工業用エレクトロニクスパッケージングの世界市場:産業分析・市場機会

【英語タイトル】Industrial Electronics Packaging Market: Global Industry Analysis 2014-2018 and Opportunity Assessment 2019-2029

Future Market Insightsが出版した調査資料(FUMI906074)・商品コード:FUMI906074
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・発行日:2019年4月
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・レポート言語:英語
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※本調査レポートでは、工業用エレクトロニクスパッケージングの世界市場について調査・分析し、以下の構成でお届けいたします。
・工業用エレクトロニクスパッケージングの世界市場の世界市場概観
・工業用エレクトロニクスパッケージングの世界市場の世界市場規模
・工業用エレクトロニクスパッケージングの世界市場の世界市場予測
・工業用エレクトロニクスパッケージングの世界市場の世界市場:地域別市場分析
・工業用エレクトロニクスパッケージングの世界市場のアメリカ市場規模
・工業用エレクトロニクスパッケージングの世界市場のヨーロッパ市場規模
・工業用エレクトロニクスパッケージングの世界市場のアジア市場規模
・工業用エレクトロニクスパッケージングの世界市場の世界市場:製品別(検査及び計量用器具、プロセス制御器具、工業用制御器具、電力エレクトロニクス、工業用自動化設備及びその他)
・工業用エレクトロニクスパッケージングの世界市場の世界市場:競争状況
・工業用エレクトロニクスパッケージングの世界市場の世界市場:市場動向
・工業用エレクトロニクスパッケージングの世界市場の世界市場:関連企業分析
【レポートの概要】

This report provides a forecast analysis of the global industrial electronics packaging market. It provides historical data of 2014-2018 and forecast from 2019-2029 in terms of market revenue (US$ Mn) and volume (tonnes).

The report on the industrial electronics packaging market includes market outlook and macroeconomic indicators on the packaging industry, ESD packaging industry, and the global rigid packaging industry, among others. Moreover, it also includes market dynamics such as drivers, recent trends, restraints, and opportunities associated with the industrial electronics packaging market. The report includes a study of the market prospects for the manufacturers of industrial electronics packaging, and comprises an exhaustive value chain analysis.

The industrial electronics packaging market report is compiled under different chapters; an overview of each chapter is as follows -

Chapter 1: Executive Summary

This section provides a comprehensive summary of the global industrial electronics packaging market, including the trends, and product & market evolution, along with FMI analysis and key recommendations on how to frame winning strategies for the target market.

Chapter 2: Market Overview

This section reflects a detailed overview of the industrial electronics packaging market coverage, definitions, and limitations of the market eco-system.

Chapter 3: Key Market Trends

It includes a comprehensive analysis of the key trends that are impacting the global industrial electronics packaging market.

Chapter 4: Global Industrial Electronics Packaging Market Demand Analysis

This section covers the industrial electronics packaging market demand analysis for 2014-2018 and forecast for 2019-2029 from a volume (tons) perspective.

Chapter 5: Global Industrial Electronics Packaging Market – Pricing Analysis

Pricing analysis of the industrial electronics packaging market on the basis of region and packaging type has been considered. Weighted average pricing has been considered by taking regional market share, segmental market share, and pricing, by each region.

Chapter 6: Global Industrial Electronics Packaging Market Background

This section covers the global economic outlook, packaging industry outlook, ESD packaging market outlook, macro-economic factors, forecast factors, value chain analysis, cost structure analysis, Porter’s five forces analysis, PESTLE analysis for key countries, and market dynamics (drivers, restraints, and opportunity analysis) to gain deep qualitative insights about the industrial electronics packaging market.

Chapter 7: Global Industrial Electronics Packaging Market by Product Type

This chapter includes the industrial electronics packaging market analysis by product type, such as testing & measuring equipment, process control equipment, industrial controls, power electronics, industrial automation equipment, and others. Market attractiveness analysis for each segment is also provided in this chapter.

Chapter 8: Global Industrial Electronics Packaging Market by Material Type

This chapter includes the industrial electronics packaging market analysis by material type, including plastic and paper & paperboard. Plastic is further sub-segmented as polyethylene terephthalate (PET), polyethylene (PE), polyvinyl chloride (PVC), polypropylene (PP), and polystyrene (PS). Market attractiveness analysis for each segment is also provided in this chapter.

Chapter 9: Global Industrial Electronics Packaging Market by Packaging Type

This chapter includes the industrial electronics packaging market analysis by packaging type, such as rigid and flexible. The rigid segment is sub-segmented as corrugated boxes, containers & shippers, protective packaging, trays, clamshells, bins & totes, and others. The flexible segment is sub-segmented as bags & pouches, tapes & labels, and films & others. Market attractiveness analysis for each segment is also provided in this chapter.

