3D NAND型フラッシュメモリの世界市場:種類別(シングルレベルセル、マルチレベルセル、トリプルレベルセル)、用途別(カメラ、ラップトップ・PC、スマートフォン・タブレット、その他)、エンドユーザー別(自動車、家電、エンタープライズ、ヘルスケア、その他)

【英語タイトル】3D NAND Flash Memory Market by Type (Single-Level Cell, Multi-Level Cell, and Triple-Level Cell), Application (Cameras, Laptop & PCs, Smartphone & Tablets, and Others), and End Users (Automotive, Consumer Electronics, Enterprise, Healthcare, and Others): Global Opportunity Analysis and Industry Forecast, 2017 - 2025

Allied Market Researchが出版した調査資料(AMR9JN137)・商品コード:AMR9JN137
・発行会社(調査会社):Allied Market Research
・発行日:2018年12月
・ページ数:255
・レポート言語:英語
・レポート形式:PDF
・納品方法:Eメール(受注後24時間以内)
・調査対象地域:グローバル
・産業分野:半導体・エレクトロニクス
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本資料は、3D NAND型フラッシュメモリの世界市場について調べ、3D NAND型フラッシュメモリの世界規模、市場シェア、市場動向、市場環境、種類別(シングルレベルセル、マルチレベルセル、トリプルレベルセル)分析、エンドユーザー別(自動車、家電、エンタープライズ、ヘルスケア、その他)分析、アメリカ市場規模、ヨーロッパ市場規模、アジア市場規模、日本市場規模、中国市場規模、関連企業情報などをまとめた調査レポートです。
・イントロダクション
・エグゼクティブサマリー
・3D NAND型フラッシュメモリの世界市場概要
・3D NAND型フラッシュメモリの世界市場環境
・3D NAND型フラッシュメモリの世界市場動向
・3D NAND型フラッシュメモリの世界市場規模
・3D NAND型フラッシュメモリの世界市場:市場シェア
・3D NAND型フラッシュメモリの世界市場:種類別(シングルレベルセル、マルチレベルセル、トリプルレベルセル)
・3D NAND型フラッシュメモリの世界市場:用途別(カメラ、ラップトップ・PC、スマートフォン・タブレット、その他)
・3D NAND型フラッシュメモリの世界市場:エンドユーザー別(自動車、家電、エンタープライズ、ヘルスケア、その他)
・3D NAND型フラッシュメモリの世界市場:地域別市場規模・分析
・3D NAND型フラッシュメモリの北米市場規模・予測
・3D NAND型フラッシュメモリのアメリカ市場規模・予測
・3D NAND型フラッシュメモリのヨーロッパ市場規模・予測
・3D NAND型フラッシュメモリのアジア市場規模・予測
・3D NAND型フラッシュメモリの日本市場規模・予測
・3D NAND型フラッシュメモリの中国市場規模・予測
・関連企業情報
【レポートの概要】

3D NAND Flash Memory Market Overview:

The global 3D NAND flash memory market size is expected to be $ 9,056.2 million in 2017, and is projected to reach $ 99,769.0 million by 2025, registering a CAGR of 35.3% from 2018 to 2025.

3D NAND flash memory technology has been increasingly utilized in various applications due to increase in demand for data storage. It offers large storage space while operating faster at a rather reduced cost. This technology has considerably evolved as the existing technologies were not able to effectively scale capacity to meet the increase in demand for data storage.

The key market players are trying to develop advanced memory chips for consumer electronics devices with a focus on more in-built storage to reduce the reliance on external memory cards. Micron Technology, for instance, developed a 3D NAND chip in August 2016 for smartphones, which stacks 48 layers of memory cells. The mass production of such chips is yet to start by the company, but this is an advancement in the 3D NAND flash memory market. Moreover, advancements in mobile technology coupled with growth in usage aid the smartphone growth, in terms of penetration. The global smartphone market is in its mature growth stage due to decline in the overall shipment in developed markets such as the U.S., China, Japan, Canada, and parts of Europe.

