チップマウンターの世界市場:スルーホール実装技術(THT)、面実装技術(SMT)

◆英語タイトル:Global Chip Mounter Market 2016-2020
◆商品コード:IRTNTR9621
◆発行会社(調査会社):Technavio
◆発行日:2016年6月28日
◆ページ数:58
◆レポート言語:英語
◆レポート形式:PDF
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◆調査対象地域:グローバル
◆産業分野:産業装置
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当調査レポートでは、チップマウンターの世界市場について調査・分析し、エグゼクティブサマリー、市場概観、市場概観、業界の構造分析、チップマウンターの世界市場規模及び予測、用途別分析、技術別分析、地域別分析/市場規模、市場の成長要因、市場の課題、市場動向、競争状況などの情報をお届けいたします。
【レポートの概要】

About the Chip Mounter Market
The chip mounting technology has progressed significantly over the last two decades in terms of a practical solution for achieving higher densities related to packaging systems. It started with the conventional through hole technology (THT), then resurfaced as surface mount technology (SMT) and fine pitch technology (FPT). Most manufacturers are using both SMT and THT to produce chips mounted on substrates. The dynamic semiconductor packaging technology has evolved with the help of THT (with component steers through 2.54 mm hole). Then comes SMT, which leads on 1.27 mm hole with minimal sized centers. The FPT leads on 0.63 mm as well as 0.50 mm centers. The component package mainly consists of a silicon-based die or integrated circuits chips, which got reduced to a large extent within the last two decades. Thus, the chip mounting technology has moved from a big diameter to a small diameter of space.

Technavio’s analysts forecast the global chip mounter market to grow at a CAGR of 8.05% during the period 2016-2020.

[Covered in this report]
The report covers the present scenario and the growth prospects of the global chip mounter market for 2016-2020. To calculate the market size, the report considers revenue from the sales of chip mounter equipment.

The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA

Technavio’s report, Global Chip Mounter Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

[Key vendors]
• Hitachi
• Juki Corporation
• Nitto Denko Corporation
• Panasonic
• Yamaha Corporation

[Other prominent vendors]
• ASM Pacific Technology
• Canon
• Essemtec
• Ohashi Engineering
• Nordson
• Samsung Techwin
• Sony
• Sun Electric Industries
• TOA

[Market driver]
• Growing adoption of communication-related consumer electronic gadgets
• For a full, detailed list, view our report

[Market challenge]
• Uncertain global economic conditions
• For a full, detailed list, view our report

[Market trend]
• Emergence of wearable technology
• For a full, detailed list, view our report

[Key questions answered in this report]
• What will the market size be in 2020 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?

※You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.

【レポートの目次】

PART 01: Executive summary
• Highlights

PART 02: Scope of the report
• Report coverage
• Base year and forecast period
• Geographical segmentation
• Common currency conversion rates
• Vendor offerings

PART 03: Market research methodology
• Research methodology
• Economic indicators

PART 04: Introduction
• Key market highlights
• Technology landscape

PART 05: Industry overview
• Overview of semiconductor packaging industry
• Global semiconductor industry value chain

PART 06: Market landscape
• Market overview
• Market size and forecast
• Five forces analysis

PART 07: Market segmentation by technology
• Global chip mounter market by technology
• SMT segment
• THT segment

PART 08: Market segmentation by application
• Global chip mounter market by application
• Application segmentation

PART 09: Geographical segmentation
• Global chip mounter market by region
• APAC
• EMEA
• Americas

PART 10: Market drivers
• Growing adoption of communication-related electronic gadgets
• Increase in chip density
• Miniaturization of electronics

PART 11: Impact of drivers

PART 12: Market challenges
• Cyclical nature of semiconductor industry
• Uncertain global economic conditions

PART 13: Impact of drivers and challenges

PART 14: Market trends
• Growing focus on IoT
• Increasing automation in automobiles
• Emergence of wearable technology

PART 15: Vendor landscape
• Competitive scenario
• Other prominent vendors

PART 16: Market summary
• Market figure snapshot

PART 17: Appendix
• List of abbreviations

PART 18: Explore Technavio

Exhibit 01: Global chip mounter market segmentation
Exhibit 02: Major countries covered
Exhibit 03: Currency conversion rates
Exhibit 04: Product offerings
Exhibit 05: Changes in semiconductor packaging size and component density
Exhibit 06: Evolution of semiconductor IC packaging
Exhibit 07:.5D IC packaging technology using TSVs and silicon interposers
Exhibit 08:D semiconductor packaging technology using TSVs
Exhibit 09: Semiconductor value chain
Exhibit 10: Front-end processes
Exhibit 11: Back-end processes
Exhibit 12: Global chip mounter market forecast 2015-2020 ($ billions)
Exhibit 13: Five forces analysis
Exhibit 14: Global chip mounter market by technology 2015
Exhibit 15: Global chip mounter market by technology 2020
Exhibit 16: SMT segment forecast of global chip mounter market 2015-2020 ($ billions)
Exhibit 17: THT segment forecast of global chip mounter market 2015-2020 ($ millions)
Exhibit 18: Global chip mounter market by application 2015-2020 (% share)
Exhibit 19: Global chip mounter market by application 2015-2020 ($ billions)
Exhibit 20: Global chip mounter market by communication segment 2015-2020 ($ billions)
Exhibit 21: Global chip mounter market by computer segment 2015-2020 ($ billions)
Exhibit 22: Global chip mounter market by consumer electronics segment 2015-2020 ($ millions)
Exhibit 23: Global chip mounter market by automotive segment 2015-2020 ($ millions)
Exhibit 24: Global chip mounter market by region 2015
Exhibit 25: Global chip mounter market by region 2020
Exhibit 26: Chip mounter market in APAC 2015-2020 ($ billions)
Exhibit 27: Chip mounter market in EMEA 2015-2020 ($ billions)
Exhibit 28: Chip mounter market in Americas 2015-2020 ($ billions)
Exhibit 29: Global smartphone shipment forecast 2015-2020 (millions of units)
Exhibit 30: Global tablet shipments forecast 2015-2020 (millions of units)
Exhibit 31: Impact of drivers
Exhibit 32: Impact of drivers and challenges
Exhibit 33: Other prominent vendors
Exhibit 34: Key inferences
Exhibit 35: Market summary of global chip mounter market 2015-2020
Exhibit 36: Technology segments: Year-over-year revenue comparison ($ billions)
Exhibit 37: Geographical segments: Year-over-year revenue comparison ($ billions)
Exhibit 38: Geographical segments: Year-over-year revenue comparison ($ billions)



【掲載企業】

Hitachi, Juki Corporation, Nitto Denko Corporation, Panasonic, Yamaha Corporation, ASM Pacific Technology, Canon, Essemtec, Ohashi Engineering, Nordson, Samsung Techwin, Sony, Sun Electric Industries, TOA.

【レポートのキーワード】

チップマウンター、スルーホール実装技術(THT)、面実装技術(SMT)、チップ実装技術

【調査方法】

一次資料による調査(業界専門家、ベンダー、代理店、顧客等を対象にしたデプスインタビュー調査など)及び二次資料による調査(Technavio独自のプラットフォーム、産業書籍、企業報告書、ニュース記事、アナリストレポート、貿易協会、政府機関発行データなど)

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