Chapter 10: Global Industrial Electronics Packaging Market by Region

This chapter includes the industrial electronics packaging market analysis by region, such as North America, Latin America, Europe, South Asia, East Asia, Oceania, and the Middle East & Africa. Market attractiveness analysis for each segment is also provided in this chapter.

Chapter 11: North America Industrial Electronics Packaging Market Analysis

This section provides the market forecasts and analysis for North America, based on the key market segments considered. It also covers market attractiveness analysis by key segments, along with impact of the market dynamics and a brief overview of key players active in the region.

Chapter 12: Latin America Industrial Electronics Packaging Market Analysis

This section provides the market forecasts and analysis for Latin America, based on key market segments considered. It also covers market attractiveness analysis by key segments, along with impact of the market dynamics and a brief overview of key players active in the region.

Chapter 13: Europe Industrial Electronics Packaging Market Analysis

This section provides the market forecasts and analysis for Europe, based on key market segments considered. It also covers market attractiveness analysis by key segments, along with impact of the market dynamics and a brief overview of key players active in the region.

Chapter 14: South Asia Industrial Electronics Packaging Market Analysis

This section provides the market forecasts and analysis for South Asia, based on key market segments considered. It also covers market attractiveness analysis by key segments, along with impact of the market dynamics and a brief overview of key players active in the region.

Chapter 15: East Asia Industrial Electronics Packaging Market Analysis

This section provides the market forecasts and analysis for East Asia, based on key market segments considered. It also covers market attractiveness analysis by key segments, along with impact of the market dynamics and a brief overview of key players active in the region.

Chapter 16: Oceania Industrial Electronics Packaging Market Analysis

This section provides the market forecasts and analysis for Oceania, based on key market segments considered. It also covers market attractiveness analysis by key segments, along with impact of the market dynamics and a brief overview of key players active in the region.

Chapter 17: Middle East & Africa (MEA) Industrial Electronics Packaging Market Analysis

This section provides the market forecasts and analysis for the Middle East & Africa (MEA), based on key market segments considered. It also covers market attractiveness analysis by key segments, along with impact of the market dynamics and a brief overview of key players active in the region.

Chapter 18: Emerging Countries Industrial Electronics Packaging Market Analysis

This section provides the market forecasts and analysis for emerging countries, including India and China, based on key market segments considered. It also covers market attractiveness analysis by key segments, along with impact of the market dynamics and a brief overview of key players active in the region.

Chapter 19: Industrial Electronics Packaging Market Structure Analysis

This section provides the breakdown of the market into a three-tier framework, depending upon the revenue generated from the sales of industrial electronics packaging.

Chapter 20: Competition Analysis

The competition analysis section includes company market share analysis, along with a dashboard view of the key parameters of the top 20 companies in the market. Company profiles encompass product overview, SWOT analysis, go-to market strategies, preferred sales channels, and key financials, among others.

Major players operating in the industrial electronics packaging market are DS Smith Plc., Smurfit Kappa Group Plc., UFP Technologies, Inc., Sealed Air Corporation, Achilles Corporation, Desco Industries Inc., Kiva Container Corporation, Orlando Products Inc., Delphon Industries, LLC, Summit Container Corporation, Protective Packaging Corporation, GWP Group Limited, Pure-Stat Engineered Technologies, Inc., AUER Packaging GmbH, Dou Yee Enterprises (S) Pte Ltd., Botron Company Inc. Emballages Cre-O-Pack International Inc., Dordan Manufacturing Company, Inc., and Universal Protective Packaging, Inc., among others.

Chapter 21: Research Methodology

An overview of the research methodology for the industrial electronics packaging market has been highlighted in this section.

Chapter 22: Assumptions & Acronyms

This section includes a list of all the assumptions & acronyms used in the industrial electronics packaging market report.

