フリップチップ技術の世界市場

◆英語タイトル:Flip-Chip Technologies - Global Market Outlook (2015-2022)
◆商品コード:SMRC65084
◆発行会社(調査会社):Stratistics MRC
◆発行日:2016年1月
◆ページ数:142
◆レポート言語:英語
◆レポート形式:PDF
◆納品方法:Eメール
◆調査対象地域:グローバル
◆産業分野:電子
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当調査レポートでは、フリップチップ技術の世界市場について調査・分析し、市場動向、市場規模、市場予測、企業動向などを含め、以下の構成でお届けいたします。

・エグゼクティブサマリー
・序文
・市場動向分析
・ファイブフォース分析(市場環境分析)
・フリップチップ技術の世界市場:ウェーハー・バンピング・プロセス別分析/市場規模
・フリップチップ技術の世界市場:エンドユーザー別分析/市場規模
・フリップチップ技術の世界市場:用途別分析/市場規模
・フリップチップ技術の世界市場:地域別分析/市場規模
・フリップチップ技術のアメリカ市場規模予測
・フリップチップ技術のヨーロッパ市場規模予測
・フリップチップ技術のアジア市場規模予測
・企業動向
・企業分析
【レポートの概要】

According to Stratistics MRC, the Global Flip-Chip Technologies market is estimated at $25.89 billion in 2015 and is poised to reach $57.04 billion by 2022, growing at a Compound Annual Growth Rate (CAGR) of 11.94% during the forecast period. Flip chip is a key technology for advanced packaging of microelectronic circuits and other micro-devices. This technology is used to interconnect semiconductor IC with other ICs, peripheral circuits or substrate in efficient way by solving the heat transfer problem of semiconductor devices, improving performance at higher frequency and reducing the power consumption. Wide range of low-end and high-end electronic products, enhanced electrical performance and high interconnection density are the major factors favoring the market growth.
Due to a global trend on banning the toxic material lead in electronic products, conventional flip chip assembly using lead-based solder bumps is facing a great challenge. Flip chip technology continues to advance and is playing a huge role in 2.5D interposers and 3DICs. The demand for copper pillars and microbumps are reshaping the Flip chip technology, which are swiftly becoming the innovative conventional bumping metallurgy solutions for die interconnections. Intel is the leading producer of flip chip. It is estimated that, by the year 2017 more than half of all bumped wafers for flip chips will be made with copper pillars.

Some of the key players in the global market include IBM Corp., Samsung Electronics Co. Ltd., Texas Instruments Inc., Amkor Technology Inc., Intel Corp., Taiwan Semiconductor Manufacturing Co., Global Foundries U.S. Inc., Powertech Technology Inc. and Advanced Semiconductor Engineering Inc, Nepes Pte. Ltd., Stmicroelectronics NV (STM) and Stats Chippac Ltd.

Wafer Bumping Process Covered:
• Copper (Cu) pillar
• Tin-lead eutectic solder
• Lead free solder
• Gold stud and plated
End Use Covered:
• Medical devices
• Industrial applications
• Robotics
• Smartphones
• Desktop CPUs
• Laptops
• Automotive
• GPUs and chipsets
• Smart technologies
• Other computing devices
Applications Covered:
• Memory
• 2D logic system-on-a-chip (SoC)
• Imaging
• High-brightness light-emitting diode (HB-LED)
• RF, power and Analog ICs
• 2.5D/3D system-in-package/system-on-a-chip (SiP/SoC)
Regions Covered:
• North America
o US
o Canada
o Mexico
• Europe
o Germany
o France
o Italy
o UK
o Spain
o Rest of Europe
• Asia Pacific
o Japan
o China
o India
o Australia
o New Zealand
o Rest of Asia Pacific
• Rest of the World
o Middle East
o Brazil
o Argentina
o South Africa
o Egypt

What our report offers:
- Market share assessments for the regional and country level segments
- Market share analysis of the top industry players
- Strategic recommendations for the new entrants
- Market forecasts for a minimum of 7 years of all the mentioned segments, sub segments and the regional markets
- Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
- Strategic recommendations in key business segments based on the market estimations
- Competitive landscaping mapping the key common trends
- Company profiling with detailed strategies, financials, and recent developments
- Supply chain trends mapping the latest technological advancements

