中国の半導体パッケージング及びテスト市場

◆英語タイトル:Semiconductor Packaging and Test Market in China 2015-2019
◆商品コード:IRTNTR7868
◆発行会社(調査会社):Technavio
◆発行日:2015年11月18日
◆ページ数:57
◆レポート言語:英語
◆レポート形式:pdf
◆納品方法:Eメール
◆調査対象地域:中国
◆産業分野:電子
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当調査レポートでは、中国の半導体パッケージング及びテスト市場について調査・分析し、エグゼクティブサマリー、市場概観、市場概観、業界の構造分析、中国の半導体パッケージング及びテスト市場規模及び予測、市場の成長要因、市場の課題、市場動向、競争状況、主要企業(ベンダー)分析などの情報をお届けいたします。
【レポートの概要】

About semiconductor packaging and testing
Semiconductor packaging involves casing of materials such as metal, plastic, glass, or ceramic on the silicon wafer. These casings usually contain one or more semiconductor electronic components. A casing protects the silicon wafer against corrosion and impact, clamps the contact pins or leads used to connect the external circuits to the device, and dissipates heat produced in the device. Though packages are usually made in accordance to industry standards, they meet the specifics of an individual manufacturer.
Wafer testing is executed during the semiconductor device fabrication. This involves the testing of all individual integrated circuits present on the wafer. The individual circuits are tested for functional defects using special test patterns. The testing is carried out using an equipment called a wafer prober or handler. Testing is also carried out using testing methods such as system level tests and burn-in method.

Technavio’s analysts forecast the semiconductor packaging and test market in China to grow at a CAGR of 7.05% by revenue over the period 2014-2019.

[Covered in this report]
The report covers the present scenario and the growth prospects of the semiconductor packaging and test market in China for 2015-2019 along with a market overview. The market has been segmented and sub-segmented on the following basis:
By business type :
IDM (integrated devices manufacturers)
Outsourced semiconductor assembly and test (OSAT)

Technavio’s report, Semiconductor Packaging and Test Market in China in 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts. The report focuses on the landscape of semiconductor packaging and test market in China market and its opportunities in the coming years. The report includes a discussion of the key vendors operating in this market.

[Key vendors]
Amkor
ASE
PowerTech
SPIL
STATS ChipsPAC
UTAC

[Other prominent vendors]
ChipMos
Greatek
Huanhong
JCET
KYEC
Lingsen Precision
Nepes Corporation
SMIC
Tianshui Huatian
Unisem

[Market Driver]
Growth of semiconductor chip application market
For a full, detailed list, view our report

[Market challenge]
Short lifecycle of semiconductor devices
For a full, detailed list, view our report

[Market trend]
Emergence of 3D packaging
For a full, detailed list, view our report

[Key questions answered in this report]
What will the market size be in 2019 in terms of both revenue and unit shipments and what will the growth rate be
What are the key market trends
What is driving this market
What are the challenges to market growth
Who are the key vendors in this market space
What are the market opportunities and threats faced by the key vendors

【レポートの目次】

PART 01: Executive summary
Highlights

PART 02: Scope of the report
Market overview
Product offerings

PART 03: Market research methodology
Research methodology
Economic indicators

PART 04: Introduction
Key market highlights

PART 05: Market landscape
Country profile
Market size and forecast
Five forces analysis

PART 06: Market segmentation by business type
Market size and forecast

PART 07: Market drivers

PART 08: Impact of drivers

PART 09: Market challenges

PART 10: Impact of drivers and challenges

PART 11: Market trends

PART 12: Vendor landscape
Competitive scenario
Other prominent vendors
ChipMOS TECHNOLOGIES (Bermuda)
Greatek Electronic
Huahong
JCET
KYEC
Lingsen Precision
Nepes
SMIC
Tianshui Huatian
Unisem

PART 13: Key vendor analysis
Amkor Technology
ASE
Powertech Technology
Siliconware Precision Industries (SPIL)
STATS ChipPAC
UTAC

PART 14: Appendix
List of abbreviations

PART 15: Explore Technavio

[List of Exhibits]

Exhibit 01: Evolution of semiconductor packaging techniques
Exhibit 02: Types of packaging and testing
Exhibit 03: Semiconductor packaging and test market
Exhibit 04: Semiconductor packaging and test market size in China ($ billions)
Exhibit 05: Five forces analysis
Exhibit 06: Semiconductor packaging and test market by IDM in China 2014-2019 ($ billions)
Exhibit 07: Semiconductor packaging and test market in China by outsourcing 2014-2019 ($ billions)
Exhibit 08: Impact of drivers
Exhibit 09: Impact of drivers and challenges
Exhibit 10: Market share in semiconductor packaging and test market in China 2014
Exhibit 11: Amkor Technology: Product segmentation by revenue 2014
Exhibit 12: Amkor Technology: Product segment comparison by revenue 2013 and 2014 ($ billions)
Exhibit 13: Amkor Technology: Geographical segmentation by revenue 2014
Exhibit 14: ASE: Business segmentation by revenue 2014
Exhibit 15: ASE: Business segmentation by revenue 2013 and 2014 ($ billions)
Exhibit 16: Company Name: Geographical segmentation by revenue 2013
Exhibit 17: Powertech Technology: Business segmentation
Exhibit 18: Powertech Technology: Geographical segmentation by revenue 2014
Exhibit 19: SPIL: Business segmentation by revenue 2014
Exhibit 20: SPIL: Business segmentation by revenue 2013 and 2014 ($ billions)
Exhibit 21: SPIL: Geographical segmentation by revenue 2014
Exhibit 22: STATS ChipPAC: Product segmentation by revenue 2014
Exhibit 23: STATS ChipPAC: Geographical segmentation by revenue 2013
Exhibit 24: UTAC: Business segmentation



【掲載企業】

Amkor Technology, ASE, Powertech Technology, Siliconware Precision Industries (SPIL), STATS ChipPAC, UTAC, ChipMos, Greatek, Huahong, JCET, KYEC, Lingsen Precision, Nepes, SMIC, Tianshui Huatian, Unisem.

【レポートのキーワード】

半導体パッケージング、半導体テスト、半導体検査、中国

【調査方法】

一次資料による調査(業界専門家、ベンダー、代理店、顧客等を対象にしたデプスインタビュー調査など)及び二次資料による調査(Technavio独自のプラットフォーム、産業書籍、企業報告書、ニュース記事、アナリストレポート、貿易協会、政府機関発行データなど)

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