The 3D NAND flash memory market is analyzed on the basis of type, application, end user, and geography. On the basis of type, the market is divided into single-level cell (SLC), multi-level cell (MLC), and triple-level cell (TLC). Based on application, the market is categorized into cameras, laptops & PCs, smartphone & tablets, and others. Based on end user, the market is segmented into automotive, consumer electronics, enterprise, healthcare, and others. Geographically, the market is analyzed across North America, Europe, Asia-Pacific, and LAMEA along with their prominent countries.

The key players profiled in the report include Samsung Electronics Co., Ltd., Toshiba Corporation, SK Hynix Semiconductor, Inc., Micron Technology, Inc., Intel Corporation, Apple Inc., Lenovo Group Ltd., Advanced Micro Devices, STMicroelectronics, and SanDisk Corporation.

These key players have adopted strategies such as product portfolio expansion, mergers & acquisitions, agreements, geographical expansion, and collaborations to enhance their market penetration.

Key Benefits for 3d Nand Flash Memory Market:

This study presents the analytical depiction of the global 3D NAND flash memory along with the current trends and future estimations to determine the imminent investment pockets.
The report presents information regarding the key drivers, restraints, and opportunities.
The current market is quantitatively analyzed from 2017 to 2025 to highlight the financial competency of the industry.
Porter’s five forces analysis illustrates the potency of the buyers and suppliers in the industry.

3d Nand Flash Memory Market Segmentation:

By Type

Single-Level Cell (SLC)
Multi-Level Cell (MLC)
Triple-Level Cell (TLC)

By Application

Cameras
Laptops & PCs
Smartphone & Tablets
Others

By End User

Automotive
Consumer Electronics
Enterprise
Healthcare
Others

By Region

North America
U.S.
Canada
Mexico
Europe
UK
Germany
France
Rest of Europe
Asia-Pacific
China
Japan
India
South Korea
Rest of Asia-Pacific
LAMEA
Latin America
Middle East
Africa

Key Market Players Profiled

Samsung Electronics Co., Ltd.,
Toshiba Corporation,
SK Hynix Semiconductor, Inc.,
Micron Technology, Inc.,
Intel Corporation,
Apple Inc.,
Lenovo Group Ltd.,
Advanced Micro Devices,
STMicroelectronics,
SanDisk Corporation

【レポートの目次】

Chapter: 1: INTRODUCTION

1.1. REPORT DESCRIPTION
1.2. KEY MARKET SEGMENTS
1.3. KEY BENEFITS
1.4. RESEARCH METHODOLOGY
1.4.1. PRIMARY RESEARCH
1.4.2. SECONDARY RESEARCH
1.4.3. ANALYST TOOLS AND MODELS

Chapter: 2: EXECUTIVE SUMMARY

2.1. CXO PERSPECTIVE

Chapter: 3: MARKET LANDSCAPE

3.1. MARKET DEFINITION AND SCOPE
3.2. KEY FINDINGS
3.2.1. TOP INVESTMENT POCKETS
3.2.2. TOP WINNING STRATEGIES
3.3. PORTER’S FIVE FORCES ANALYSIS
3.3.1. BARGAINING POWER OF SUPPLIERS
3.3.2. THREAT OF NEW ENTRANTS
3.3.3. THREAT OF SUBSTITUTES
3.3.4. COMPETITIVE RIVALRY
3.3.5. BARGAINING POWER AMONG BUYERS
3.4. MARKET SHARE ANALYSIS/TOP PLAYER POSITIONING
3.5. MARKET DYNAMICS
3.5.1. DRIVERS
3.5.2. RESTRAINTS
3.5.3. OPPORTUNITIES

