半導体成膜装置の世界市場2016-2020

◆英語タイトル:Global Semiconductor Deposition Market 2016-2020
◆商品コード:IRTNTR9100
◆発行会社(調査会社):Technavio
◆発行日:2016年6月14日
◆ページ数:76
◆レポート言語:英語
◆レポート形式:PDF
◆納品方法:Eメール(受注後24時間以内)
◆調査対象地域:グローバル
◆産業分野:産業装置
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当調査レポートでは、半導体成膜装置の世界市場について調査・分析し、エグゼクティブサマリー、市場概観、市場概観、業界の構造分析、半導体成膜装置の世界市場規模及び予測、技術別分析、需要先別分析、地域別分析/市場規模、主要国別分析、市場の成長要因、市場の課題、市場動向、競争状況などの情報をお届けいたします。
【レポートの概要】

About the Semiconductor Deposition Market
Semiconductor deposition is a process or technique of depositing a thin layer of a material on the surface area of a wafer or substrate. The added layer acts as a conductor, an insulator barrier, or a customized surface on which the semiconductor device pattern is etched. Materials that are used for the deposition are silicon, filaments, silicon dioxide, carbon nanotubes, tungsten, silicon carbide, silicon oxynitride, carbon fiber, silicon nitride, titanium nitride, silicon-germanium, and a number of high-k dielectrics. The thickness of the deposited layer usually ranges from a few to around 100 nm. Certain deposition techniques such as molecular beam epitaxy involve the deposition of a single layer of atom on the surface of wafers at a time. However, in CVD technology, the wafer is exposed to one or more volatile precursors, which react or decompose on the surface to give the desired deposit.

Technavio’s analysts forecast the global semiconductor deposition market to grow at a CAGR of 16.03% during the period 2016-2020.

[Covered in this report]
The report covers the present scenario and the growth prospects of the global semiconductor deposition market for 2016-2020. To calculate the market size, the report considers the sale of semiconductor deposition equipment to a number of global, regional, and local semiconductor device manufacturers.
The report does not include the revenue generated from the resale and aftermarket service of deposition equipment as well as the sale of components that are used for repairs of such devices.

The market is divided into the following segments based on geography:
• APAC
• Europe
• North America

Technavio’s report, Global Global Semiconductor Deposition market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

[Key vendors]
• Applied Materials
• ASM International
• Hitachi Kokusai Electric
• Lam Research
• Tokyo Electron

[Other prominent vendors]
• AIXTRON
• CANON ANELVA
• IHI
• IQE
• Plasma-Therm
• Veeco Instruments

[Market driver]
• Miniaturization of semiconductor devices
• For a full, detailed list, view our report

[Market challenge]
• Cyclical nature of semiconductor industry
• For a full, detailed list, view our report

[Market trend]
• Growing number of IoT applications
• For a full, detailed list, view our report

[Key questions answered in this report]
• What will the market size be in 2020 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?

※You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.

【レポートの目次】

PART 01: Executive summary
• Highlights

PART 02: Scope of the report
• Definition
• Source year and forecast period
• Market coverage
• Market size computation
• Geographical segmentation
• Vendor segmentation
• Top-vendor offerings

PART 03: Market research methodology
• Research methodology
• Economic indicators

PART 04: Introduction
• Key market highlights

PART 05: Market landscape
• Market overview
• Market size and forecast
• Five forces model

PART 06: Market segmentation by end-user
• Global semiconductor deposition market by end-user 2015
• Global semiconductor deposition market by end-user 2020
• Foundries
• Memory manufacturers
• IDMs

PART 07: Market segmentation by technology
• Global semiconductor deposition market by technology 2015
• Global semiconductor deposition market by technology 2020
• CVD
• Market size and forecast
• PVD
• ALD
• Epitaxy

PART 08: Geographical segmentation
• Global semiconductor deposition market by geography 2015
• Global semiconductor deposition market by geography 2020
• APAC
• North America
• Europe

PART 09: Key leading countries
• Taiwan
• South Korea
• Japan
• US
• China

PART 10: Market drivers
• Miniaturization of semiconductor devices
• Rising automation in automobiles
• Increasing number of fabs
• Growth of system-on-chip technology

PART 11: Impact of drivers

PART 12: Market challenges
• Limited number of customers
• Cyclical nature of semiconductor industry
• Rapid technological changes in semiconductor industry
• Dependency on limited key suppliers

PART 13: Impact of drivers and challenges

PART 14: Market trends
• Growing number of IoT applications
• High demand for memory devices
• Wearable technology
• Increasing wafer size
• Short replacement cycles of mobile devices
• Development of smart cities

