LEDパッケージング装置の世界市場:ダイ・シンギュレーション、ダイ・アタッチ、基板分離、永久結合、LED検査

◆英語タイトル:Global Light Emitting Diode Packaging Equipment Market 2016-2020
◆商品コード:IRTNTR9712
◆発行会社(調査会社):Technavio
◆発行日:2016年6月28日
◆ページ数:78
◆レポート言語:英語
◆レポート形式:PDF
◆納品方法:Eメール(受注後24時間以内)
◆調査対象地域:グローバル
◆産業分野:電子
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当調査レポートでは、LEDパッケージング装置の世界市場について調査・分析し、エグゼクティブサマリー、市場概観、市場概観、業界の構造分析、LEDパッケージング装置の世界市場規模及び予測、製造プロセス別分析、地域別分析/市場規模、市場の成長要因、市場の課題、市場動向、競争状況などの情報をお届けいたします。
【レポートの概要】

About the Light Emitting Diode (LED) Packaging Equipment Market
The numerous benefits of LED lights have aided their growth traction among end-users. They are preferred over incandescent bulbs and compact fluorescent lamps (CFLs) as they are energy efficient (they consume almost 75% less energy than other bulbs) and have a long lifespan (which is pegged at 60,000 hours, compared to 1,500 hours of incandescent bulbs and 8,000 hours of CFLs). These features are the main reasons for the continued growth of LED lights, which are also known as green lighting systems.

Technavio’s analysts forecast the global light emitting diode (LED) packaging equipment market to grow at a CAGR of 1.51% during the period 2016-2020.

[Covered in this report]
The report covers the present scenario and the growth prospects of the global light emitting diode (LED) packaging equipment market for 2016-2020. To calculate the market size, Technavio considers revenue generated from the sale of LED packaging equipment for the following applications:
• Die singulation
• Die attach
• Substrate separation
• Permanent bonding
• LED package testing

The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA

Technavio’s report, Global Light Emitting Diode (LED) Packaging Equipment Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

[Key vendors]
• ASM Pacific Tech
• BESI
• Kulicke & Soffa
• Palomar Technologies
• TOWA

[Other prominent vendors]
• Daitron
• DISCO
• Nordson ASYMTEK
• SUSS MicroTec AG

[Market driver]
• Demand for enhanced display functionality in devices
• For a full, detailed list, view our report

[Market challenge]
• Cyclical nature of semiconductor market
• For a full, detailed list, view our report

[Market trend]
• Emergence of COB technology
• For a full, detailed list, view our report

[Key questions answered in this report]
• What will the market size be in 2020 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?

※You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.

【レポートの目次】

PART 01: Executive summary
• Highlights

PART 02: Scope of the report
• Definition
• Base year and forecast period
• Market coverage
• Market size calculation
• Geographical segmentation
• Vendor segmentation
• Top-vendor offerings

PART 03: Market research methodology
• Research methodology
• Economic indicators

PART 04: Introduction
• Key market highlights
• Types of LED packages
• LED packaging equipment market overview

PART 05: Industry landscape
• Global LED industry value chain
• LED production equipment

PART 06: Market landscape
• Market overview
• Market size and forecast
• Five forces analysis

PART 07: Market segmentation by process
• Global LED packaging equipment market by process
• Die singulation
• Die attach
• Substrate separation
• Permanent bonding
• LED testing

PART 08: Geographical segmentation
• Global LED packaging equipment market by region
• LED packaging equipment market in APAC
• LED packaging equipment market in Americas
• LED packaging equipment market in EMEA

PART 09: Market drivers

PART 10: Impact of drivers

PART 11: Market challenges

PART 12: Impact of drivers and challenges

PART 13: Market trends

PART 14: Vendor landscape
• Competitive scenario
• Key vendors
• Other prominent vendors

