世界のCOF(チップ・オン・フレックス)市場予測2011-2021

◆英語タイトル:Global Chip-on-Flex Market Forecast 2011-2021
◆商品コード:DATA70126019
◆発行会社(調査会社):Market Research Future
◆発行日:2016年12月1日
◆ページ数:103
◆レポート言語:英語
◆レポート形式:PDF
◆納品方法:Eメール
◆調査対象地域:グローバル
◆産業分野:電子
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本調査レポートでは、世界のCOF(チップ・オン・フレックス)市場について調査・分析し、世界のCOF(チップ・オン・フレックス)市場動向、市場予測、セグメント別分析、主要地域別分析(アメリカ市場、ヨーロッパ市場、アジア市場)、世界市場規模、関連企業分析などを含め、以下の構成でお届けいたします。
【レポートの概要】

IntroductionChip on flex (COF) refers to the semiconductor assembly technology wherein the microchip or die is directly mounted on and electrically connected to a flexible circuit board. Increase in need for small & flexible electronic devices and rapid technological progression for improving accuracy are the major growth factors for the chip on flex market. Application in wearable electronics, and mobile smartphones shall also provide ample growth opportunities for this market. The global chip on flex market is expected to grow from USD 1.44 Billion in 2016 to USD 1.8 Billion by 2021.
The global chip on flex market is segmented on the basis of type, and application. Market categorization on the basis of type includes one sided chip on flex, and others. One sided chip type segment dominated the market with 85.5% share in 2015. Market segmentation based on application includes sub-segments military, medical, aerospace, electronics, and others. Electronic and medical application segments together contributed around 75% of the total market, in 2015. Regional market segmentation includes sub-segments Asia-Pacific, North America, Europe, and Rest of the World.

Study Objectives
• To provide insights about factors influencing and affecting the market growth
• To provide historical and forecast revenue of the market segments as well as sub-segments with respect to regional markets and their key countries
• To provide historical and forecast revenue of the market segments based on type, and application
• To provide strategic profiling of key players in the market, comprehensively analyzing their market share, core competencies, and drawing a competitive landscape for the market
Key Players
The key players of global chip on flex market report are LGIT Corporation (U.S.), Stemco Ltd. (Korea), Flexceed Co. Ltd. (Japan), Chipbond Technology Corporation (Taiwan), CWE materials, Inc.(Taiwan), Danbond Technology Co. Ltd.(China), AKM Industrial Co. Ltd. (China), Compass Technology Company Limited (China), Compunetics Inc. (U.S.), and Stars Microelectronics Company Ltd (Thailand). Leading companies in this market are majorly adopting innovation as well as capability expansion to enhance their market share. Strong focus on research and development activities has widened the scope of application for this technology.

Target Audience
• COF manufactures
• Government institutions
• Industries such as aerospace, automotive, IT, industrial, and medical, among others
• Research Institutions
• Adhesive Manufacturers
• Conductor and insulator manufacturers

Regional Analysis
Europe is expected to exhibit the highest growth rate followed by Asia-Pacific, during the forecast period. Europe is projected to offer high growth opportunities to the market, following increasing adoption of COF technology within the automobile industry. Many well established firms such as AKM Industrial Company Ltd., and Compunetics Inc. are increasing their geographic presence in the Europe region, which is indicative of the high growth expectation from this market. Chip on flex market in China is projected to grow from an estimated USD 69.70 million in 2016 to USD 85.53 million by 2021.
The reports also covers country level analysis:
• North America
o U.S.
o Canada
• Europe
o Germany
o U.K.
o France
o Rest of Europe
• Asia-Pacific
o China
o Japan
o Korea
o Taiwan
o Rest of Asia-Pacific
• Rest of the World

【レポートの目次】

Executive Summary
2 Scope of the Report
2.1 Assumptions
2.1.1 Research Objective
2.2 Assumptions
2.3 Top-vendor Offerings
3 Market Research Methodology
3.1 Research Process
3.2 Primary Research
3.3 Secondary Research
3.4 Forecast Model
4 Market Landscape
4.1 Market overview
4.2 Market Size and Forecast
6 GLOBAL CHIP-ON-FLEX MARKET, BY SEGMENTS
6.1 INTRODUCTION
6.2 MARKET STATISTICS
6.2.1 BY TYPE
6.2.1.1 SINGLE-SIDED CHIP-ON-FLEX
6.2.1.2 OTHERS
6.2.2 APPLICATIONS
6.2.2.1 MILITARY
6.2.2.2 MEDICAL
6.2.2.3 AEROSPACE
6.2.2.4 ELECTRONICS
6.2.2.5 OTHERS
6.2.3 BY GEOGRAPHY
6.2.3.1 Introduction
6.2.3.2 Americas
6.2.3.4 Europe
6.2.3.5 APAC
6.2.3.6 ROW
7 COMPETITIVE LANDSCAPE
7.1 Global Chip-On-Flex Market Competitors, By Manufacturers
7.2 Company Profiles
7.2.1 LGIT
7.2.2 Stemco
7.2.3 Flexceed
7.2.4 Chipbond Technology
7.2.5 CWE Materials
7.2.6 Danbond Technology
7.2.7 AKM Industrial
7.2.8 Compass Technology Company
7.2.9 Compunetics
7.2.10 Stars Microelectronics



【掲載企業】

LGIT
Stemco
Flexceed
Chipbond Technology
CWE Materials
Danbond Technology
AKM Industrial
Compass Technology Company
Compunetics
Stars Microelectronics


【レポートのキーワード】

COF(チップ・オン・フレックス)

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