【レポートの目次】

1 Executive Summary

2 Preface
2.1 Abstract
2.2 Stake Holders
2.3 Research Scope
2.4 Research Methodology
2.4.1 Data Mining
2.4.2 Data Analysis
2.4.3 Data Validation
2.4.4 Research Approach
2.5 Research Sources
2.5.1 Primary Research Sources
2.5.2 Secondary Research Sources
2.5.3 Assumptions

3 Market Trend Analysis
3.1 Introduction
3.2 Drivers
3.3 Restraints
3.4 Opportunities
3.5 Threats
3.6 Product Analysis
3.7 Application Analysis
3.8 Emerging Markets

4 Porters Five Force Analysis
4.1 Bargaining power of suppliers
4.2 Bargaining power of buyers
4.3 Threat of substitutes
4.4 Threat of new entrants
4.5 Competitive rivalry

5 Global Flip-Chip Technologies Market, By Wafer Bumping Process
5.1 Introduction
5.2 Copper (Cu) pillar
5.3 Tin-lead eutectic solder
5.4 Lead free solder
5.5 Gold stud and plated

6 Global Flip-Chip Technologies Market, By End Users
6.1 Introduction
6.2 Medical devices
6.3 Industrial applications
6.4 Robotics
6.5 Smartphones
6.6 Desktop CPUs
6.7 Laptops
6.8 Automotive
6.9 GPUs and chipsets
6.10 Smart technologies
6.11 Other computing devices

7 Global Flip-Chip Technologies Market, By Application
7.1 Introduction
7.2 Memory
7.3 2D logic system-on-a-chip (SoC)
7.4 Imaging
7.5 High-brightness light-emitting diode (HB-LED)
7.6 RF, power and Analog ICs
7.7 2.5D/3D system-in-package/system-on-a-chip (SiP/SoC)

8 Global Flip-Chip Technologies Market, By Geography
8.1 North America
8.1.1 US
8.1.2 Canada
8.1.3 Mexico
8.2 Europe
8.2.1 Germany
8.2.2 France
8.2.3 Italy
8.2.4 UK
8.2.5 Spain
8.2.6 Rest of Europe
8.3 Asia Pacific
8.3.1 Japan
8.3.2 China
8.3.3 India
8.3.4 Australia
8.3.5 New Zealand
8.3.6 Rest of Asia Pacific
8.4 Rest of the World
8.4.1 Middle East
8.4.2 Brazil
8.4.3 Argentina
8.4.4 South Africa
8.4.5 Egypt

9 Key Developments
9.1 Agreements, Partnerships, Collaborations and Joint Ventures
9.2 Acquisitions & Mergers
9.3 New Product Launch
9.4 Expansions
9.5 Other Key Strategies

10 Company Profiling
10.1 IBM Corp.
10.2 Samsung Electronics Co. Ltd.
10.3 Texas Instruments Inc.
10.4 Amkor Technology Inc.
10.5 Intel Corp.
10.6 Taiwan Semiconductor Manufacturing Co.
10.7 Global Foundries U.S. Inc.
10.8 Powertech Technology Inc.
10.9 Advanced Semiconductor Engineering Inc.
10.10 NEPES PTE. LTD.
10.11 STMICROELECTRONICS NV (STM)
10.12 STATS CHIPPAC LTD.

