世界の3D半導体パッケージング市場2022-2029:技術別(3Dスルーシリコンビア、3Dパッケージオンパッケージ、3Dファンアウトベース、3Dワイヤボンディング)、材料別、産業別、地域別

【英語タイトル】Global 3D Semiconductor Packaging Market Size study & Forecast, by Technology (3D Through silicon via, 3D Package on Package, 3D Fan Out Based, 3D Wire Bonded), by Material (Organic Substrate, Bonding Wire, Leadframe, Encapsulation Resin, Ceramic Package, Die Attach Material), by Industry vertical (Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication, Aerospace & Defense), and Regional Analysis, 2022-2029

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・発行日:2022年10月8日
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・レポート言語:英語
・レポート形式:PDF
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❖ レポートの概要 ❖

Bizwit Research社は、2021年におよそXX億ドルであった世界の3D半導体パッケージング市場規模が、2022年から2029年の間にXX%以上成長すると予測しています。当調査資料は、3D半導体パッケージングの世界市場を総合的に調査・分析し、エグゼクティブサマリー、市場定義・範囲、市場動向、産業分析、リスク分析(新型コロナウイルス感染症の影響)、技術別(3Dスルーシリコンビア、3Dパッケージオンパッケージ、3Dファンアウトベース、3Dワイヤボンディング)分析、材料別(有機基板、ボンディングワイヤ、リードフレーム、カプセル化樹脂、その他)分析、産業別(電子、工業、自動車・輸送、医療、その他)分析、地域別(北米、ヨーロッパ、アジア太平洋、中南米、その他地域)分析、競争分析、調査プロセスなど、以下の構成でまとめております。なお、当書には、Amkor Technology、ASE group、Siliconware Precision Industries Co., Ltd.、Jiangsu Changjiang Electronics Technology Co. Ltd.、SÜSS MicroTec AG.、International Business Machines Corporation (IBM)、Intel Corporation、Qualcomm Technologies, Inc.などの企業情報が含まれています。
・エグゼクティブサマリー
・市場定義・範囲
・市場動向
・産業分析
・リスク分析(新型コロナウイルス感染症の影響)
・世界の3D半導体パッケージング市場規模:技術別
- 3Dスルーシリコンビアの市場規模
- 3Dパッケージオンパッケージの市場規模
- 3Dファンアウトベースの市場規模
- 3Dワイヤボンディングの市場規模
・世界の3D半導体パッケージング市場規模:材料別
- 有機基板の市場規模
- ボンディングワイヤの市場規模
- リードフレームの市場規模
- カプセル化樹脂の市場規模
- その他材料の市場規模
・世界の3D半導体パッケージング市場規模:産業別
- 電子における市場規模
- 工業における市場規模
- 自動車・輸送における市場規模
- 医療における市場規模
- その他産業における市場規模
・世界の3D半導体パッケージング市場規模:地域別
- 北米の3D半導体パッケージング市場規模
- ヨーロッパの3D半導体パッケージング市場規模
- アジア太平洋の3D半導体パッケージング市場規模
- 中南米の3D半導体パッケージング市場規模
- その他地域の3D半導体パッケージング市場規模
・競争分析
・調査プロセス

Global 3D Semiconductor Packaging Market is valued at approximately USD XX billion in 2021 and is anticipated to grow with a healthy growth rate of more than XX% over the forecast period 2022-2029. In order to function as a single device, two or more layers of active electronic components must be stacked together and connected both vertically and horizontally. This is known as 3D semiconductor packaging. Major driving factor for the Global 3D Semiconductor packaging market is rising investment in semiconductor. Along with this, rising demand for consumer electronic products is also driving the growth of the market over the forecasted periods.

According to Statista, in 2014, the big funding for semiconductors in China was USD 21 billion and this number increased to USD 35 billion in year 2019. Along with this, in 2019, the import value of semiconductors was USD 47.4 billion and this number is projected to increase up to USD 60.92 billion in 2025. Similarly, the export value of semiconductors in 2019 was USD 95.16 billion and this number is projected to increase up to USD 145.87 billion in 2025. However, shortage of raw materials in the market is restraining the market growth for the market over the forecasted period. Moreover, the need for 3D packaging is increasing as a result of the quick acceptance and development of AI and machine intelligence is creating lucrative growth opportunities for the market over the forecasted period.

The key regions considered for the Global 3D Semiconductor Packaging Market study include Asia Pacific, North America, Europe, Latin America, and Rest of the World. North America dominated the space in terms of revenue, owing to the presence of key market players and rising production of semiconductors in the region. For instance, according to Statista, the sales of semiconductors are increasing which is driving the demand for 3D semiconductor packaging market. In May 2019, the sales were USD 5.92 which increased up to USD 8.96 in May 2021. Asia Pacific is expected to grow significantly during the forecast period. Factors such as increasing demand for consumer electronics, product launches by the key market players in the region, rising automotive industry and increase in the value of import and export of ICs are driving the growth of the 3D semiconductor packaging market over the forecasted period.