PART 15: Summary of key figures

PART 16: Appendix
• List of abbreviations

PART 17: Explore Technavio

Exhibit 01: List of countries in key regions
Exhibit 02: Product offerings
Exhibit 03: Benefits of LED lighting
Exhibit 04: Cost breakdown for manufacturing high- and medium-power LED packages
Exhibit 05: Countries with banned incandescent bulbs
Exhibit 06: Segmentation of global LED industry
Exhibit 07: LED manufacturing value chain
Exhibit 08: Value chain levels of LED manufacturers by regions
Exhibit 09: Categories of LED production equipment
Exhibit 10: Efficiency and cost of LEDs, incandescent bulbs, and CFLs
Exhibit 11: Prominent LED manufacturers
Exhibit 12: Significance of LED packaging equipment buying parameters for customer segment
Exhibit 13: Global LED packaging equipment market 2015-2020 ($ millions)
Exhibit 14: Forecast for LED market 2015-2020 ($ billions)
Exhibit 15: Japan’s 21st-century lighting plan
Exhibit 16: Five forces analysis
Exhibit 17: Global LED packaging equipment market by process 2015
Exhibit 18: Global LED packaging equipment market by process 2020
Exhibit 19: Global LED packaging equipment market by die singulation 2015-2020 ($ millions)
Exhibit 20: Global LED packaging equipment market by die attach 2015-2020 ($ millions)
Exhibit 21: Evolution of wafers in terms of size
Exhibit 22: Global LED packaging equipment market by substrate separation 2015-2020 ($ millions)
Exhibit 23: Global LED packaging equipment market by permanent bonding 2015-2020 ($ millions)
Exhibit 24: Global LED packaging equipment market by LED testing 2015-2020 ($ millions)
Exhibit 25: Global LED packaging equipment market by region 2015 (% share)
Exhibit 26: Global LED packaging equipment market by region 2015-2020
Exhibit 27: LED packaging equipment market in APAC 2015-2020 ($ millions)
Exhibit 28: Automobile production by countries 2015 (% share)
Exhibit 29: LED packaging equipment market in Americas 2015-2020 ($ millions)
Exhibit 30: LED packaging equipment market in EMEA 2015-2020 ($ millions)
Exhibit 31: Urbanization and growth rate of China, Brazil, and India
Exhibit 32: Degree of urbanization by region 2015
Exhibit 33: Impact of drivers
Exhibit 34: Global semiconductor market trend 1992-2015 ($ billions)
Exhibit 35: Impact of drivers and challenges
Exhibit 36: Principle parameters of competition
Exhibit 37: Comparison of leading vendors in global LED packaging equipment market 2015
Exhibit 38: ASM Pacific Tech: Company information
Exhibit 39: BESI: Company information
Exhibit 40: Kulicke & Soffa: Company information
Exhibit 41: Palomar Technologies: Company information
Exhibit 42: TOWA: Company information
Exhibit 43: TOWA: Capital expenditure ($ millions)
Exhibit 44: Other vendors in global LED packaging equipment market
Exhibit 45: Market size for LED packaging equipment ($ millions) and global LED market ($ billions): Year-over-year revenue comparison
Exhibit 46: Process segments: Year-over-year revenue comparison ($ millions)
Exhibit 47: Geographical segments: Year-over-year revenue comparison ($ billions)



【掲載企業】

ASM Pacific Tech, BESI, Kulicke & Soffa, Palomar Technologies, TOWA, Daitron, DISCO, Nordson ASYMTEK, SUSS MicroTec AG.

【レポートのキーワード】

ダイ・シンギュレーション、ダイ・アタッチ、基板分離、永久結合、LED検査、LEDパッケージング装置、LED製造、LED装置、半導体製造

【調査方法】

一次資料による調査(業界専門家、ベンダー、代理店、顧客等を対象にしたデプスインタビュー調査など)及び二次資料による調査(Technavio独自のプラットフォーム、産業書籍、企業報告書、ニュース記事、アナリストレポート、貿易協会、政府機関発行データなど)

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