Table of Contents
1 Global Flip-Chip Technologies Market Outlook, By Region (2012-2022) ($MN)
2 Global Flip-Chip Technologies Market Outlook, By Wafer Bumping Process (2012-2022) ($MN)
3 Global Flip-Chip Technologies Market Outlook, By Copper (Cu) pillar (2012-2022) ($MN)
4 Global Flip-Chip Technologies Market Outlook, By Tin-lead eutectic solder (2012-2022) ($MN)
5 Global Flip-Chip Technologies Market Outlook, By Lead free solder (2012-2022) ($MN)
6 Global Flip-Chip Technologies Market Outlook, By Gold stud and plated (2012-2022) ($MN)
7 Global Flip-Chip Technologies Market Outlook, By End Use (2012-2022) ($MN)
8 Global Flip-Chip Technologies Market Outlook, By Medical devices (2012-2022) ($MN)
9 Global Flip-Chip Technologies Market Outlook, By Industrial applications (2012-2022) ($MN)
10 Global Flip-Chip Technologies Market Outlook, By Robotics (2012-2022) ($MN)
11 Global Flip-Chip Technologies Market Outlook, By Smartphones (2012-2022) ($MN)
12 Global Flip-Chip Technologies Market Outlook, By Desktop CPUs (2012-2022) ($MN)
13 Global Flip-Chip Technologies Market Outlook, By Laptops (2012-2022) ($MN)
14 Global Flip-Chip Technologies Market Outlook, By Automotive (2012-2022) ($MN)
15 Global Flip-Chip Technologies Market Outlook, By GPUs and chipsets (2012-2022) ($MN)
16 Global Flip-Chip Technologies Market Outlook, By Smart technologies (2012-2022) ($MN)
17 Global Flip-Chip Technologies Market Outlook, By Other computing devices (2012-2022) ($MN)
18 Global Flip-Chip Technologies Market Outlook, By Application (2012-2022) ($MN)
19 Global Flip-Chip Technologies Market Outlook, By Memory (2012-2022) ($MN)
20 Global Flip-Chip Technologies Market Outlook, By 2D logic system-on-a-chip (SoC) (2012-2022) ($MN)
21 Global Flip-Chip Technologies Market Outlook, By Imaging (2012-2022) ($MN)
22 Global Flip-Chip Technologies Market Outlook, By High-brightness light-emitting diode (HB-LED) (2012-2022) ($MN)
23 Global Flip-Chip Technologies Market Outlook, By RF, power and Analog ICs (2012-2022) ($MN)
24 Global Flip-Chip Technologies Market Outlook, By 2.5D/3D system-in-package/system-on-a-chip (SiP/SoC) (2012-2022) ($MN)
25 North America Flip-Chip Technologies Market Outlook, By Wafer Bumping Process (2012-2022) ($MN)
26 North America Flip-Chip Technologies Market Outlook, By Copper (Cu) pillar (2012-2022) ($MN)
27 North America Flip-Chip Technologies Market Outlook, By Tin-lead eutectic solder (2012-2022) ($MN)
28 North America Flip-Chip Technologies Market Outlook, By Lead free solder (2012-2022) ($MN)
29 North America Flip-Chip Technologies Market Outlook, By Gold stud and plated (2012-2022) ($MN)
30 North America Flip-Chip Technologies Market Outlook, By End Use (2012-2022) ($MN)
31 North America Flip-Chip Technologies Market Outlook, By Medical devices (2012-2022) ($MN)
32 North America Flip-Chip Technologies Market Outlook, By Industrial applications (2012-2022) ($MN)
33 North America Flip-Chip Technologies Market Outlook, By Robotics (2012-2022) ($MN)
34 North America Flip-Chip Technologies Market Outlook, By Smartphones (2012-2022) ($MN)
35 North America Flip-Chip Technologies Market Outlook, By Desktop CPUs (2012-2022) ($MN)
36 North America Flip-Chip Technologies Market Outlook, By Laptops (2012-2022) ($MN)
37 North America Flip-Chip Technologies Market Outlook, By Automotive (2012-2022) ($MN)
38 North America Flip-Chip Technologies Market Outlook, By GPUs and chipsets (2012-2022) ($MN)
39 North America Flip-Chip Technologies Market Outlook, By Smart technologies (2012-2022) ($MN)
40 North America Flip-Chip Technologies Market Outlook, By Other computing devices (2012-2022) ($MN)
