インタコネクト部品の世界市場:ケーブルアセンブリ、コネクター

◆英語タイトル:Global Interconnect Market 2015-2019
◆商品コード:IRTNTR6610
◆発行会社(調査会社):Technavio
◆発行日:2015年8月5日
◆ページ数:78
◆レポート言語:英語
◆レポート形式:pdf
◆納品方法:Eメール
◆調査対象地域:グローバル
◆産業分野:部品
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【レポートの概要】

About Interconnect Device
Interconnect is an electrical connection that connects two or more devices. It derives its applications in the process and discrete industries by facilitating effective interconnection and smooth operations. With the increase in integration of IT and electronics in process and discrete industries, there is a growing need of interconnects which can connect various devices in use and provide real-time information to the operators on shop-floor.

Technavio’s analysts forecast the global interconnect market to grow at a CAGR of 8.68% over the period 2014-2019.

[Covered in this Report]
The report includes the present scenario and the growth prospects of the global interconnect market for the period 2015-2019. The market can be segmented into two divisions: connectors and cable assemblies.

Technavio’s report, Global Interconnect Market 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the APAC, Europe, and North America; it also covers the landscape of the global interconnect market and its growth prospects in the coming years. The report includes a discussion of the key vendors operating in this market.

[Key Regions]
• APAC
• Europe
• North America

[Key Vendors]
• Amphenol
• Foxconn
• Molex
• TE Connectivity
• Yazaki

[Other Prominent Vendors]
• 3M
• Alstom SA
• Belden Incorporated
• Delphi
• JST
• Phoenix Contact
• Rosenberger
• Sumitomo Wiring Systems

[Market Driver]
• Increasing Demand for Bandwidth
• For a full, detailed list, view our report

[Market Challenge]
• Absence of Uniform Standard
• For a full, detailed list, view our report

[Market Trend]
• Real-time Data for Industrial Applications
• For a full, detailed list, view our report

[Key Questions Answered in this Report]
• What will the market size be in 2019 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?

【レポートの目次】

01. Executive Summary

02.List of Abbreviations

03.Scope of the Report
03.1 Market Overview
03.2 Product Offerings

04.Market Research Methodology
04.1 Market Research Process
04.2 Research Methodology

05.Introduction

06.Market Landscape
06.1 Market Overview
06.2 Market Size and Forecast
06.3 Five Forces Analysis

07.Geographical Segmentation
07.1 Global Interconnect Market by Geographical Segmentation 2014-2019
07.2 Interconnect Market in the APAC Region
07.2.1 Market Size and Forecast
07.3 Interconnect Market in the Europe
07.3.1 Market Size and Forecast
07.4 Interconnect Market in North America
07.4.1 Market Size and Forecast
07.5 Interconnect Market in RoW
07.5.1 Market Size and Forecast

08.Market Segmentation by Product
08.1 Global Interconnect Market by Product 2014-2019
08.2 Global Interconnect Market by Product: Cable Assembly
08.2.1 Market Size and Forecast
08.3 Global Interconnect Market by Product: Connector
08.3.1 Market Size and Forecast

09.Market Segmentation by End-users
09.1 Global Interconnect Market by End-users 2014-2019
09.2 Global Interconnect Market by End-user: Automotive
09.2.1 Market Size and Forecast
09.3 Global Interconnect Market by End-user: IT
09.3.1 Market Size and Forecast
09.4 Global Interconnect Market by End-user: Telecommunication
09.4.1 Market Size and Forecast
09.5 Global Interconnect Market by End-user: Industrial
09.5.1 Market Size and Forecast
09.6 Global Interconnect Market by End-user: Others
09.6.1 Market Size and Forecast