Chapter: 4: 3D NAND MARKET MARKET BY TYPE

4.1. OVERVIEW
4.2. SINGLE LEVEL CELL (SLC)
4.2.1. KEY MARKET TRENDS, GROWTH FACTORS AND OPPORTUNITIES
4.2.2. MARKET SIZE AND FORECAST BY REGION
4.2.3. MARKET ANALYSIS BY COUNTRY
4.3. MULTI LEVEL CELL MLC
4.3.1. KEY MARKET TRENDS, GROWTH FACTORS AND OPPORTUNITIES
4.3.2. MARKET SIZE AND FORECAST BY REGION
4.3.3. MARKET ANALYSIS BY COUNTRY
4.4. TRIPLE LEVEL CELL TLC
4.4.1. KEY MARKET TRENDS, GROWTH FACTORS AND OPPORTUNITIES
4.4.2. MARKET SIZE AND FORECAST BY REGION
4.4.3. MARKET ANALYSIS BY COUNTRY

Chapter: 5: 3D NAND MARKET MARKET BY APPLICATION

5.1. OVERVIEW
5.2. CAMERAS
5.2.1. KEY MARKET TRENDS, GROWTH FACTORS AND OPPORTUNITIES
5.2.2. MARKET SIZE AND FORECAST BY REGION
5.2.3. MARKET ANALYSIS BY COUNTRY
5.3. LAPTOPS PCS
5.3.1. KEY MARKET TRENDS, GROWTH FACTORS AND OPPORTUNITIES
5.3.2. MARKET SIZE AND FORECAST BY REGION
5.3.3. MARKET ANALYSIS BY COUNTRY
5.4. SMARTPHONE TABLETS
5.4.1. KEY MARKET TRENDS, GROWTH FACTORS AND OPPORTUNITIES
5.4.2. MARKET SIZE AND FORECAST BY REGION
5.4.3. MARKET ANALYSIS BY COUNTRY
5.5. OTHERS
5.5.1. KEY MARKET TRENDS, GROWTH FACTORS AND OPPORTUNITIES
5.5.2. MARKET SIZE AND FORECAST BY REGION
5.5.3. MARKET ANALYSIS BY COUNTRY

Chapter: 6: 3D NAND MARKET MARKET BY END USER

6.1. OVERVIEW
6.2. AUTOMOTIVE
6.2.1. KEY MARKET TRENDS, GROWTH FACTORS AND OPPORTUNITIES
6.2.2. MARKET SIZE AND FORECAST BY REGION
6.2.3. MARKET ANALYSIS BY COUNTRY
6.3. CONSUMER ELECTRONICS
6.3.1. KEY MARKET TRENDS, GROWTH FACTORS AND OPPORTUNITIES
6.3.2. MARKET SIZE AND FORECAST BY REGION
6.3.3. MARKET ANALYSIS BY COUNTRY
6.4. ENTERPRISE
6.4.1. KEY MARKET TRENDS, GROWTH FACTORS AND OPPORTUNITIES
6.4.2. MARKET SIZE AND FORECAST BY REGION
6.4.3. MARKET ANALYSIS BY COUNTRY
6.5. HEALTHCARE
6.5.1. KEY MARKET TRENDS, GROWTH FACTORS AND OPPORTUNITIES
6.5.2. MARKET SIZE AND FORECAST BY REGION
6.5.3. MARKET ANALYSIS BY COUNTRY
6.6. OTHERS
6.6.1. KEY MARKET TRENDS, GROWTH FACTORS AND OPPORTUNITIES
6.6.2. MARKET SIZE AND FORECAST BY REGION
6.6.3. MARKET ANALYSIS BY COUNTRY