【レポートの目次】

1. Executive Summary

1.1. Global Market Outlook

1.2. Analysis and Recommendations

2. Market Overview

2.1. Market Coverage / Taxonomy

2.2. Market Definition / Scope / Limitations

3. Key Market Trends

3.1. Key Trends Impacting the Market

3.2. Product Innovation / Development Trends

4. Global Industrial Electronics Packaging Market Demand Analysis 2014-2018 and Forecast, 2019-2029

4.1. Historical Market Volume (Tonnes) Analysis, 2014-2018

4.2. Current and Future Market Volume (Tonnes) Projections, 2019-2029

4.3. Y-o-Y Growth Trend Analysis

5. Global Industrial Electronics Packaging Market – Pricing Analysis

5.1. Regional Pricing Analysis by Packaging Type

5.2. Pricing Break-up

5.3. Global Average Pricing Analysis Benchmark

6. Global Industrial Electronics Packaging Market Demand (in Value or Size in US$ Mn) Analysis 2014-2018 and Forecast, 2019-2029

6.1. Historical Market Value (US$ Mn) Analysis, 2014-2018

6.2. Current and Future Market Value (US$ Mn) Projections, 2019-2029

6.2.1. Y-o-Y Growth Trend Analysis

6.2.2. Absolute $ Opportunity Analysis

7. Market Background

7.1. Macro-Economic Factors

7.1.1. Global GDP Growth Outlook

7.1.2. Manufacture Value Added (MVA)

7.1.3. Trade Analysis

7.1.4. Retail Sales

7.1.5. GDP Per Capita

7.1.6. Domestic Demand

7.1.7. Import Duty on Raw Materials – Regional

7.1.8. IT/Technology Spend

7.1.9. Industrial Production

7.2. Forecast Factors – Relevance & Impact

7.2.1. Global Packaging Industry Outlook

7.2.2. Global Rigid Packaging Industry Outlook

7.2.3. Global Flexible Packaging Industry Outlook

7.2.4. Global Industrial Electronics Market Outlook

7.2.5. Regional Plastic Production

7.2.6. Regional Paperboard Production

7.2.7. Recovery Rate – Regional

7.2.8. Manufacturers Historical Production Assessment

7.2.9. Manufacturer Segmental Revenue Growth

7.2.10. GDP Growth- Regional

7.2.11. End-user Adoption Rate

7.3. Value Chain Analysis

7.3.1. Key Participants

7.3.1.1. Raw Material Suppliers

7.3.1.2. Packaging Manufacturers

7.3.1.3. End Use Industry

7.3.2. Profitability Margin

7.4. Market Dynamics

7.4.1. Drivers

7.4.2. Restraints

7.4.3. Opportunity Analysis

8. Global Industrial Electronics Packaging Market Analysis 2014-2018 and Forecast 2019-2029, by Product Type

8.1. Introduction / Key Findings

8.2. Historical Market Size (US$ Mn) and Volume Analysis by Product Type, 2014 – 2018

8.3. Current and Future Market Size (US$ Mn) and Volume Analysis and Forecast by Product Type, 2019 – 2029

8.3.1. Testing & Measuring Equipment

8.3.2. Process Control Equipment

8.3.3. Industrial Controls

8.3.4. Power Electronics

8.3.5. Industrial Automation Equipment & Others

8.4. Market Attractiveness Analysis by Product Type

9. Global Industrial Electronics Packaging Market Analysis 2014-2018 and Forecast 2019-2029, by Material Type

9.1. Introduction / Key Findings

9.2. Historical Market Size (US$ Mn) and Volume Analysis by Material Type, 2014 – 2018

9.3. Current and Future Market Size (US$ Mn) and Volume Analysis and Forecast by Material Type, 2019 – 2029

9.3.1. Plastic

9.3.1.1. PE

9.3.1.2. PET

9.3.1.3. PP

9.3.1.4. PS

9.3.1.5. PVC

9.3.2. Paper & Paperboard

9.4. Market Attractiveness Analysis by Material Type

10. Global Industrial Electronics Packaging Market Analysis 2014-2018 and Forecast 2019-2029, by Packaging Type

10.1. Introduction / Key Findings

10.2. Historical Market Size (US$ Mn) and Volume Analysis by packaging Type, 2014 – 2018

10.3. Current and Future Market Size (US$ Mn) and Volume Analysis and Forecast by Packaging Type, 2019 – 2029

10.3.1. Rigid

10.3.1.1. Corrugated Box

10.3.1.2. Container &

10.3.1.3. Protective Pack.

10.3.1.4. Trays

10.3.1.5. Clamshells

10.3.1.6. Bin & Totes

10.3.1.7. Others

10.3.2. Flexible

10.3.2.1. Bags & Pouches

10.3.2.2. Tapes & Labels

