3D半導体パッケージングの世界市場2016-2020

◆英語タイトル:Global 3D Semiconductor Packaging Market 2016-2020
◆商品コード:IRTNTR9277
◆発行会社(調査会社):Technavio
◆発行日:2016年6月28日
◆ページ数:54
◆レポート言語:英語
◆レポート形式:PDF
◆納品方法:Eメール(受注後24時間以内)
◆調査対象地域:グローバル
◆産業分野:電子
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当調査レポートでは、3D半導体パッケージングの世界市場について調査・分析し、エグゼクティブサマリー、市場概観、市場概観、業界の構造分析、3D半導体パッケージングの世界市場規模及び予測、用途別分析、地域別分析/市場規模、市場の成長要因、市場の課題、市場動向、競争状況などの情報をお届けいたします。
【レポートの概要】

About the 3D Semiconductor Packaging Market
Recent technology advances along with improved durability, reduced energy consumption, superior performance, enhanced quality, and highly efficient features of 3D semiconductor packaging equipment are making this equipment attractive packaging proposition in the semiconductor industry, especially in the consumer electronics industry. The increasing demand for consumer electronics is expected to increase the revenue of the global 3D semiconductor packaging market during the forecast period.

Technavio’s analysts forecast the global 3D semiconductor packaging market to grow at a CAGR of 16.27% during the period 2016-2020.

[Covered in this report]
The report covers the present scenario and the growth prospects of the global 3D semiconductor packaging market for 2016-2020. To calculate the market size, the report considers revenue generated from the sales of 3D semiconductor packaging equipment to semiconductor component manufacturers.

The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA

Technavio’s report, Global 3D Semiconductor Packaging Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

[Key vendors]
• Amkor Technology
• SUSS Microtek
• EV Group
• Tokyo Electron

[Other prominent vendors]
• ACCRETECH Tokyo Seimitsu
• Rudolph Technologies
• SEMES
• Ultratech
• ULVAC

[Market driver]
• Need to control chip design costs
• For a full, detailed list, view our report

[Market challenge]
• High capital investment in 3D semiconductor packaging
• For a full, detailed list, view our report

[Market trend]
• Short replacement cycle of portable electronic devices
• For a full, detailed list, view our report

[Key questions answered in this report]
• What will the market size be in 2020 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?

※You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.

【レポートの目次】

PART 01: Executive summary
• Highlights

PART 02: Scope of the report
• Definition
• Report overview
• Base year and forecast period
• Geographical segmentation
• Common currency conversion rates
• Vendor offerings

PART 03: Market research methodology
• Research methodology
• Economic indicators

PART 04: Introduction
• Key market highlights
• Technology landscape
• Industry overview
• Global semiconductor industry value chain

PART 05: Market landscape
• Market overview
• Market size and forecast
• Five forces analysis

PART 06: Market segmentation by application
• Global 3D semiconductor packaging market by application 2015-2020
• Consumer electronics
• Others

PART 07: Geographical segmentation
• 3D semiconductor packaging market in APAC
• 3D semiconductor packaging market in EMEA
• The Americas

PART 08: Market drivers

PART 09: Impact of drivers

PART 10: Market challenges

PART 11: Impact of drivers and challenges

PART 12: Market trends

PART 13: Vendor landscape
• Competitive scenario
• Other prominent vendors

PART 14: Market summary

PART 15: Appendix
• List of abbreviations

PART 16: Explore Technavio

[List of Exhibits]

Exhibit 01: Global 3D semiconductor packaging market 2015
Exhibit 02: Product offerings
Exhibit 03:D semiconductor packaging technology using TSVs
Exhibit 04: Evolution of semiconductor IC packaging
Exhibit 05: Color code indicating starting period of each packaging solutions
Exhibit 06:.5 D IC packaging technology using TSVs and silicon interposer
Exhibit 07: Semiconductor value chain
Exhibit 08: Front-end processes
Exhibit 09: Back-end processes
Exhibit 10: Global 3D semiconductor packaging market 2015-2020 ($ billions)
Exhibit 11: Five forces analysis
Exhibit 12: Global 3D semiconductor packaging market by application 2015
Exhibit 13: Global 3D semiconductor packaging market by application 2020
Exhibit 14: Consumer electronics segment in global 3D semiconductor packaging market ($ billions)
Exhibit 15: Global 3D semiconductor packaging market by others segment ($ millions)
Exhibit 16: Revenue generation in 2015 Revenue generation in 2020
Exhibit 17:D semiconductor packaging market in APAC 2015-2020 ($ billions)
Exhibit 18:D semiconductor packaging market in EMEA 2015-2020 ($ billions)
Exhibit 19:D semiconductor packaging market in Americas 2015-2020 ($ millions)
Exhibit 20: Global smartphone shipment forecast 2015-2020 (millions of units)
Exhibit 21: Global tablet shipments forecast 2015-2020 (millions of units)
Exhibit 22: Impact of drivers
Exhibit 23: Impact of drivers and challenges
Exhibit 24: Global MEMS market 2015-2020 ($ billions)
Exhibit 25: Principle parameters of competition
Exhibit 26: Comparison of leading vendors in global 3D semiconductor packaging market 2015
Exhibit 27: Amkor Technology: Revenue comparison from top application segments
Exhibit 28: Other prominent vendors in global 3D semiconductor packaging market
Exhibit 29: Market summary of 3D semiconductor packaging market 2015-2020
Exhibit 30: Application segments: Year-over-year revenue comparison ($ billions)
Exhibit 31: Geographical segments: Year-over-year revenue comparison ($ billions)
Exhibit 32: Application segments: Year-over-year revenue comparison (%)
Exhibit 33: Geographical segments: Year-over-year revenue comparison (%)



【掲載企業】

Amkor Technology, SUSS Microtek, EV Group, Tokyo Electron, ACCRETECH Tokyo Seimitsu, Rudolph Technologies, SEMES, Ultratech, ULVAC.

【レポートのキーワード】

3D半導体パッケージング、3D半導体パッケージング装置、半導体部品、家電製品

【調査方法】

一次資料による調査(業界専門家、ベンダー、代理店、顧客等を対象にしたデプスインタビュー調査など)及び二次資料による調査(Technavio独自のプラットフォーム、産業書籍、企業報告書、ニュース記事、アナリストレポート、貿易協会、政府機関発行データなど)

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