PART 15: Vendor landscape
• Competitive scenario
• Key vendors
• Other prominent vendors

PART 16: Appendix
• List of abbreviations

PART 17: Explore Technavio

[List of Exhibits]

Exhibit 01: Key countries covered
Exhibit 02: Product offerings
Exhibit 03: Advantages of deposition
Exhibit 04: Factors influencing growth of film on substrate
Exhibit 05: Factors for selecting deposition material
Exhibit 06: Segmentation of global semiconductor deposition market 2015-2020
Exhibit 07: Global semiconductor deposition market 2015-2020 ($ billions)
Exhibit 08: Five forces model
Exhibit 09: Global semiconductor deposition market by end-user 2015 (% share)
Exhibit 10: Global semiconductor deposition market by end-user 2020 (% share)
Exhibit 11: Global semiconductor deposition market for foundries 2015-2020 ($ billions)
Exhibit 12: Global semiconductor deposition market for memory manufacturers 2015-2020 ($ billions)
Exhibit 13: Global semiconductor deposition market for IDMs 2015-2020 ($ billions)
Exhibit 14: Global semiconductor deposition market by technology 2015 (% share)
Exhibit 15: Global semiconductor deposition market by technology 2020 (% share)
Exhibit 16: Global semiconductor deposition market for CVD technology 2015-2020 ($ billions)
Exhibit 17: Advantages of CVD technology
Exhibit 18: Global semiconductor deposition market for PVD technology 2015-2020 ($ billions)
Exhibit 19: Global semiconductor deposition market for ALD technology 2015-2020 ($ billions)
Exhibit 20: Advantages of ALD technology
Exhibit 21: Global semiconductor deposition market for epitaxy 2015-2020 ($ millions)
Exhibit 22: Global semiconductor deposition market by geography 2015 (% share)
Exhibit 23: Global semiconductor deposition market by geography 2020 (% share)
Exhibit 24: Semiconductor deposition market in APAC 2015-2020 ($ billions)
Exhibit 25: Semiconductor deposition market in North America 2015-2020 ($ millions)
Exhibit 26: Global semiconductor deposition market in Europe 2015-2020 ($ billions)
Exhibit 27: Key leading countries
Exhibit 28: Percentage share of key leading countries 2015-2020
Exhibit 29: Semiconductor deposition market in Taiwan 2015-2020 ($ billions)
Exhibit 30: Semiconductor deposition market in South Korea 2015-2020 ($ billions)
Exhibit 31: Semiconductor deposition market in Japan 2015-2020 ($ billions)
Exhibit 32: Semiconductor deposition market in US 2015-2020 ($ billions)
Exhibit 33: Semiconductor deposition market in China 2015-2020 ($ billions)
Exhibit 34: Global MEMS market 2015-2020 ($ billions)
Exhibit 35: Expected car shipment 2015-2020
Exhibit 36: Global NAND flash market 2015-2020 (% share)
Exhibit 37: CAGR of LED chip and sensor markets 2015-2020
Exhibit 38: Impact of drivers
Exhibit 39: Global semiconductor market trend 1990-2015 ($ billions)
Exhibit 40: Impact of drivers and challenges
Exhibit 41: Requirement for IoT
Exhibit 42: CAGR of 3D NAND and DRAM 2015-2020
Exhibit 43: Timeline for semiconductor wafer size advancements
Exhibit 44: Key vendors
Exhibit 45: Applied Materials: R&D expenses 2011-2015 ($ billions)
Exhibit 46: Hitachi-Kokusai: R&D spending over two major business sectors
Exhibit 47: Lam Research: R&D expenses 2013-2015 ($ billions)
Exhibit 48: Tokyo Electron: Business performance by revenue 2012-2015 ($ billions)
Exhibit 49: Tokyo Electron: R&D expenses 2012-2015 ($ millions)
Exhibit 50: Other vendors in global semiconductor deposition market



【掲載企業】

Applied Materials, ASM International, Hitachi Kokusai Electric, Lam Research, Tokyo Electron, AIXTRON, CANON ANELVA, IHI, IQE, Plasma-Therm, Veeco Instruments.

【レポートのキーワード】

半導体成膜装置、半導体成膜技術、成長、物理蒸着(PVD)、化学蒸着(CVD)、半導体製造

【調査方法】

一次資料による調査(業界専門家、ベンダー、代理店、顧客等を対象にしたデプスインタビュー調査など)及び二次資料による調査(Technavio独自のプラットフォーム、産業書籍、企業報告書、ニュース記事、アナリストレポート、貿易協会、政府機関発行データなど)

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