10.Buying Criteria

11.Market Growth Drivers

12.Drivers and their Impact

13.Market Challenges

14.Impact of Drivers and Challenges

15.Market Trends

16.Trends and their Impact

17.Vendor Landscape
17.1 Competitive Scenario
17.2 Other Prominent Vendors

18.Key Vendor Analysis
18.1 Amphenol
18.1.1 Key Facts
18.1.2 Business Overview
18.1.3 Business Segmentation by Revenue 2013
18.1.4 Products Segmentation by Revenue 2012 and 2013
18.1.5 Geographical Segmentation by Revenue 2013
18.1.6 Business Strategy
18.1.7 Recent Developments
18.1.8 SWOT Analysis
18.2 Hon Hai (Foxconn)
18.2.1 Key Facts
18.2.2 Business Overview
18.2.3 Geographical Segmentation by Revenue 2013
18.2.4 Recent Developments
18.2.5 SWOT Analysis
18.3 Molex
18.3.1 Key Facts
18.3.2 Business Overview
18.3.3 Market Segmentation by Revenue 2013
18.3.4 Product Segmentation by Revenue 2013
18.3.5 Product Segmentation by Revenue 2012 and 2013
18.3.6 Geographical Segmentation by Revenue 2013
18.3.7 Business Strategy
18.3.8 Recent Developments
18.3.9 SWOT Analysis
18.4 TE Connectivity
18.4.1 Key Facts
18.4.2 Business Overview
18.4.3 Business Segmentation by Revenue 2013
18.4.4 Business Segmentation by Revenue 2012 and 2013
18.4.5 Geographical Segmentation by Revenue 2013
18.4.6 Business Strategy
18.4.7 Recent Developments
18.4.8 SWOT Analysis
18.5 Yazaki
18.5.1 Key Facts
18.5.2 Business Overview
18.5.3 Key Offerings
18.5.4 Net Sales by 2012 and 2013
18.5.5 Geographical Segmentation by Revenue 2014
18.5.6 SWOT Analysis

19.Other Reports in this Series

[List of Exhibits]

Exhibit 1: Market Research Methodology
Exhibit 2: Interconnect Components
Exhibit 3: Global Interconnect Market
Exhibit 4: Global Interconnect Market 2014-2019 ($ billions)
Exhibit 5: Interconnect Market by Geographical Segmentation 2014-2019
Exhibit 6: Interconnect Market in APAC Region 2014-2019 ($ billions)
Exhibit 7: Interconnect Market in Europe 2014-2019 ($ billions)
Exhibit 8: Interconnect Market in North America 2014-2019 ($ billions)
Exhibit 9: Interconnect Market in RoW 2014-2019 ($ billions)
Exhibit 10: Market Segmentation by Product 2014
Exhibit 11: Market Segmentation by Product 2014-2019
Exhibit 12: Market Segmentation by Product 2019
Exhibit 13: Market Segmentation by Product: Cable Assembly 2014-2019 ($ billions)
Exhibit 14: Market Segmentation by Product: Cable Assembly 2014-2019 ($ billions)
Exhibit 15: Market Segmentation by End-users 2014-2019
Exhibit 16: Market Segmentation by End-user: Automotive 2014-2019 ($ billions)
Exhibit 17: Market Segmentation by End-user: IT 2014-2019 ($ billions)
Exhibit 18: Market Segmentation by End-user: Telecommunication 2014-2019 ($ billions)
Exhibit 19: Market Segmentation by End-user: Industrial 2014-2019 ($ billions)
Exhibit 20: Market Segmentation by End-user: Others 2014-2019 ($ billions)
Exhibit 21: Smartphone Unit Sales (millions)
Exhibit 22: Mobile Data Traffic (exabytes)
Exhibit 23: Worldwide Electric and Hybrid Vehicle Production Units (millions)
Exhibit 24: Amphenol: Business Segmentation by Revenue 2013
Exhibit 25: Amphenol: Business Segmentation by Revenue 2012 and 2013 (US$ million)
Exhibit 26: Amphenol: Geographical Segmentation by Revenue 2013
Exhibit 27: Hon Hai : Geographical Segmentation by Revenue 2013
Exhibit 28: Molex: Market Segmentation by Revenue 2013
Exhibit 29: Molex: Product Segmentation by Revenue 2013
Exhibit 30: Molex: Product Segmentation by Revenue 2012 and 2013 (US$ million)
Exhibit 31: Molex: Geographical Segmentation by Revenue 2013
Exhibit 32: TE Connectivity: Business Segmentation by Revenue 2013
Exhibit 33: TE Connectivity: Business Segmentation by Revenue 2012 and 2013 (US$ billion)
Exhibit 34: TE Connectivity: Geographical Segmentation by Revenue 2013
Exhibit 35: Yazaki: Key Offerings
Exhibit 36: Yazaki: Net Sales 2012 and 2013 (US$ billion)
Exhibit 37: Yazaki: Geographical Segmentation by Revenue 2014



【掲載企業】

Amphenol, Foxconn, Molex, TE Connectivity, Yazaki, 3M, Alstom SA, Belden Incorporated, Delphi, JST, Phoenix Contact, Rosenberger, Sumitomo Wiring Systems

【レポートのキーワード】

インタコネクト部品、ケーブルアセンブリ、コネクター、相互接続、電子部品

【調査方法】

一次資料による調査(業界専門家、ベンダー、代理店、顧客等を対象にしたデプスインタビュー調査など)及び二次資料による調査(Technavio独自のプラットフォーム、産業書籍、企業報告書、ニュース記事、アナリストレポート、貿易協会、政府機関発行データなど)

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