Major market players included in this report are:
Amkor Technology
ASE group
Siliconware Precision Industries Co., Ltd.
Jiangsu Changjiang Electronics Technology Co. Ltd.
SÜSS MicroTec AG.
International Business Machines Corporation (IBM)
Intel Corporation
Qualcomm Technologies, Inc.
STMicroelectronics
Taiwan Semiconductor Manufacturing Company

Recent Developments in the Market:
 In July 2022, Samsung Electronics established a task group for semiconductor packaging (TF). The team, which reports directly to the CEO, is meant to improve packaging industry collaboration with major foundry clients.
 In May 2022, ISC launched a rubber socket that is majorly used for 3D semiconductor chip packaging.

Global 3D Semiconductor Packaging Market Report Scope:
Historical Data 2019-2020-2021
Base Year for Estimation 2021
Forecast period 2022-2029
Report Coverage Revenue forecast, Company Ranking, Competitive Landscape, Growth factors, and Trends
Segments Covered Technology, Material, Industry vertical, Region
Regional Scope North America; Europe; Asia Pacific; Latin America; Rest of the World
Customization Scope Free report customization (equivalent up to 8 analyst’s working hours) with purchase. Addition or alteration to country, regional & segment scope*

The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within countries involved in the study.

The report also caters detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, it also incorporates potential opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and Technology offerings of key players. The detailed segments and sub-segment of the market are explained below:

By Technology:
3D Through silicon via
3D Package on Package
3D Fan Out Based
3D Wire Bonded

By Material:
Organic Substrate
Bonding Wire
Leadframe
Encapsulation Resin
Ceramic Package
Die Attach Material

By Industry vertical:
Electronics
Industrial
Automotive & Transport
Healthcare
IT & Telecommunication
Aerospace & Defense

By Region:
North America
U.S.
Canada
Europe
UK
Germany
France
Spain
Italy
ROE
Asia Pacific
China
India
Japan
Australia
South Korea
RoAPAC
Latin America
Brazil
Mexico
Rest of the World