41 North America Flip-Chip Technologies Market Outlook, By Application (2012-2022) ($MN)
42 North America Flip-Chip Technologies Market Outlook, By Memory (2012-2022) ($MN)
43 North America Flip-Chip Technologies Market Outlook, By 2D logic system-on-a-chip (SoC) (2012-2022) ($MN)
44 North America Flip-Chip Technologies Market Outlook, By Imaging (2012-2022) ($MN)
45 North America Flip-Chip Technologies Market Outlook, By High-brightness light-emitting diode (HB-LED) (2012-2022) ($MN)
46 North America Flip-Chip Technologies Market Outlook, By RF, power and Analog ICs (2012-2022) ($MN)
47 North America Flip-Chip Technologies Market Outlook, By 2.5D/3D system-in-package/system-on-a-chip (SiP/SoC) (2012-2022) ($MN)
48 Europe Flip-Chip Technologies Market Outlook, By Wafer Bumping Process (2012-2022) ($MN)
49 Europe Flip-Chip Technologies Market Outlook, By Copper (Cu) pillar (2012-2022) ($MN)
50 Europe Flip-Chip Technologies Market Outlook, By Tin-lead eutectic solder (2012-2022) ($MN)
51 Europe Flip-Chip Technologies Market Outlook, By Lead free solder (2012-2022) ($MN)
52 Europe Flip-Chip Technologies Market Outlook, By Gold stud and plated (2012-2022) ($MN)
53 Europe Flip-Chip Technologies Market Outlook, By End Use (2012-2022) ($MN)
54 Europe Flip-Chip Technologies Market Outlook, By Medical devices (2012-2022) ($MN)
55 Europe Flip-Chip Technologies Market Outlook, By Industrial applications (2012-2022) ($MN)
56 Europe Flip-Chip Technologies Market Outlook, By Robotics (2012-2022) ($MN)
57 Europe Flip-Chip Technologies Market Outlook, By Smartphones (2012-2022) ($MN)
58 Europe Flip-Chip Technologies Market Outlook, By Desktop CPUs (2012-2022) ($MN)
59 Europe Flip-Chip Technologies Market Outlook, By Laptops (2012-2022) ($MN)
60 Europe Flip-Chip Technologies Market Outlook, By Automotive (2012-2022) ($MN)
61 Europe Flip-Chip Technologies Market Outlook, By GPUs and chipsets (2012-2022) ($MN)
62 Europe Flip-Chip Technologies Market Outlook, By Smart technologies (2012-2022) ($MN)
63 Europe Flip-Chip Technologies Market Outlook, By Other computing devices (2012-2022) ($MN)
64 Europe Flip-Chip Technologies Market Outlook, By Application (2012-2022) ($MN)
65 Europe Flip-Chip Technologies Market Outlook, By Memory (2012-2022) ($MN)
66 Europe Flip-Chip Technologies Market Outlook, By 2D logic system-on-a-chip (SoC) (2012-2022) ($MN)
67 Europe Flip-Chip Technologies Market Outlook, By Imaging (2012-2022) ($MN)
68 Europe Flip-Chip Technologies Market Outlook, By High-brightness light-emitting diode (HB-LED) (2012-2022) ($MN)
69 Europe Flip-Chip Technologies Market Outlook, By RF, power and Analog ICs (2012-2022) ($MN)
70 Europe Flip-Chip Technologies Market Outlook, By 2.5D/3D system-in-package/system-on-a-chip (SiP/SoC) (2012-2022) ($MN)
71 Asia Pacific Flip-Chip Technologies Market Outlook, By Wafer Bumping Process (2012-2022) ($MN)
72 Asia Pacific Flip-Chip Technologies Market Outlook, By Copper (Cu) pillar (2012-2022) ($MN)
73 Asia Pacific Flip-Chip Technologies Market Outlook, By Tin-lead eutectic solder (2012-2022) ($MN)
74 Asia Pacific Flip-Chip Technologies Market Outlook, By Lead free solder (2012-2022) ($MN)
75 Asia Pacific Flip-Chip Technologies Market Outlook, By Gold stud and plated (2012-2022) ($MN)
76 Asia Pacific Flip-Chip Technologies Market Outlook, By End Use (2012-2022) ($MN)
77 Asia Pacific Flip-Chip Technologies Market Outlook, By Medical devices (2012-2022) ($MN)
78 Asia Pacific Flip-Chip Technologies Market Outlook, By Industrial applications (2012-2022) ($MN)
79 Asia Pacific Flip-Chip Technologies Market Outlook, By Robotics (2012-2022) ($MN)
80 Asia Pacific Flip-Chip Technologies Market Outlook, By Smartphones (2012-2022) ($MN)
