiP Market, By Geography, 2015–2023 (USD Million)
Table 45 SiP Market Size in APAC, By Country, 2015–2023 (USD Million)
Table 46 SiP Market Size in APAC, By Application, 2015–2023 (USD Million)
Table 47 SiP Market Size in North America, By Country, 2015–2023 (USD Million)
Table 48 SiP Market Size in North America, By Application, 2015–2023 (USD Million)
Table 49 SiP Market Size in Europe, By Country, 2015–2023 (USD Million)
Table 50 SiP Market Size in Europe, By Application, 2015–2023 (USD Million)
Table 51 SiP Market Size in RoW, By Country, 2015–2023 (USD Million)
Table 52 SiP Market Size in RoW, By Application, 2015–2023 (USD Million)
Table 53 Ranking of Top 5 Players in the SiP Market, 2016
Table 54 10 Key Product Launches, Product Developments, and Technology Developments
Table 55 10 Key Agreements, Collaborations, Partnerships, and Joint Ventures
Table 56 5 Key Acquisitions and Expansions

List of Figures (52 Figures)

Figure 1 SiP Market Segmentation
Figure 2 SiP Market: Research Design
Figure 3 Research Flow of Market Size Estimation
Figure 4 Market Size Estimation Methodology: Bottom-Up Approach
Figure 5 Market Size Estimation Methodology: Top-Down Approach
Figure 6 Data Triangulation
Figure 7 SiP Market for 3d IC Packaging Technology Expected to Grow at the Highest CAGR During the Forecast Period
Figure 8 SiP Market for FOWLP Packaging Method Expected to Grow at the Highest CAGR During the Forecast Period
Figure 9 RF Front-End Device Expected to Hold the Largest Size of SiP Market for Packaging Methods in 2017
Figure 10 SiP Market for Healthcare Application Expected to Grow at the Highest CAGR During the Forecast Period
Figure 11 APAC Expected to Hold the Largest Market Share in 2017
Figure 12 Increasing Demand for Miniaturization Along With High-Performance Electronic Devices Drives the Growth of the SiP Market
Figure 13 2D IC Packaging Technology Expected to Hold the Largest Market Size During the Forecast Period
Figure 14 Consumer Electronics Application and RF Front-End Device Expected to Hold the Largest Share of the SiP Market By 2023
Figure 15 SiP Market in RoW Expected to Grow at the Highest CAGR During 2017–2023
Figure 16 FOWLP Packaging Expected to Grow at the Highest CAGR During the Forecast Period
Figure 17 BGA Packaging Expected to Hold the Largest Size of the SiP Market During the Forecast Period
Figure 18 Value Chain Analysis of the SiP Market
Figure 19 SiP Market, By Packaging Technology
Figure 20 SiP Market for 3d IC Packaging Technology Expected to Grow at the Highest CAGR During the Forecast Period
Figure 21 Structure of 2D IC Packaging Technology
Figure 22 Structure of 2.5D IC Packaging Technology
Figure 23 Structure of 3d IC Packaging Technology
Figure 24 SiP Market, By Package Type
Figure 25 SiP Market for Sop Packaging Expected to Grow at the Highest CAGR During the Forecast Period
Figure 26 SiP Market, By Packaging Method
Figure 27 SiP Market for FOWLP Packaging Method Expected to Grow at the Highest CAGR During the Forecast Period
Figure 28 SiP Market, By Device
Figure 29 SiP Market for MEMS Expected to Grow at the Highest CAGR During the Forecast Period
Figure 30 Automotive & Transportation Application Market for MEMS Expected to Grow at the Highest CAGR During the Forecast Period
Figure 31 SiP Market, By Application
Figure 32 SiP Market for Healthcare Application Expected to Grow at the Highest CAGR During the Forecast Period
Figure 33 APAC Market for Healthcare Application Expected to Grow at the Highest CAGR During the Forecast Period
Figure 34 SiP Market in APAC Expected to Hold the Largest Size in 2017
Figure 35 APAC: Snapshot of SiP Market
Figure 36 North America: Snapshot of SiP Market
Figure 37 Europe: Snapshot of SiP Market
Figure 38 Companies Adopted Agreements, Collaborations, Partnerships, Joint Ventures as Key Growth Strategies Between January 2013 and October 2017
Figure 39 SiP Market Evaluation Framework
Figure 40 Amkor Technology: Company Snapshot
Figure 41 ASE Group: Company Snapshot
Figure 42 Chipbond Technology: Company Snapshot
Figure 43 Chipmos Technologies: Company Snapshot
Figure 44 FATC: Company Snapshot
Figure 45 Intel: Company Snapshot
Figure 46 JCET: Company Snapshot
Figure 47 Powertech Technology: Company Snapshot
Figure 48 Samsung Electronics: Company Snapshot
Figure 49 Spil: Company Snapshot
Figure 50 Texas Instruments: Company Snapshot
Figure 51 Unisem: Company Snapshot
Figure 52 UTAC: Company Snapshot

【レポートのキーワード】

システム・イン・パッケージ(SiP)、2D IC、2.5D IC、3D IC、パッケージング、家電、通信、SiP用途

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