❖ レポートの目次 ❖

Chapter 1. Executive Summary
1.1. Market Snapshot
1.2. Global & Segmental Market Estimates & Forecasts, 2019-2029 (USD Billion)
1.2.1. 3D Semiconductor Packaging Market, by Region, 2019-2029 (USD Billion)
1.2.2. 3D Semiconductor Packaging Market, by Technology, 2019-2029 (USD Billion)
1.2.3. 3D Semiconductor Packaging Market, by Material, 2019-2029 (USD Billion)
1.2.4. 3D Semiconductor Packaging Market, by Industry Vertical, 2019-2029 (USD Billion)
1.3. Key Trends
1.4. Estimation Methodology
1.5. Research Assumption
Chapter 2. Global 3D Semiconductor Packaging Market Definition and Scope
2.1. Objective of the Study
2.2. Market Definition & Scope
2.2.1. Scope of the Study
2.2.2. Industry Evolution
2.3. Years Considered for the Study
2.4. Currency Conversion Rates
Chapter 3. Global 3D Semiconductor Packaging Market Dynamics
3.1. 3D Semiconductor Packaging Market Impact Analysis (2019-2029)
3.1.1. Market Drivers
3.1.1.1. Rising demand for consumer electronics
3.1.1.2. Rising investment in semiconductor
3.1.2. Market Challenges
3.1.2.1. Shortage of raw materials in the market
3.1.3. Market Opportunities
3.1.3.1. Advancements in 3D semiconductor packaging
Chapter 4. Global 3D Semiconductor Packaging Market Industry Analysis
4.1. Porter’s 5 Force Model
4.1.1. Bargaining Power of Suppliers
4.1.2. Bargaining Power of Buyers
4.1.3. Threat of New Entrants
4.1.4. Threat of Substitutes
4.1.5. Competitive Rivalry
4.2. Futuristic Approach to Porter’s 5 Force Model (2019-2029)
4.3. PEST Analysis
4.3.1. Political
4.3.2. Economical
4.3.3. Social
4.3.4. Technological
4.4. Investment Adoption Model
4.5. Analyst Recommendation & Conclusion
4.6. Top investment opportunity
4.7. Top winning strategies
Chapter 5. Risk Assessment: COVID-19 Impact
5.1. Assessment of the overall impact of COVID-19 on the industry
5.2. Pre COVID-19 and post COVID-19 Market scenario
Chapter 6. Global 3D Semiconductor Packaging Market, by Technology
6.1. Market Snapshot
6.2. Global 3D Semiconductor Packaging Market by Technology, Performance – Potential Analysis
6.3. Global 3D Semiconductor Packaging Market Estimates & Forecasts by Technology, 2019-2029 (USD Billion)
6.4. 3D Semiconductor Packaging Market, Sub Segment Analysis
6.4.1. 3D Through silicon via
6.4.2. 3D Package on Package
6.4.3. 3D Fan Out Based
6.4.4. 3D Wire Bonded
Chapter 7. Global 3D Semiconductor Packaging Market, by Material
7.1. Market Snapshot
7.2. Global 3D Semiconductor Packaging Market by Material, Performance – Potential Analysis
7.3. Global 3D Semiconductor Packaging Market Estimates & Forecasts by Material, 2019-2029 (USD Billion)
7.4. 3D Semiconductor Packaging Market, Sub Segment Analysis
7.4.1. Organic Substrate
7.4.2. Bonding Wire
7.4.3. Leadframe
7.4.4. Encapsulation Resin
7.4.5. Ceramic Package
7.4.6. Die Attach Material
Chapter 8. Global 3D Semiconductor Packaging Market, by Industry vertical
8.1. Market Snapshot
8.2. Global 3D Semiconductor Packaging Market by Industry vertical, Performance – Potential Analysis
8.3. Global 3D Semiconductor Packaging Market Estimates & Forecasts by Industry vertical, 2019-2029 (USD Billion)
8.4. 3D Semiconductor Packaging Market, Sub Segment Analysis
8.4.1. Electronics
8.4.2. Industrial
8.4.3. Automotive & Transport
8.4.4. Healthcare
8.4.5. IT & Telecommunication
8.4.6. Aerospace & Defense
Chapter 9. Global 3D Semiconductor Packaging Market, Regional Analysis
9.1. 3D Semiconductor Packaging Market, Regional Market Snapshot
9.2. North America 3D Semiconductor Packaging Market
9.2.1. U.S. 3D Semiconductor Packaging Market
9.2.1.1. Technology breakdown estimates & forecasts, 2019-2029
9.2.1.2. Material breakdown estimates & forecasts, 2019-2029
9.2.1.3. Industry vertical breakdown estimates & forecasts, 2019-2029
9.2.2. Canada 3D Semiconductor Packaging Market
9.3. Europe 3D Semiconductor Packaging Market Snapshot
9.3.1. U.K. 3D Semiconductor Packaging Market
9.3.2. Germany 3D Semiconductor Packaging Market
9.3.3. France 3D Semiconductor Packaging Market
9.3.4. Spain 3D Semiconductor Packaging Market
9.3.5. Italy 3D Semiconductor Packaging Market
9.3.6. Rest of Europe 3D Semiconductor Packaging Market
9.4. Asia-Pacific 3D Semiconductor Packaging Market Snapshot
9.4.1. China 3D Semiconductor Packaging Market
9.4.2. India 3D Semiconductor Packaging Market
9.4.3. Japan 3D Semiconductor Packaging Market
9.4.4. Australia 3D Semiconductor Packaging Market
9.4.5. South Korea 3D Semiconductor Packaging Market
9.4.6. Rest of Asia Pacific 3D Semiconductor Packaging Market
9.5. Latin America 3D Semiconductor Packaging Market Snapshot
9.5.1. Brazil 3D Semiconductor Packaging Market
9.5.2. Mexico 3D Semiconductor Packaging Market
9.6. Rest of The World 3D Semiconductor Packaging Market

Chapter 10. Competitive Intelligence
10.1. Top Market Strategies
10.2. Company Profiles
10.2.1. Amkor Technology
10.2.1.1. Key Information
10.2.1.2. Overview
10.2.1.3. Financial (Subject to Data Availability)
10.2.1.4. Product Summary
10.2.1.5. Recent Developments
10.2.2. ASE group
10.2.3. Siliconware Precision Industries Co., Ltd.
10.2.4. Jiangsu Changjiang Electronics Technology Co. Ltd.
10.2.5. SÜSS MicroTec AG.
10.2.6. International Business Machines Corporation (IBM)
10.2.7. Intel Corporation
10.2.8. Qualcomm Technologies, Inc.
10.2.9. STMicroelectronics
10.2.10. Taiwan Semiconductor Manufacturing Company.
Chapter 11. Research Process
11.1. Research Process
11.1.1. Data Mining
11.1.2. Analysis
11.1.3. Market Estimation
11.1.4. Validation
11.1.5. Publishing
11.2. Research Attributes
11.3. Research Assumption



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