10.3.2.3. Films & others

10.4. Market Attractiveness Analysis by Packaging Type

11. Global Industrial Electronics Packaging Market Analysis 2014-2018 and Forecast 2019-2029, by Region

11.1. Introduction

11.2. Historical Market Size (US$ Mn) and Volume Analysis by Region, 2014 – 2018

11.3. Current Market Size (US$ Mn) and Volume Analysis and Forecast by Region, 2019 – 2029

11.3.1. North America

11.3.2. Latin America

11.3.3. Europe

11.3.4. Middle East and Africa (MEA)

11.3.5. East Asia

11.3.6. South Asia

11.3.7. Oceania

11.4. Market Attractiveness Analysis by Region

12. North America Industrial Electronics Packaging Market Analysis 2014-2018 and Forecast 2019-2029

12.1. Introduction

12.2. Pricing Analysis

12.3. Historical Market Size (US$ Mn) and Volume Trend Analysis by Market Taxonomy, 2014 – 2018

12.4. Market Size (US$ Mn) and Volume Forecast by Market Taxonomy, 2018 – 2028

12.4.1. by Country

12.4.1.1. U.S.

12.4.1.2. Canada

12.4.2. by Product Type

12.4.3. by Material

12.4.4. by Packaging Type

12.5. Market Attractiveness Analysis

12.5.1. by Country

12.5.2. by Product Type

12.5.3. by Material

12.5.4. by Packaging Type

13. Latin America Industrial Electronics Packaging Market Analysis 2014-2018 and Forecast 2019-2029

13.1. Introduction

13.2. Pricing Analysis

13.3. Historical Market Size (US$ Mn) and Volume Trend Analysis by Market Taxonomy, 2014 – 2018

13.4. Market Size (US$ Mn) and Volume Forecast by Market Taxonomy, 2018 – 2028

13.4.1. by Country

13.4.1.1. Brazil

13.4.1.2. Mexico

13.4.1.3. Argentina

13.4.1.4. Rest of Latin America

13.4.2. by Product Type

13.4.3. by Material

13.4.4. by Packaging Type

13.5. Market Attractiveness Analysis

13.5.1. by Country

13.5.2. by Product Type

13.5.3. by Material

13.5.4. by Packaging Type

14. Europe Industrial Electronics Packaging Market Analysis 2014-2018 and Forecast 2019-2029

14.1. Introduction

14.2. Pricing Analysis

14.3. Historical Market Size (US$ Mn) and Volume Trend Analysis by Market Taxonomy, 2014 – 2018

14.4. Market Size (US$ Mn) and Volume Forecast by Market Taxonomy, 2018 – 2028

14.4.1. by Country

14.4.1.1. Germany

14.4.1.2. Italy

14.4.1.3. France

14.4.1.4. U.K.

14.4.1.5. Spain

14.4.1.6. BENELUX

14.4.1.7. Russia

14.4.1.8. Rest of Europe

14.4.2. by Product Type

14.4.3. by Material

14.4.4. by Packaging Type

14.5. Market Attractiveness Analysis

14.5.1. by Country

14.5.2. by Product Type

14.5.3. by Material

14.5.4. by Packaging Type

15. South Asia Industrial Electronics Packaging Market Analysis 2014-2018 and Forecast 2019-2029

15.1. Introduction

15.2. Pricing Analysis

15.3. Historical Market Size (US$ Mn) and Volume Trend Analysis by Market Taxonomy, 2014 – 2018

15.4. Market Size (US$ Mn) and Volume Forecast by Market Taxonomy, 2018 – 2028

15.4.1. by Country

15.4.1.1. India

15.4.1.2. Thailand

15.4.1.3. Indonesia

15.4.1.4. Malaysia

15.4.1.5. Rest of South Asia

15.4.2. by Product Type

15.4.3. by Material

15.4.4. by Packaging Type

15.5. Market Attractiveness Analysis

15.5.1. by Country

15.5.2. by Product Type

15.5.3. by Material

15.5.4. by Packaging Type

16. East Asia Industrial Electronics Packaging Market Analysis 2014-2018 and Forecast 2019-2029

16.1. Introduction

16.2. Pricing Analysis

16.3. Historical Market Size (US$ Mn) and Volume Trend Analysis by Market Taxonomy, 2014 – 2018

16.4. Market Size (US$ Mn) and Volume Forecast by Market Taxonomy, 2018 – 2028

16.4.1. by Country

16.4.1.1. China

16.4.1.2. Japan

16.4.1.3. South Korea

16.4.2. by Product Type

16.4.3. by Material

16.4.4. by Packaging Type

16.5. Market Attractiveness Analysis

16.5.1. by Country

16.5.2. by Product Type

16.5.3. by Material

16.5.4. by Packaging Type

17. Oceania Industrial Electronics Packaging Market Analysis 2014-2018 and Forecast 2019-2029

17.1. Introduction

