BEOL(バックエンド)半導体装置の世界市場:ステッパー、CVD装置、塗布・現像装置、ウェットステーション、PVD装置、CMP装置、金属エッチング装置

◆英語タイトル:Global Back End of the Line Semiconductor Equipment Market 2016-2020
◆商品コード:IRTNTR10233
◆発行会社(調査会社):Technavio
◆発行日:2016年8月26日
◆ページ数:61
◆レポート言語:英語
◆レポート形式:PDF
◆納品方法:Eメール(受注後24時間以内)
◆調査対象地域:グローバル
◆産業分野:産業装置
◆販売価格オプション(消費税別)
Single User(1名利用)USD2,500 ⇒換算¥277,500見積依頼/購入/質問フォーム
Five User(~5名利用)USD3,000 ⇒換算¥333,000見積依頼/購入/質問フォーム
Enterprise License(全社内共有可)USD4,000 ⇒換算¥444,000見積依頼/購入/質問フォーム
販売価格オプションの説明はこちらでご確認ください。
※お支払金額は「換算金額(日本円)+消費税+配送料(Eメール納品は無料)」です。
※本体価格が¥30,000未満のレポートにつきましては、ハンドリングチャージ¥5,000が別途かかります。
※Eメールによる納品の場合、通常ご注文当日~2日以内に納品致します。
※レポート納品後、納品日+5日以内に請求書を発行し、お客様宛に郵送いたしますので、請求書発行日より2ヶ月以内に銀行振込にて支払をお願いします。(支払期限と方法は調整可能、振込先:三菱東京UFJ銀行/京橋支店/H&Iグローバルリサーチ株式会社)
※為替レートは適宜修正・更新しております。リアルタイム更新ではありません。
※弊社H&Iグローバルリサーチ株式会社はTechnavio社の日本における正規販売代理店です。Technavio社の概要及び新刊レポートはこちらでご確認いただけます。
当調査レポートでは、BEOL(バックエンド)半導体装置の世界市場について調査・分析し、エグゼクティブサマリー、市場概観、市場概観、業界の構造分析、BEOL(バックエンド)半導体装置の世界市場規模及び予測、製品別分析、需要先別分析、地域別分析/市場規模、主要国別分析、市場の成長要因、市場の課題、市場動向、競争状況などの情報をお届けいたします。
【レポートの概要】

About Semiconductor Equipment Industry
The semiconductor equipment industry is an important part of the overall semiconductor market, with semiconductor chip makers investing 20% of their sales toward obtaining manufacturing equipment. The equipment manufacturing companies are leading the development of most core process technologies in the semiconductor market. The semiconductor production equipment industry is divided into front-end and back-end process equipment.

Technavio’s analysts forecast the global back end of the line semiconductor equipment market to grow at a CAGR of 1.41% during the period 2016-2020.

[Covered in this report]
The report covers the present scenario and the growth prospects of the global back end of the line semiconductor equipment market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sales of BEOL semiconductor equipment.

The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA

Technavio’s report, Global Back End of the Line Semiconductor Equipment Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

[Key vendors]
• Applied Materials
• ASML
• KLA-Tencor
• Lam Research
• TEL

[Other prominent vendors]
• Dainippon Screen Manufacturing
• Hitachi High-Technologies
• Hitachi Kokusai Electric
• Nikon

[Market driver]
• Rising demand for flip chip and advanced packaging technologies
• For a full, detailed list, view our report

[Market challenge]
• Dependency on few key suppliers
• For a full, detailed list, view our report

[Market trend]
• Increased need for semiconductor memory devices
• For a full, detailed list, view our report

[Key questions answered in this report]
• What will the market size be in 2020 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?

※You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.

【レポートの目次】

PART 01: Executive summary
• Highlights

PART 02: Scope of the report
• Market overview
• Definition
• Base year
• Product segmentation
• End-user segmentation
• Geographical segmentation
• Vendor selection
• Common currency conversion rates
• Top-vendor offerings

PART 03: Market research methodology
• Research methodology
• Economic indicators

PART 04: Introduction
• Key market highlights

PART 05: Market landscape
• Technology landscape of wafer fab equipment
• Wafer-level manufacturing equipment categories
• Key customers
• Market size and forecast
• Five forces analysis

PART 06: Market segmentation by product
• Market overview
• Market size and forecast
• Stepper
• CVD equipment
• Coater developer
• Wet station
• PVD equipment
• CMP equipment
• Metal etching equipment

PART 07: Market segmentation by end user
• Market overview
• Market size and forecast
• Foundry
• Memory
• IDM

PART 08: Geographical segmentation
• Market size and forecast
• APAC
• Americas
• EMEA

PART 09: Key leading countries

PART 10: Market drivers
• Increase in number of fabs
• Miniaturization of electronic devices
• Proliferation of advanced consumer electronic products
• Rising demand for flip chip and advanced packaging technologies
• High requirement of SoC technology