81 Asia Pacific Flip-Chip Technologies Market Outlook, By Desktop CPUs (2012-2022) ($MN)
82 Asia Pacific Flip-Chip Technologies Market Outlook, By Laptops (2012-2022) ($MN)
83 Asia Pacific Flip-Chip Technologies Market Outlook, By Automotive (2012-2022) ($MN)
84 Asia Pacific Flip-Chip Technologies Market Outlook, By GPUs and chipsets (2012-2022) ($MN)
85 Asia Pacific Flip-Chip Technologies Market Outlook, By Smart technologies (2012-2022) ($MN)
86 Asia Pacific Flip-Chip Technologies Market Outlook, By Other computing devices (2012-2022) ($MN)
87 Asia Pacific Flip-Chip Technologies Market Outlook, By Application (2012-2022) ($MN)
88 Asia Pacific Flip-Chip Technologies Market Outlook, By Memory (2012-2022) ($MN)
89 Asia Pacific Flip-Chip Technologies Market Outlook, By 2D logic system-on-a-chip (SoC) (2012-2022) ($MN)
90 Asia Pacific Flip-Chip Technologies Market Outlook, By Imaging (2012-2022) ($MN)
91 Asia Pacific Flip-Chip Technologies Market Outlook, By High-brightness light-emitting diode (HB-LED) (2012-2022) ($MN)
92 Asia Pacific Flip-Chip Technologies Market Outlook, By RF, power and Analog ICs (2012-2022) ($MN)
93 Asia Pacific Flip-Chip Technologies Market Outlook, By 2.5D/3D system-in-package/system-on-a-chip (SiP/SoC) (2012-2022) ($MN)
94 Rest of the World Flip-Chip Technologies Market Outlook, By Wafer Bumping Process (2012-2022) ($MN)
95 Rest of the World Flip-Chip Technologies Market Outlook, By Copper (Cu) pillar (2012-2022) ($MN)
96 Rest of the World Flip-Chip Technologies Market Outlook, By Tin-lead eutectic solder (2012-2022) ($MN)
97 Rest of the World Flip-Chip Technologies Market Outlook, By Lead free solder (2012-2022) ($MN)
98 Rest of the World Flip-Chip Technologies Market Outlook, By Gold stud and plated (2012-2022) ($MN)
99 Rest of the World Flip-Chip Technologies Market Outlook, By End Use (2012-2022) ($MN)
100 Rest of the World Flip-Chip Technologies Market Outlook, By Medical devices (2012-2022) ($MN)
101 Rest of the World Flip-Chip Technologies Market Outlook, By Industrial applications (2012-2022) ($MN)
102 Rest of the World Flip-Chip Technologies Market Outlook, By Robotics (2012-2022) ($MN)
103 Rest of the World Flip-Chip Technologies Market Outlook, By Smartphones (2012-2022) ($MN)
104 Rest of the World Flip-Chip Technologies Market Outlook, By Desktop CPUs (2012-2022) ($MN)
105 Rest of the World Flip-Chip Technologies Market Outlook, By Laptops (2012-2022) ($MN)
106 Rest of the World Flip-Chip Technologies Market Outlook, By Automotive (2012-2022) ($MN)
107 Rest of the World Flip-Chip Technologies Market Outlook, By GPUs and chipsets (2012-2022) ($MN)
108 Rest of the World Flip-Chip Technologies Market Outlook, By Smart technologies (2012-2022) ($MN)
109 Rest of the World Flip-Chip Technologies Market Outlook, By Other computing devices (2012-2022) ($MN)
110 Rest of the World Flip-Chip Technologies Market Outlook, By Application (2012-2022) ($MN)
111 Rest of the World Flip-Chip Technologies Market Outlook, By Memory (2012-2022) ($MN)
112 Rest of the World Flip-Chip Technologies Market Outlook, By 2D logic system-on-a-chip (SoC) (2012-2022) ($MN)
113 Rest of the World Flip-Chip Technologies Market Outlook, By Imaging (2012-2022) ($MN)
114 Rest of the World Flip-Chip Technologies Market Outlook, By High-brightness light-emitting diode (HB-LED) (2012-2022) ($MN)
115 Rest of the World Flip-Chip Technologies Market Outlook, By RF, power and Analog ICs (2012-2022) ($MN)
116 Rest of the World Flip-Chip Technologies Market Outlook, By 2.5D/3D system-in-package/system-on-a-chip (SiP/SoC) (2012-2022) ($MN)



【レポートのキーワード】

フリップチップ、フリップチップ技術、ウェーハー・バンピング・プロセス

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