17.2. Pricing Analysis

17.3. Historical Market Size (US$ Mn) and Volume Trend Analysis by Market Taxonomy, 2014 – 2018

17.4. Market Size (US$ Mn) and Volume Forecast by Market Taxonomy, 2018 – 2028

17.4.1. by Country

17.4.1.1. Australia

17.4.1.2. New Zealand

17.4.2. by Product Type

17.4.3. by Material

17.4.4. by Packaging Type

17.5. Market Attractiveness Analysis

17.5.1. by Country

17.5.2. by Product Type

17.5.3. by Material

17.5.4. by Packaging Type

18. Middle East and Africa Industrial Electronics Packaging Market Analysis 2014-2018 and Forecast 2019-2029

18.1. Introduction

18.2. Pricing Analysis

18.3. Historical Market Size (US$ Mn) and Volume Trend Analysis by Market Taxonomy, 2014 – 2018

18.4. Market Size (US$ Mn) and Volume Forecast by Market Taxonomy, 2018 – 2028

18.4.1. by Country

18.4.1.1. GCC Countries

18.4.1.2. Turkey

18.4.1.3. Northern Africa

18.4.1.4. South Africa

18.4.1.5. Rest of Middle East and Africa

18.4.2. by Product Type

18.4.3. by Material

18.4.4. by Packaging Type

18.5. Market Attractiveness Analysis

18.5.1. by Country

18.5.2. by Product Type

18.5.3. by Material

18.5.4. by Packaging Type

19. Emerging Countries Industrial Electronics Packaging Market Analysis 2014-2018 and Forecast 2019-2029

19.1. Introduction

19.1.1. Market Value Proportion Analysis, by Key Countries

19.1.2. Global Vs. Country Growth Comparison

19.2. China Industrial Electronics Packaging Market Analysis

19.2.1. Introduction

19.2.2. Pricing Analysis

19.2.3. PEST Analysis

19.2.4. Market Value Proportion Analysis by Market Taxonomy

19.2.5. Market Volume (Tonnes) and Value (US$ Mn) Analysis and Forecast by Market Taxonomy

19.2.5.1. by Product Type

19.2.5.2. by Material

19.2.5.3. by Packaging Type

19.2.6. China Industrial Electronics Packaging Market – Competition Landscape

19.2.7. China – Trade Analysis

19.3. India Industrial Electronics Packaging Market Analysis

19.3.1. Introduction

19.3.2. Pricing Analysis

19.3.3. PEST Analysis

19.3.4. Market Value Proportion Analysis by Market Taxonomy

19.3.5. Market Volume (Tonnes) and Value (US$ Mn) Analysis and Forecast by Market Taxonomy

19.3.5.1. by Product Type

19.3.5.2. by Material

19.3.5.3. by Packaging Type

19.3.6. India Industrial Electronics Packaging Market – Competition Landscape

20. Market Structure Analysis

20.1. Market Analysis by Tier of Companies (Industrial Electronics Packaging)

20.2. Market Concentration

20.3. Market Share Analysis of Top Players

20.4. Market Presence Analysis

20.4.1. by Regional footprint of Players

20.4.2. Product foot print by Players

20.4.3. Channel Foot Print by Players

21. Competition Analysis

21.1. Competition Dashboard

21.2. Pricing Analysis by Competition

21.3. Competition Benchmarking

21.4. Competition Deep Dive

21.4.1. Dordan Manufacturing Company

21.4.1.1. Overview

21.4.1.2. Product Portfolio

21.4.1.3. Profitability by Market Segments (Product/Channel/Region)

21.4.1.4. Sales Footprint

21.4.1.5. Strategy Overview

21.4.1.5.1. Marketing Strategy

21.4.1.5.2. Product Strategy

21.4.1.5.3. Channel Strategy

21.4.2. Kiva Container Corporation

21.4.3. Sealed Air Corporation

21.4.4. Orlando Products Inc.

21.4.5. UFP Technologies, Inc.

21.4.6. Smurfit Kappa Group

21.4.7. DS Smith Plc

21.4.8. Desco Industries Inc.

21.4.9. Summit Packaging Solutions

21.4.10. Delphon Industries, LLC

21.4.11. Protective Packaging Corporation

21.4.12. GWP Group Limited

21.4.13. Pure-Stat Engineered Technologies, Inc.

21.4.14. AUER Packaging GmbH

21.4.15. Dou Yee Enterprises (S) Pte Ltd.

21.4.16. Botron Company Inc.

21.4.17. Rand-Whitney Container LLC

21.4.18. Creopack Packaging Intelligence

21.4.19. Universal Protective Packaging, Inc.

22. Assumptions and Acronyms Used

23. Research Methodology



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