PART 11: Impact of drivers

PART 12: Market challenges
• Dependency on few key suppliers
• High investment market
• Fluctuations in the semiconductor industry

PART 13: Impact of drivers and challenges

PART 14: Market trends
• Increase in the number of fabless semiconductor companies
• Increased need for semiconductor memory devices
• Growing application of IoT
• Vehicle automation

PART 15: Vendor landscape
• Competitive landscape
• Other prominent vendors

PART 16: Explore Technavio

[List of Exhibits]

Exhibit 01: List of major countries considered
Exhibit 02: Common currency conversion rates
Exhibit 03: Product offerings
Exhibit 04: Semiconductor production equipment
Exhibit 05: Semiconductor IC manufacturing process
Exhibit 06: Front-end chip formation steps
Exhibit 07: Back-end chip formation steps
Exhibit 08: Wafer-level manufacturing equipment categories
Exhibit 09: Requirements of a manufacturing equipment
Exhibit 10: Global BEOL semiconductor equipment market ($ billions)
Exhibit 11: Five forces analysis
Exhibit 12: Global BEOL semiconductor equipment market by product 2015-2020 (% share)
Exhibit 13: Global BEOL semiconductor equipment market by product 2015-2020 ($ billions)
Exhibit 14: Global BEOL semiconductor equipment market by stepper segment 2015-2020 ($ billions)
Exhibit 15: Global BEOL semiconductor equipment market by CVD equipment segment 2015-2020 ($ billions)
Exhibit 16: Global BEOL semiconductor equipment market by coater developer segment 2015-2020 ($ billions)
Exhibit 17: Global BEOL semiconductor equipment market by wet station segment 2015-2020 ($ billions)
Exhibit 18: Global BEOL semiconductor equipment market by PVD equipment segment 2015-2020 ($ billions)
Exhibit 19: Global BEOL semiconductor equipment market by CMP equipment segment 2015-2020 ($ billions)
Exhibit 20: Global BEOL semiconductor equipment market by metal etching equipment segment 2015-2020 ($ billions)
Exhibit 21: Global BEOL semiconductor equipment market by end-user 2015-2020 (% share)
Exhibit 22: Global BEOL semiconductor equipment market by end-user 2015-2020 ($ billions)
Exhibit 23: Global BEOL semiconductor equipment market by foundry segment 2015-2020 ($ billions)
Exhibit 24: Global BEOL semiconductor equipment market by memory segment 2015-2020 ($ billions)
Exhibit 25: Global BEOL semiconductor equipment market by IDM segment 2015-2020 ($ billions)
Exhibit 26: Segmentation of global BEOL semiconductor equipment market by geography 2015-2020 (% share)
Exhibit 27: Segmentation of global BEOL semiconductor equipment market by geography 2015-2020 ($ millions)
Exhibit 28: BEOL semiconductor equipment market in APAC ($ billions)
Exhibit 29: BEOL semiconductor equipment market in Americas ($ billions)
Exhibit 30: BEOL semiconductor equipment market in EMEA ($ billions)
Exhibit 31: Global NAND flash market 2015-2020 (% share)
Exhibit 32: Impact of drivers
Exhibit 33: Impact of drivers and challenges
Exhibit 34: CAGR of 3D NAND and DRAM 2015-2020
Exhibit 35: Cars shipment growth forecast 2015-2020 (% growth)
Exhibit 36: Key vendors
Exhibit 37: ASML customers by end-user segment
Exhibit 38: Other prominent vendors



【掲載企業】

Applied Materials, ASML, KLA-Tencor, Lam Research, TEL, Dainippon Screen Manufacturing, Hitachi High-Technologies, Hitachi Kokusai Electric, and Nikon.

【レポートのキーワード】

半導体装置、バックエンド半導体装置、BEOL(バックエンド)、ステッパー、CVD装置、塗布・現像装置、ウェットステーション、PVD装置、CMP装置、金属エッチング装置

【調査方法】

一次資料による調査(業界専門家、ベンダー、代理店、顧客等を対象にしたデプスインタビュー調査など)及び二次資料による調査(Technavio独自のプラットフォーム、産業書籍、企業報告書、ニュース記事、アナリストレポート、貿易協会、政府機関発行データなど)

★調査レポート[BEOL(バックエンド)半導体装置の世界市場:ステッパー、CVD装置、塗布・現像装置、ウェットステーション、PVD装置、CMP装置、金属エッチング装置]販売に関する免責事項
★調査レポート[BEOL(バックエンド)半導体装置の世界市場:ステッパー、CVD装置、塗布・現像装置、ウェットステーション、PVD装置、CMP装置、金属エッチング装置]についてメールでお問い合わせ


◆H&Iグローバルリサーチのお客様(例)◆