Chapter: 7: 3D NAND MARKET MARKET BY REGION

7.1. OVERVIEW
7.2. NORTH AMERICA
7.2.1. KEY MARKET TRENDS AND OPPORTUNITIES
7.2.2. MARKET SIZE AND FORECAST BY TYPE
7.2.3. MARKET SIZE AND FORECAST BY APPLICATION
7.2.4. MARKET SIZE AND FORECAST BY END USER
7.2.5. MARKET SIZE AND FORECAST BY COUNTRY
7.2.6. US 3D NAND MARKET MARKET
7.2.6.1. MARKET SIZE AND FORECAST BY TYPE
7.2.6.2. MARKET SIZE AND FORECAST BY APPLICATION
7.2.6.3. MARKET SIZE AND FORECAST BY END USER
7.2.7. CANADA 3D NAND MARKET MARKET
7.2.7.1. MARKET SIZE AND FORECAST BY TYPE
7.2.7.2. MARKET SIZE AND FORECAST BY APPLICATION
7.2.7.3. MARKET SIZE AND FORECAST BY END USER
7.2.8. MEXICO 3D NAND MARKET MARKET
7.2.8.1. MARKET SIZE AND FORECAST BY TYPE
7.2.8.2. MARKET SIZE AND FORECAST BY APPLICATION
7.2.8.3. MARKET SIZE AND FORECAST BY END USER
7.3. EUROPE
7.3.1. KEY MARKET TRENDS AND OPPORTUNITIES
7.3.2. MARKET SIZE AND FORECAST BY TYPE
7.3.3. MARKET SIZE AND FORECAST BY APPLICATION
7.3.4. MARKET SIZE AND FORECAST BY END USER
7.3.5. MARKET SIZE AND FORECAST BY COUNTRY
7.3.6. UK 3D NAND MARKET MARKET
7.3.6.1. MARKET SIZE AND FORECAST BY TYPE
7.3.6.2. MARKET SIZE AND FORECAST BY APPLICATION
7.3.6.3. MARKET SIZE AND FORECAST BY END USER
7.3.7. GERMANY 3D NAND MARKET MARKET
7.3.7.1. MARKET SIZE AND FORECAST BY TYPE
7.3.7.2. MARKET SIZE AND FORECAST BY APPLICATION
7.3.7.3. MARKET SIZE AND FORECAST BY END USER
7.3.8. FRANCE 3D NAND MARKET MARKET
7.3.8.1. MARKET SIZE AND FORECAST BY TYPE
7.3.8.2. MARKET SIZE AND FORECAST BY APPLICATION
7.3.8.3. MARKET SIZE AND FORECAST BY END USER
7.3.9. REST OF EUROPE 3D NAND MARKET MARKET
7.3.9.1. MARKET SIZE AND FORECAST BY TYPE
7.3.9.2. MARKET SIZE AND FORECAST BY APPLICATION
7.3.9.3. MARKET SIZE AND FORECAST BY END USER
7.4. ASIA PACIFIC
7.4.1. KEY MARKET TRENDS AND OPPORTUNITIES
7.4.2. MARKET SIZE AND FORECAST BY TYPE
7.4.3. MARKET SIZE AND FORECAST BY APPLICATION
7.4.4. MARKET SIZE AND FORECAST BY END USER
7.4.5. MARKET SIZE AND FORECAST BY COUNTRY
7.4.6. CHINA 3D NAND MARKET MARKET
7.4.6.1. MARKET SIZE AND FORECAST BY TYPE
7.4.6.2. MARKET SIZE AND FORECAST BY APPLICATION
7.4.6.3. MARKET SIZE AND FORECAST BY END USER
7.4.7. JAPAN 3D NAND MARKET MARKET
7.4.7.1. MARKET SIZE AND FORECAST BY TYPE
7.4.7.2. MARKET SIZE AND FORECAST BY APPLICATION
7.4.7.3. MARKET SIZE AND FORECAST BY END USER
7.4.8. INDIA 3D NAND MARKET MARKET
7.4.8.1. MARKET SIZE AND FORECAST BY TYPE
7.4.8.2. MARKET SIZE AND FORECAST BY APPLICATION
7.4.8.3. MARKET SIZE AND FORECAST BY END USER
7.4.9. SOUTH KOREA 3D NAND MARKET MARKET
7.4.9.1. MARKET SIZE AND FORECAST BY TYPE
7.4.9.2. MARKET SIZE AND FORECAST BY APPLICATION
7.4.9.3. MARKET SIZE AND FORECAST BY END USER
7.4.10. REST OF ASIA PACIFIC 3D NAND MARKET MARKET
7.4.10.1. MARKET SIZE AND FORECAST BY TYPE
7.4.10.2. MARKET SIZE AND FORECAST BY APPLICATION
7.4.10.3. MARKET SIZE AND FORECAST BY END USER
7.5. LAMEA
7.5.1. KEY MARKET TRENDS AND OPPORTUNITIES
7.5.2. MARKET SIZE AND FORECAST BY TYPE
7.5.3. MARKET SIZE AND FORECAST BY APPLICATION
7.5.4. MARKET SIZE AND FORECAST BY END USER
7.5.5. MARKET SIZE AND FORECAST BY COUNTRY
7.5.6. LATIN AMERICA 3D NAND MARKET MARKET
7.5.6.1. MARKET SIZE AND FORECAST BY TYPE
7.5.6.2. MARKET SIZE AND FORECAST BY APPLICATION
7.5.6.3. MARKET SIZE AND FORECAST BY END USER
7.5.7. MIDDLE EAST 3D NAND MARKET MARKET
7.5.7.1. MARKET SIZE AND FORECAST BY TYPE
7.5.7.2. MARKET SIZE AND FORECAST BY APPLICATION
7.5.7.3. MARKET SIZE AND FORECAST BY END USER
7.5.8. AFRICA 3D NAND MARKET MARKET
7.5.8.1. MARKET SIZE AND FORECAST BY TYPE
7.5.8.2. MARKET SIZE AND FORECAST BY APPLICATION
7.5.8.3. MARKET SIZE AND FORECAST BY END USER

