FEOL(フロントエンド)半導体装置の世界市場2016-2020

◆英語タイトル:Global Front End of the Line Semiconductor Equipment Market 2016-2020
◆商品コード:IRTNTR10319
◆発行会社(調査会社):Technavio
◆発行日:2016年8月23日
◆ページ数:63
◆レポート言語:英語
◆レポート形式:PDF
◆納品方法:Eメール(受注後24時間以内)
◆調査対象地域:グローバル
◆産業分野:産業装置
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当調査レポートでは、FEOL(フロントエンド)半導体装置の世界市場について調査・分析し、エグゼクティブサマリー、市場概観、市場概観、業界の構造分析、FEOL(フロントエンド)半導体装置の世界市場規模及び予測、製品別分析、需要先別分析、地域別分析/市場規模、主要国別分析、市場の成長要因、市場の課題、市場動向、競争状況などの情報をお届けいたします。
【レポートの概要】

About Semiconductor Equipment Industry and Front-End Process
The semiconductor equipment industry is an important part of the overall semiconductor market, with semiconductor chipmakers investing 20% of their sales in obtaining manufacturing equipment. The equipment manufacturing companies are leading the development of most core process technologies in the semiconductor market. The semiconductor production equipment industry is divided into front-end and back-end process equipment. The front-end process includes advanced technology and integration. Investment in front-end equipment is more than back-end equipment, with 60% of the total investment made for front-end equipment. The front-end process is subdivided into front-end-of-the-line (FEOL) and back-end-of-the-line (BEOL).

Technavio’s analysts forecast the global front-end-of-the-line (FEOL) semiconductor equipment market to grow at a CAGR of 1.78% during the period 2016-2020.

[Covered in this report]
The report covers the present scenario and the growth prospects of the global front-end-of-the-line (FEOL) semiconductor equipment market for 2016-2020. To calculate the market size, the report considers revenue generated from the sales of FEOL semiconductor equipment.

The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA

Technavio’s report, Global Front-End-Of-The-Line (FEOL) Semiconductor Equipment Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

[Key vendors]
• Applied Materials
• ASML
• KLA-Tencor
• Lam Research
• Tokyo Electron

[Other prominent vendors]
• Dainippon Screen Manufacturing
• Hitachi High-Technologies
• Nikon
• Hitachi Kokusai Electric

[Market driver]
• Increase in number of fabs worldwide
• For a full, detailed list, view our report

[Market challenge]
• High cost of equipment
• For a full, detailed list, view our report

[Market trend]
• Proliferation of automotive electronics
• For a full, detailed list, view our report

[Key questions answered in this report]
• What will the market size be in 2020 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?

※You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.

【レポートの目次】

PART 01: Executive summary
• Highlights

PART 02: Scope of the report
• Market overview
• Definition
• Source year and forecast period
• Product segmentation
• End-user segmentation
• Geographical segmentation
• Common currency conversion rates
• Top-vendor offerings

PART 03: Market research methodology
• Research methodology
• Economic indicators

PART 04: Introduction
• Key market highlights

PART 05: Technology landscape
• Technology landscape of wafer fab equipment
• Wafer-level manufacturing equipment categories
• Key customers

PART 06: Market landscape
• Market overview
• Market size and forecast
• Five forces analysis

PART 07: Market segmentation by product
• Market overview
• Market size and forecast

PART 08: Market segmentation by end-user
• Market overview
• Market size and forecast
• Foundry
• Memory
• IDM

PART 09: Geographical segmentation
• Global FEOL semiconductor equipment market by geography
• Market size and forecast
• APAC
• Americas
• EMEA

PART 10: Key leading countries
• Taiwan
• South Korea
• Japan

PART 11: Market drivers
• Increase in number of fabs worldwide
• Growth of advanced consumer electronics market
• Miniaturization of electronic devices
• Advent of 3D ICs

PART 12: Impact of drivers

PART 13: Market challenges
• High cost of equipment
• Long payback period
• Fluctuations in the semiconductor industry

PART 14: Impact of drivers and challenges

PART 15: Market trends
• Proliferation of automotive electronics
• Growing number of connected devices through IoT and other emerging markets
• Increasing investment in memory capacity
• Shorter replacement cycle of smart devices
• Adoption of FinFET architecture

PART 16: Vendor landscape
• Competitive scenario
• Other prominent vendors

PART 17: Explore Technavio

[List of Exhibits]

Exhibit 01: List of major countries considered
Exhibit 02: Product offerings
Exhibit 03: Semiconductor production equipment
Exhibit 04: Semiconductor IC manufacturing process
Exhibit 05: Front-end chip formation steps
Exhibit 06: Back-end chip formation steps
Exhibit 07: Wafer-level manufacturing equipment categories
Exhibit 08: Requirements of a manufacturing equipment
Exhibit 09: Global FEOL semiconductor equipment market 2015-2020 ($ billions)
Exhibit 10: Five forces analysis
Exhibit 11: Global FEOL semiconductor equipment market by product 2015-2020 (% share)
Exhibit 12: Global FEOL semiconductor equipment market by product 2015-2020 ($ billions)
Exhibit 13: Global FEOL semiconductor equipment market by end-user 2015-2020 (% share)
Exhibit 14: Global FEOL semiconductor equipment market by end-user 2015-2020 ($ billions)
Exhibit 15: Global FEOL semiconductor equipment market by foundry segment 2015-2020 ($ billions)
Exhibit 16: Global FEOL semiconductor equipment market by memory segment 2015-2020 ($ billions)
Exhibit 17: Global FEOL semiconductor equipment market by IDM segment 2015-2020 ($ billions)
Exhibit 18: Global FEOL semiconductor equipment market by geography 2015-2020 (% share)
Exhibit 19: Global FEOL semiconductor equipment market by geography 2015-2020 ($ billions)
Exhibit 20: FEOL semiconductor equipment market in APAC 2015-2020 ($ billions)
Exhibit 21: Global wearables market 2015-2020 ($ billions)
Exhibit 22: FEOL semiconductor equipment market in Americas 2015-2020 ($ billions)
Exhibit 23: FEOL semiconductor equipment market in EMEA 2015-2020 ($ billions)
Exhibit 24: Global NAND flash market 2015-2020 (% share)
Exhibit 25: Consumer electronics market 2015-2020 (unit shipment in millions)
Exhibit 26: Global MEMS market 2015-2020
Exhibit 27: Impact of drivers
Exhibit 28: Global semiconductor market trend 1990-2015 ($ billions)
Exhibit 29: Impact of drivers and challenges
Exhibit 30: Cars shipment growth forecast 2015-2020 (% growth)
Exhibit 31: IoT spending and device penetration 2014, 2015, and 2020
Exhibit 32: CAGR of 3D NAND and DRAM 2015-2020
Exhibit 33: Key vendors
Exhibit 34: ASML customers by end-user segment
Exhibit 35: Other prominent vendors



【掲載企業】

Applied Materials, ASML, KLA-Tencor, Lam Research, Tokyo Electron, Dainippon Screen Manufacturing, Hitachi High-Technologies, Nikon, Hitachi Kokusai Electric

【レポートのキーワード】

FEOL(フロントエンド)、半導体装置、半導体前工程、フロントエンドプロセス、バックエンド

【調査方法】

一次資料による調査(業界専門家、ベンダー、代理店、顧客等を対象にしたデプスインタビュー調査など)及び二次資料による調査(Technavio独自のプラットフォーム、産業書籍、企業報告書、ニュース記事、アナリストレポート、貿易協会、政府機関発行データなど)

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