半導体パッケージング装置の世界市場:ダイレベルパッケージ、ウエハレベルパッケージ

◆英語タイトル:Global Semiconductor Packaging Equipment Market 2016-2020
◆商品コード:IRTNTR10101
◆発行会社(調査会社):Technavio
◆発行日:2016年8月24日
◆ページ数:67
◆レポート言語:英語
◆レポート形式:PDF
◆納品方法:Eメール(受注後24時間以内)
◆調査対象地域:グローバル
◆産業分野:電子
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当調査レポートでは、半導体パッケージング装置の世界市場について調査・分析し、エグゼクティブサマリー、市場概観、市場概観、業界の構造分析、半導体パッケージング装置の世界市場規模及び予測、種類別分析、需要先別分析、地域別分析/市場規模、市場の成長要因、市場の課題、市場動向、競争状況などの情報をお届けいたします。
【レポートの概要】

About Semiconductor Packaging
Semiconductor packaging is carried out to provide extra protection to wafers or substrates. The package casing is made up of materials such as metal, plastic, glass, or ceramic and contains one or more semiconductor electronic components.
Semiconductor packaging offers the following benefits to wafers:
• Prevents corrosion
• Offers protection in case of impact
• Dissipates heat produced in the device
• Secures the contact leads or pins used to plug in the device to its external circuits

Technavio’s analysts forecast the global semiconductor packaging equipment market to grow at a CAGR of 8.04% during the period 2016-2020.

[Covered in this report]
The report covers the present scenario and the growth prospects of the global semiconductor packaging equipment market for 2016-2020. To calculate the market size, the report considers the sale of semiconductor packaging equipment to the end-users — OSATs and IDMs.

The market is divided into the following segments based on geography:
• APAC
• Europe
• North America

Technavio’s report, Global Semiconductor Packaging Equipment Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

[Key vendors]
• Applied Materials
• ASM Pacific Technology
• Kulicke and Soffa Industries
• Tokyo Electron Limited
• Tokyo Seimitsu

[Other prominent vendors]
• ChipMos
• Greatek
• Hua Hong
• Jiangsu Changjiang Electronics Technology
• Lingsen Precision
• Nepes
• Tianshui Huatian
• Unisem
• Ultratech

[Market driver]
• High demand for polymer adhesive wafer bonding equipment
• For a full, detailed list, view our report

[Market challenge]
• Fluctuation of foreign exchange rates
• For a full, detailed list, view our report

[Market trend]
• Growing number of mergers and acquisitions
• For a full, detailed list, view our report

[Key questions answered in this report]
• What will the market size be in 2020 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?

※You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.

【レポートの目次】

PART 01: Executive summary
• Highlights

PART 02: Scope of the report
• Definition
• Source year and forecast period
• Market reportage
• Market size computation
• Market segmentation
• Geographical coverage
• Vendor segmentation
• Common currency conversion rates
• Top-vendor offerings

PART 03: Market research methodology
• Research methodology
• Economic indicators

PART 04: Introduction
• Key market highlights

PART 05: Technology landscape
• Wafer-level versus die-level packaging and assembly
• Roadmap of semiconductor packaging industry
• Ecosystem of semiconductor IC packaging industry

PART 06: Market landscape
• Customer perspective
• Market size and forecast
• Five forces analysis

PART 07: Market segmentation by type
• Types of packaging equipment
• Die-level packaging equipment
• Wafer-level packaging equipment

PART 08: Market segmentation by end-user
• Global semiconductor packaging equipment market by end-user
• OSATs
• IDMs

PART 09: Geographical segmentation
• Global semiconductor packaging equipment market by region
• APAC
• North America
• Europe

PART 10: Market drivers
• Growing number of fabs
• High demand for polymer adhesive wafer bonding equipment
• Complex semiconductor IC designs
• Explosive growth of wireless computing devices along with advent of IoT
• Growing demand for compact electronic devices
• High need for SoC technology

PART 11: Impact of drivers

PART 12: Market challenges
• High inventory levels in supply chain
• Dependency on few key suppliers
• Fluctuation of foreign exchange rates
• High investment market