Chapter: 8: COMPANY PROFILES

8.1. SAMSUNG ELECTRONICS CO LTD
8.1.1. COMPANY OVERVIEW
8.1.2. BUSINESS PERFORMANCE
8.1.3. KEY STRATEGIC MOVES AND DEVELOPMENTS
8.2. TOSHIBA CORPORATION
8.2.1. COMPANY OVERVIEW
8.2.2. BUSINESS PERFORMANCE
8.2.3. KEY STRATEGIC MOVES AND DEVELOPMENTS
8.3. SK HYNIX SEMICONDUCTOR INC
8.3.1. COMPANY OVERVIEW
8.3.2. BUSINESS PERFORMANCE
8.3.3. KEY STRATEGIC MOVES AND DEVELOPMENTS
8.4. MICRON TECHNOLOGY INC
8.4.1. COMPANY OVERVIEW
8.4.2. BUSINESS PERFORMANCE
8.4.3. KEY STRATEGIC MOVES AND DEVELOPMENTS
8.5. INTEL CORPORATION
8.5.1. COMPANY OVERVIEW
8.5.2. BUSINESS PERFORMANCE
8.5.3. KEY STRATEGIC MOVES AND DEVELOPMENTS
8.6. APPLE INC
8.6.1. COMPANY OVERVIEW
8.6.2. BUSINESS PERFORMANCE
8.6.3. KEY STRATEGIC MOVES AND DEVELOPMENTS
8.7. LENOVO GROUP LTD
8.7.1. COMPANY OVERVIEW
8.7.2. BUSINESS PERFORMANCE
8.7.3. KEY STRATEGIC MOVES AND DEVELOPMENTS
8.8. ADVANCED MICRO DEVICES
8.8.1. COMPANY OVERVIEW
8.8.2. BUSINESS PERFORMANCE
8.8.3. KEY STRATEGIC MOVES AND DEVELOPMENTS
8.9. STMICROELECTRONICS
8.9.1. COMPANY OVERVIEW
8.9.2. BUSINESS PERFORMANCE
8.9.3. KEY STRATEGIC MOVES AND DEVELOPMENTS
8.10. SANDISK CORPORATION
8.10.1. COMPANY OVERVIEW
8.10.2. BUSINESS PERFORMANCE
8.10.3. KEY STRATEGIC MOVES AND DEVELOPMENTS



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