PART 13: Impact of drivers and challenges

PART 14: Market trends
• Development of 3D chip packaging
• Increase in number of OSAT vendors
• Growing number of mergers and acquisitions
• FOWLP technology
• High need for semiconductor memory devices
• Growing acceptance of wearable devices
• Automation in automobiles

PART 15: Vendor landscape
• Competitive scenario
• Key vendors
• Other prominent vendors

PART 16: Appendix
• List of abbreviations

PART 17: Explore Technavio

[List of Exhibits]

Exhibit 01: Segmentation of global semiconductor packaging equipment market
Exhibit 02: List of countries in key regions
Exhibit 03: Market vendors
Exhibit 04: Currency conversions
Exhibit 05: Product offerings
Exhibit 06: Steps involved in back-end chip formation
Exhibit 07:.5D IC block diagram
Exhibit 08:D IC block diagram
Exhibit 09: Supply chain in traditional semiconductor IC packaging industry
Exhibit 10: Supply chain in new semiconductor IC packaging industry
Exhibit 11: Global semiconductor packaging equipment market 2015-2020 ($ billions)
Exhibit 12: Five forces analysis
Exhibit 13: Global semiconductor packaging equipment market by type 2015 (% share)
Exhibit 14: Global semiconductor packaging equipment market by type 2020 (% share)
Exhibit 15: Global semiconductor packaging equipment market by die-level packaging equipment 2015-2020 ($ millions)
Exhibit 16: Global semiconductor packaging equipment market by wafer-level packaging equipment 2015-2020 ($ millions)
Exhibit 17: Global semiconductor packaging equipment market by end-user 2015 (% share)
Exhibit 18: Global semiconductor packaging equipment market by end-user 2020 (% share)
Exhibit 19: Global semiconductor packaging equipment market by OSAT 2015-2020 ($ millions)
Exhibit 20: Global semiconductor packaging equipment market by IDM 2015-2020 ($ millions)
Exhibit 21: Global semiconductor packaging equipment market by region 2015 (% share)
Exhibit 22: Global semiconductor packaging equipment market by region 2020 (% share)
Exhibit 23: Semiconductor packaging equipment market in APAC 2015-2020 ($ millions)
Exhibit 24: Semiconductor packaging equipment market in North America 2015-2020 ($ millions)
Exhibit 25: Semiconductor packaging equipment market in Europe 2015-2020 ($ millions)
Exhibit 26: Global semiconductor packaging equipment market 2015-2020 (% share)
Exhibit 27: CAGR of LED chip and sensor market 2015-2020
Exhibit 28: Impact of drivers
Exhibit 29: Impact of drivers (continued)
Exhibit 30: Global semiconductor market trend 1992-2015 ($ billions)
Exhibit 31: Impact of drivers and challenges
Exhibit 32: CAGR of 3D NAND and DRAM 2015-2020
Exhibit 33: Cars shipment growth forecast 2015-2020 (% growth)
Exhibit 34: Applied Materials: Segment-wise revenue contribution 2015 (% share)
Exhibit 35: Applied Materials: Segment-wise revenue break-up 2015 ($ billions)
Exhibit 36: Applied Materials: Silicon system segment performance 2014-2015 ($ billions)
Exhibit 37: Applied Materials: R&D expenses 2011-2015 ($ billions)
Exhibit 38: TEL: Sector performance by revenue 2012-2015
Exhibit 39: Tokyo Seimitsu: Business segmentation by revenue 2013-2015 ($ millions)
Exhibit 40: Other vendors in global semiconductor packaging equipment market



【掲載企業】

Applied Materials, ASM Pacific Technology, Kulicke and Soffa Industries, Tokyo Electron Limited, Tokyo Seimitsu, ChipMos, Greatek, Hua Hong, Jiangsu Changjiang Electronics Technology, Lingsen Precision, Nepes, Tianshui Huatian¸ Unisem, Ultratech.

【レポートのキーワード】

半導体パッケージング装置、ダイレベルパッケージング装置、ウエハレベルパッケージング装置、半導体製造

【調査方法】

一次資料による調査(業界専門家、ベンダー、代理店、顧客等を対象にしたデプスインタビュー調査など)及び二次資料による調査(Technavio独自のプラットフォーム、産業書籍、企業報告書、ニュース記事、アナリストレポート、貿易協会、政府機関発行データなど)

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